CN100445403C - Soft copper alloy and soft copper alloy wire or board - Google Patents
Soft copper alloy and soft copper alloy wire or board Download PDFInfo
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- CN100445403C CN100445403C CNB2005100767620A CN200510076762A CN100445403C CN 100445403 C CN100445403 C CN 100445403C CN B2005100767620 A CNB2005100767620 A CN B2005100767620A CN 200510076762 A CN200510076762 A CN 200510076762A CN 100445403 C CN100445403 C CN 100445403C
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Abstract
The present invention provides a bending resistant conducting material with bending resistance and heat resistance, which is suitable for distribution wires, vehicle wires, robot wires, etc. The conducting material is a copper-indium alloy prepared from oxygen-free copper having the oxygen content which is smaller than or equal to 10 ppm and 0.005 to 0.6 wt% of indium, or a copper alloy to which 0.0001 to 0.003 wt% of phosphorus and 0.01 to 0.1 wt% of boron are added.
Description
Technical field
The present invention relates to soft copper alloy and soft copper alloy wire or sheet material as electro-conductive material.
Background technology
In science and technology in recent years, make electricity consumption as all parts such as the electric power of propulsion source or electric signals, use leads such as cable or lead-in wire in order to transmit electricity.As employed material in these leads, use the high metals of electric conductivity such as copper, silver, especially from considerations such as cost aspects, most copper cash that use.
In the material that all is called copper, style is carried out in the arrangement of corresponding its molecule etc., can be divided into hard copper and soft copper.So corresponding application purpose is used the copper with desired character.
For example, the cable of the drive part of the robot that uses on the connection industry, automatic work mechanism etc. etc. just can not use the inflexible solid copper wire, should use annealed copper wire.
In addition, the electronic component-use lead-in wire uses solid copper wire, and this is because just do not need to change in case connect afterwards again, and prevent to deform when mounted.
But, no matter use which kind of copper cash, the copper that seldom use not have adds, and use the copper that has carried out suitable interpolation to make it to have desirable performance mostly, and then also carry out the control of molecular configuration etc.
For example, thermotolerance or mechanical characteristics can improve than fine copper by adding indium or tin etc., descend but add the excessive electric conductivity that then causes.
In addition, if oxygen level increases in the copper, then electroconductibility or cold-workability descend, and also have, owing to form oxide compound between oxygen and interpolation element, can cause the problem of broken string when forming glass-coated microwire.
At above-mentioned problem, various effort have been carried out up to now.(for example, with reference to the spy open the 2002-363668 communique, the spy opens flat 9-256084 communique).
Summary of the invention
But, also do not mention fully and studying about annealed copper wire.For example the spy opens the related invention of 2002-363668 communique, is the invention about solid copper wire all the time, and resistance to bend(ing) is not had concrete evaluation, more can not carry out any investigation by good annealed copper wire to resistance to bend(ing).And, also not to stable on heating evaluation.
In addition, open the related invention of flat 9-256084 communique for the spy, although be invention about soft copper alloy, but the crystallization particle diameter after the annealing makes size of microcrystal maintain the strictness of creating conditions of this level, therefore smaller or equal to 1.6 μ m, though character is good, but the realization this point, economical load is many, and its practicality has been said nothing of.
In view of the above problems, the object of the present invention is to provide and to be applicable to that distribution wire, line of vehicles, robot with the resistance to bend(ing) electro-conductive material of line etc., have resistance to bend(ing) and stable on heating electro-conductive material simultaneously.
Resistance to bend(ing) of the present invention and stable on heating soft copper alloy is characterized by, and are made of the copper of the indium that contains oxygen smaller or equal to 10 quality ppm, 0.005～0.6 quality %.
And then, can contain the phosphorus of 0.0001～0.003 quality %.
And then, can contain the boron of 0.01～0.1 quality %.
Contain phosphorus and boron and add up to, preferably in scope smaller or equal to 0.1 quality %.
In addition, preferably than high 10～50 degree of fusing point of this alloy, the crystalline texture of gained ingot casting is equiax crystal to the temperature of the molten state copper alloy that uses during casting.
In addition, resistance to bend(ing) of the present invention and thermotolerance soft copper alloy wire or sheet material is characterized by, and the average crystallite particle diameter after aforementioned resistance to bend(ing) and thermotolerance soft copper alloy are processed, annealed is 2～20 μ m.
Aforementioned resistance to bend(ing) and thermotolerance soft copper alloy wire or sheet material, preferred 0.2% yield strength is more than or equal to 130MPa.
Also have, aforementioned resistance to bend(ing) and thermotolerance soft copper alloy wire or sheet material in electric conductivity is not less than the scope of 85%IACS, preferably contain tin or magnesium or silver.
And then aforementioned resistance to bend(ing) and thermotolerance soft copper alloy wire or sheet material are after 400 ℃, one hour heat test, and preferred tensile strength is smaller or equal to 4%.
According to the present invention, can when suppressing electric conductivity decline, provide to have good resistance to bend(ing) and stable on heating soft copper alloy wire concurrently, therefore, when being applied to distribution wire, line of vehicles, robot with the resistance to bend(ing) electro-conductive material of line etc., expection can obtain the long lifetime of electro-conductive material.
Description of drawings
Fig. 1 is sectional view that crystalline texture is shown as each tissue of the ingot casting of column crystal and the ingot casting that is shown as equiax crystal.
Fig. 2 is the copper alloy more involved in the present invention and the sectional view of the crystal structure of the fine copper of material as a comparison.
Embodiment
Below, the suitable embodiment by copper alloy involved in the present invention describes.
[ingot casting and thick stringy quality]
The thick stringy quality that is obtained by continuous casting is determined by the structural state of processing copper alloy in the preceding ingot casting.Therefore, can use and the alloy wire of the copper of stay in grade-indium system industrial, just must control the tissue in ingot casting stage in order to make.
Structural state when making ingot casting under several different conditions and the thick stringy quality that obtains by these ingot castings have been compared in the table 1.Herein, casting speed is 30 tons/hour, casts cooling with casting ring made of copper.Also have, cast continuously and rollingly undertaken by the SCR system.
In addition, for present embodiment, every kind of material all is to be cast continuously rollingly by the SCR system, but the present invention is not limited to this, also can use ヘ ズ レ one type (ヘ ズ レ one イ プ) continuous casting rolling mode and other manufacture method.
Table 1
| Test piece number (Test pc No.) | Contain elemental oxygen (quality ppm) | Contain element In (quality %) | Molten state alloyed copper temperature (exceeding the fusing point degree) (degree) | Ingot structure | |
| 1 | 8 | 0.1 and 0.2 | 100～70 | Column crystal | * (damage is many, can't make goods) |
| 2 | 9 | 0.1 and 0.2 | 45 | Equiax crystal | ◎ (good) |
| 3 | 7 | 0.1 and 0.2 | 30 | Equiax crystal | ◎ (good) |
| 4 | 10 | 0.1 and 0.2 | 10 | Equiax crystal | Zero (have slightly damage: good) |
| 5 | 8 | 0.1 and 0.2 | 5 | Machinery stops | -(no goods) |
Usually, the molten state copper temperature when casting copper or copper alloy is contemplated to be and is higher than the high temperature that equals fusing point 50 degree, by the result shown in the table 1, as can be seen, temperature spend than melting temperature only high 10 to 4545 degree the situation of molten state alloyed copper temperature under, can obtain the good rough silk of quality.Thus, be no more than fusing point 50 degree or its when above, can obtain the good rough silk of quality in molten state alloyed copper temperature.But molten state alloyed copper temperature is no more than fusing point 5 degree or its when above, and generation machinery stops, and can't obtain goods.Also have, the tissue of the copper alloy of its ingot casting is shown as equiax crystal when obtaining good rough silk.In sum, can draw, in order to obtain the good rough silk of quality, it is desirable to use the ingot casting that constitutes as the copper alloy of equiax crystal by structure, and then, in order to make by structure is the ingot casting that the copper alloy of equiax crystal constitutes, and the temperature of molten state copper is than high 10～50 degree of fusing point when it is desirable to set casting.The temperature of molten state copper is than high 10～45 degree of fusing point when more preferably, it is desirable to set casting.
Also have, the additive of all not phosphorous or boron etc. in arbitrary example of table 1 for this copper-indium alloy system, adds irrelevantly with the trace that without phosphorus or boron are arranged, and can both obtain same result.
In addition, the comparison diagram in the cross section of cast structure as shown in Figure 1.
[to the analysis of the electroconductibility of copper alloy wire]
Below, in order to determine the suitable composition of copper alloy involved in the present invention, as shown in table 2 to the result that several different alloys of forming are tested.
Table 2
| Test piece number (Test pc No.) | In quality % | P quality % | B quality % | Oxygen concn quality ppm | Electric conductivity % IACS | Yield strength MPa | The crystallization particle diameter | Thermotolerance | |
| 1 | 0 | 7 | 101.5 | 102 | × | × | × | ||
| 2 | 0.005 | 8 | 100.8 | 122 | × | × | × | ||
| 3 | 0.01 | 9 | 100.2 | 140 | ○ | ○ | ○ | ||
| 4 | 0.02 | 7 | 100 | 145 | ○ | ○ | ○ | ||
| 5 | 0.05 | 7 | 99.5 | 148 | ○ | ○ | ○ | ||
| 6 | 0.1 | 8 | 98 | 150 | ○ | ○ | ◎ | ||
| 7 | 0.2 | 9 | 94 | 152 | ○ | ○ | ◎ | ||
| 8 | 0.3 | 7 | 92 | 155 | ○ | ○ | ◎ | ||
| 9 | 0.5 | 6 | 90 | 160 | ○ | ○ | ○ | ||
| 10 | 0.6 | 8 | 85 | 162 | ○ | ○ | ○ | ||
| 11 | 0.7 | 9 | 83 | 163 | ○ | ○ | × | ||
| 12 | 0.15 | 0.05 | 8 | 95 | 156 | ○ | ○ | ○ | |
| 13 | 0.3 | 0.0003 | 0.05 | 7 | 91 | 160 | ○ | ○ | ○ |
| 14 | 0.1 | 0.0003 | 9 | 98 | 155 | ○ | ○ | ○ |
In addition, in table 2,, be qualified smaller or equal to 20 μ m for the evaluation of crystallization particle diameter, with zero expression, it is defective surpassing 20 μ m, with * expression.In addition, for stable on heating evaluation, the intensity after the heat test of 400 ℃ of next hours be reduced in 4% with interior for qualified, with zero expression, it then be defective surpassing this scope, with * represent.And then, for comprehensive evaluation, be judged as the good ◎ that is expressed as, be judged as and good be expressed as zero, defectively then be *.
Each experimental result in the table 2, any all is to use the ingot casting that obtains by in the scope of the suitable condition of table 1, and the rough silk of the diameter 8mm that makes through the SCR casting rolling carries out.Further, these rough silks are carried out cold drawn silk to diameter 1.2mm.Also having, is that 220m/min, annealing voltage adopt this wire drawing of energising annealing furnace (ア ニ one ラ) annealing carrying out under more than or equal to 24 volts condition in speed.
At first, to not containing the alloy wire of the additive beyond the indium, carry out the comparison of the various character that cause by different indium content.
Duplicate 1-11 can confirm, along with the increase of indium content, electric conductivity descends, and the yield strength of soft copper alloy increases.Usually, for soft copper alloy wire, it is desirable to electric conductivity more than or equal to 85%IACS, according to this benchmark, sample 1-10 all satisfies this benchmark, but sample 11 does not satisfy this benchmark.According to these results, copper alloy involved in the present invention it is desirable to indium content and is 0.6 quality % to the maximum.
In addition, to the yield strength of flex life influential 0.2%, usually, the fine copper after the annealing (TPC) demonstrates the value of 110～125MPa, and any among the sample 2-11 all exceeds the mean value of fine copper.
In sum, sample 2-10 for the yield strength of electroconductibility and soft copper alloy, satisfies the benchmark as copper alloy involved in the present invention, and its condition is that indium content is in 0.005～0.6 quality % scope.
Indium content is in above-mentioned scope the time, and the reason that shows good properties is, is alloy for copper-indium, and to improve than copper simple substance be to be present in the result who causes in the copper by indium with molten admittedly element to various characteristics.As the increase of the indium that exists with molten admittedly element in the copper, can improve the mechanical characteristics of copper alloy, also cause the decline of the electric conductivity of copper alloy on the other hand.
Particularly, indium content can't obtain the above-mentioned raising of the molten caused characteristic of element admittedly during smaller or equal to 0.005 quality %, therefore, indium content must be more than or equal to 0.005 quality %, and indium content is during more than or equal to 0.6 quality %, and electric conductivity drops to benchmark value or below it.
So the indium content that requires copper alloy wire involved in the present invention is 0.005～0.6 quality %.
[to the analysis of oxygen level in the copper alloy wire]
As the continuous casting rolling, it is desirable in the copper alloy oxygen level smaller or equal to 10 quality ppm.Its reason is, as mentioned above, to be alloy than the every characteristic of copper simple substance have to improve to be present in the copper with molten admittedly element by indium copper-indium causes, at this moment, forms oxide compound because the oxygen level increase causes indium, can not produce the effect that various characteristics improves thereby cause.
So for copper alloy involved in the present invention, oxygen level is being benchmark value smaller or equal to 10 quality ppm.
[for the analysis of the crystallization particle diameter of copper alloy wire]
In addition, for the crystallization particle diameter, not only, also change along with creating conditions of this alloy wire with the content of additive.Its value of crystallization particle diameter is more little, and mechanical characteristics, particularly yield strength are high more.The crystallization particle diameter can make during more than or equal to 20 μ m yield strength descend, and therefore, this is undesirable as goods of the present invention.For example, according to the composition or the annealing conditions of alloy, the crystallization particle diameter demonstrates more than or equal to 20 μ m.On the other hand,, but reach the harshness of creating conditions of this particle diameter, can't produce in batches if the crystallization particle diameter then can obtain good mechanical characteristics smaller or equal to 2 μ m.So the crystallization particle diameter of the copper alloy that the present invention relates to, the scope of setting are 2～20 μ m.
Evaluation to the crystallization particle diameter as shown in table 2, when indium content in the copper alloy during smaller or equal to 0.005 quality %, the crystallization particle diameter is defective more than or equal to 20 μ m, when indium content was 0.01 quality %, the particle diameter of arbitrary sample all was qualified all smaller or equal to 20 μ m.Therefore, can draw, indium content is preferably in 0.01～0.6 quality % scope in the copper alloy involved in the present invention.
Fig. 2 illustrates sample 1 and sample 6 crystal structure separately in the table 2.This shows that crystallization crystal grain is little in the goods of the present invention, has obtained favorable tissue.
[to the stable on heating analysis of copper alloy wire]
Then, thermotolerance is analyzed.The stable on heating metewand of copper alloy involved in the present invention is that after 1 hour, the decline of intensity is in 4% 400 ℃ of heating.
Use the copper alloy involved in the present invention result of the strength detection after the heat test under various conditions, as shown in table 3.
Table 3
Strength Changes takes place at 400 ℃ after heating 1 hour in sample hardly that use for thermal test, and it is fully qualified to be judged to be.And when even the temperature condition of heat test changes, Strength Changes is also seldom compared extremely little with the fine copper of material as a comparison.
In addition, when test period was extended to 10 hours, the gained result also was that the Strength Changes after the heat test is minimum, confirms that copper alloy involved in the present invention has good heat-resisting property.
As shown in table 2 to stable on heating evaluation, when the indium content in the copper alloy during, do not satisfy stable on heating benchmark smaller or equal to 0.005 quality %, when content was 0.01 quality %, arbitrary sample all satisfied stable on heating benchmark.According to this result also as can be known, the indium content of copper alloy involved in the present invention is preferably in 0.01～0.6 quality % scope.
[to the analysis of the concentration range of the phosphorus in the copper alloy, boron]
Below, be that the situation that adds additive in the alloy is analyzed to copper-indium.
Miniaturization has effect to crystalline to add boron in the copper alloy, and, needn't worry to cause declining to a great extent of electric conductivity.Herein, as 1 form of implementation of copper alloy involved in the present invention, the sample that has added boron is the sample 12 in the table 2.
Indium content is 0.15 quality % in the sample 12, there is not the identical with it control sample of indium content, with indium content be that the sample 6 of 0.1 quality % and sample that indium content is 0.2 quality % 7 are relatively the time, the value of the electric conductivity that sample 12 is shown is between the value of sample 6 and sample 7, as can be seen, the interpolation of boron does not exert an influence to the electric conductivity of copper alloy.On the other hand, the shown yield strength value of sample 12 is all higher than any of sample 6 and sample 7, and as can be seen, the interpolation of boron gives the characteristic that the yield strength of copper alloy improves.
More after a little while, can't fully obtain the effect of crystallization miniaturization at the addition of boron, on the other hand, addition is easy to generate problem more for a long time when casting.Hence one can see that, and the addition optimum range of boron is 0.01～0.1 quality % among the present invention.
Also have, in copper alloy, add phosphorus and can prevent to produce pore, have the effect that improves the cast material quality, help to improve thick stringy surface quality.Herein, as a form of implementation of copper alloy involved in the present invention, the copper alloy that has added phosphorus is the sample 14 in the table 2.
Indium content in the sample 14 is 0.1 quality %, with compare with its sample 6 that contains the sample as a comparison of same amount indium, the value of the electric conductivity that the value of the electric conductivity that sample 14 is shown and sample 6 are shown equates, shows the electric conductivity not influence of the addition of phosphorus in sample 14 to copper alloy.In addition, the yield strength value that sample 14 is shown than the shown yield strength value height of sample 6, shows that the interpolation of phosphorus makes the yield strength of copper alloy improve, and this is considered to owing to have the result that effect produced of the quality that improves cast material.
In order to obtain such effect, the addition of phosphorus must be more than or equal to 0.0001 quality %, and the electric conductivity when addition is 0.003 quality % is compared when not adding and approximately reduced by 2.2%.Therefore, more than or equal to the interpolation of the phosphorus of 0.003 quality % electric conductivity significantly being descended does not wish to take place.Can draw from the above mentioned, be 0.0002～0.0005 quality % as the benchmark value of the addition of phosphorus in the copper alloy involved in the present invention.
Also have, the embodiment that adds boron and phosphorus in copper alloy simultaneously is the sample 13 in the table 2.
Indium content in the sample 13 is 0.3 quality %, its sample 8 with the sample as a comparison with identical indium content is compared, the value of the electric conductivity that sample 13 is shown, almost there is not anything to change with the value of the shown electric conductivity of sample 8, and, the value height of the yield strength that the value of the yield strength that sample 13 is shown is more shown than sample 8, as can be seen, even add boron and phosphorus simultaneously, do not produce the influence of special deterioration yet, can also produce the effect of the yield strength raising of copper alloy.
In sum, for suitable the consisting of of copper alloy of the present invention, oxygen level is smaller or equal to 10 quality ppm, consider electric conductivity and yield strength, the content of indium is preferably 0.005～0.6 quality %, considers crystallization particle diameter and thermotolerance, and then the content of indium is preferably 0.01～0.6 quality %.In addition, boron and phosphorus are not to add, and when adding, it is desirable in 0.01～0.1 quality % scope that is added on of boron, being added in 0.0001～0.003 quality % scope of phosphorus.
For the interpolation of other elements, improve owing to can not produce, therefore special requirement not the rerum natura of copper alloy.But, often cause that at the manufacturing scene of copper alloy other elements sneak into.The element of sneaking into for example has elements such as tin, magnesium, silver.Although being difficult to think can reduce mechanical characteristics because these elements are sneaked into, the worry that reduces electric conductivity is arranged.Herein, when being not less than in the scope of 85%IACS in the electric conductivity of copper alloy, be also included within the present invention even contain the copper alloy of tin, magnesium or silver.
[to the analysis of the yield strength of copper alloy wire]
Copper alloy wire involved in the present invention requires flex life to want high.The measurement result in the surrender life-span of the copper alloy wire that 0.2% yield strength is different is as shown in table 4.
Table 4
| Sample | 0.2% yield strength (MPa) | Flex life (distortion 0.5%) | Flex life is than (TPC is 1) |
| Fine copper (TPC) | 110 | 5,012 | 1.0 |
| Cu-0.1mass%In (annealing 1) | 131 | 7,523 | 1.5 |
| Cu-0.1mass%In (annealing 2) | 159 | 12,012 | 2.4 |
| Cu-0.1mass%In (annealing 3) | 182 | 15,009 | 3.0 |
| Cu-0.1mass%In (annealing 4) | 199 | 18,112 | 3.6 |
The mensuration of flex life is at the copper alloy wire that uses diameter as 0.1mm, and flexural deformation is 0.5%, and loading is 32g, about 90 degree crooked, carry out under the condition of every direction 4 seconds (4sec/way).
Generally about 100～125MPa, this time the yield strength of the fine copper of the material as a comparison that uses in the test is 110MPa to the yield strength of fine copper.In contrast, as can be seen, copper alloy involved in the present invention any in the gained differing materials under arbitrary annealing conditions all demonstrates high yield strength value, and corresponding to the raising of yield strength, flex life also increases.
Relatively 0.2% yield strength is that sample and the yield strength of 131MPa are the contrast material of 110MPa, and flex life is increased to 1.5 times, and this result shows that the long lifetime for flex life has abundant effect.Therefore, for copper alloy wire involved in the present invention, the value of 0.2% yield strength of requirement is more than or equal to 130MPa.
[about the annealing of energising annealing furnace]
As previously mentioned, in making copper alloy wire involved in the present invention, the annealing furnace annealing of switching on during by rough wire drawing.For the energising annealing furnace annealed condition of determining that the present invention is fit to, test.
Setting speed is 220m/min, changes annealing voltage, changes the annealing voltage of energising annealing furnace, and the comparative result of tensile strength, 0.2% yield strength and extensibility that obtains copper alloy wire is as shown in table 5.The copper alloy that herein uses is copper-0.1 quality % indium alloy.
Table 5
| Annealing voltage (V) | Tensile strength (MPa) | 0.2% yield strength (MPa) | Extensibility (%) |
| 20 | 455 | 450 | 1.0 |
| 22 | 360 | 350 | 2.0 |
| 24 | 295 | 230 | 14 |
| 25 | 265 | 170 | 17 |
| 26 | 259 | 154 | 23 |
| 27 | 251 | 135 | 31 |
| 28 | 250 | 133 | 32 |
| The TPC comparative material | 240 | 124 | 31 |
As qualified benchmark value, can clear and definite benchmark value be: more than or equal to 125MPa, annealing voltage be the scope of 24V～28V to extensibility more than or equal to 10%, 0.2% yield strength.Wherein, surpass 28V because the boundary of device is limit and can't be experimentized.
And this experiment is to be undertaken by the energising annealing furnace annealing of highly productive, when using tubular electric furnace to move annealing, can obtain tensile strength and the more stable copper alloy wire of yield strength than this test-results.
Claims (12)
1. a resistance to bend(ing) and stable on heating soft copper alloy, it is characterized in that: the temperature of the molten state copper alloy that uses during casting is than high 10～45 degree of fusing point of this alloy, the crystalline texture of the ingot casting that obtains is equiax crystal, and is made of the copper that contains at least smaller or equal to the indium of the oxygen of 10 quality ppm and 0.005～0.6 quality %.
2. resistance to bend(ing) according to claim 1 and stable on heating soft copper alloy is characterized in that: the phosphorus that contains 0.0001～0.003 quality %.
3. resistance to bend(ing) according to claim 1 and stable on heating soft copper alloy is characterized in that: the boron that contains 0.01～0.1 quality %.
4. resistance to bend(ing) according to claim 1 and stable on heating soft copper alloy is characterized in that: the total content of phosphorus and boron is in the scope smaller or equal to 0.1 quality %.
5. a resistance to bend(ing) and stable on heating soft copper alloy wire or sheet material is characterized in that: the average crystallite particle diameter after any described resistance to bend(ing) of claim 1 to 4 and stable on heating soft copper alloy are processed, annealed is in the scope of 2～20 μ m.
6. resistance to bend(ing) according to claim 5 and stable on heating soft copper alloy wire or sheet material is characterized in that: 0.2% yield strength is more than or equal to 130MPa.
7. resistance to bend(ing) according to claim 5 and stable on heating soft copper alloy wire or sheet material is characterized in that: electric conductivity contains tin or magnesium or silver in being not less than the scope of 85%IACS.
8. resistance to bend(ing) according to claim 6 and stable on heating soft copper alloy wire or sheet material is characterized in that: electric conductivity contains tin or magnesium or silver in being not less than the scope of 85%IACS.
9. resistance to bend(ing) according to claim 5 and stable on heating soft copper alloy wire or sheet material is characterized in that: after carrying out 1 hour heat test under 400 ℃, and the dropping to of tensile strength smaller or equal to 4%.
10. resistance to bend(ing) according to claim 6 and stable on heating soft copper alloy wire or sheet material is characterized in that: after carrying out 1 hour heat test under 400 ℃, and the dropping to of tensile strength smaller or equal to 4%.
11. resistance to bend(ing) according to claim 7 and stable on heating soft copper alloy wire or sheet material is characterized in that: after carrying out 1 hour heat test under 400 ℃, the dropping to of tensile strength smaller or equal to 4%.
12. resistance to bend(ing) according to claim 8 and stable on heating soft copper alloy wire or sheet material is characterized in that: after carrying out 1 hour heat test under 400 ℃, the dropping to of tensile strength smaller or equal to 4%.
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| JPH06240388A (en) * | 1993-02-18 | 1994-08-30 | Hitachi Cable Ltd | Copper alloy wire and its production |
| JPH07331362A (en) * | 1994-06-08 | 1995-12-19 | Yazaki Corp | High strength conductive copper alloy excellent in bendability and wire drawability |
| JPH09227970A (en) * | 1996-02-21 | 1997-09-02 | Yazaki Corp | Production of high tensile conductive copper alloy and conductor for electric wire |
| JPH09256084A (en) * | 1996-03-19 | 1997-09-30 | Hitachi Cable Ltd | Bending resistant copper alloy wire |
| JP2002363668A (en) * | 2001-06-07 | 2002-12-18 | Hitachi Cable Ltd | Conductor for bending resistant cable and production method therefor |
| CN1498978A (en) * | 2002-10-31 | 2004-05-26 | 日矿金属株式会社 | Easy machining, high strength and high conductive copper alloy |
| CN1546699A (en) * | 2003-12-05 | 2004-11-17 | 昆明贵金属研究所 | Copper alloy conductive powder material |
-
2005
- 2005-06-10 CN CNB2005100767620A patent/CN100445403C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06240388A (en) * | 1993-02-18 | 1994-08-30 | Hitachi Cable Ltd | Copper alloy wire and its production |
| JPH07331362A (en) * | 1994-06-08 | 1995-12-19 | Yazaki Corp | High strength conductive copper alloy excellent in bendability and wire drawability |
| JPH09227970A (en) * | 1996-02-21 | 1997-09-02 | Yazaki Corp | Production of high tensile conductive copper alloy and conductor for electric wire |
| JPH09256084A (en) * | 1996-03-19 | 1997-09-30 | Hitachi Cable Ltd | Bending resistant copper alloy wire |
| JP2002363668A (en) * | 2001-06-07 | 2002-12-18 | Hitachi Cable Ltd | Conductor for bending resistant cable and production method therefor |
| CN1498978A (en) * | 2002-10-31 | 2004-05-26 | 日矿金属株式会社 | Easy machining, high strength and high conductive copper alloy |
| CN1546699A (en) * | 2003-12-05 | 2004-11-17 | 昆明贵金属研究所 | Copper alloy conductive powder material |
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