CN100431140C - 具有保护性安全涂层的半导体器件及其制造方法 - Google Patents
具有保护性安全涂层的半导体器件及其制造方法 Download PDFInfo
- Publication number
- CN100431140C CN100431140C CNB038065630A CN03806563A CN100431140C CN 100431140 C CN100431140 C CN 100431140C CN B038065630 A CNB038065630 A CN B038065630A CN 03806563 A CN03806563 A CN 03806563A CN 100431140 C CN100431140 C CN 100431140C
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- Expired - Fee Related
Links
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/922—Active solid-state devices, e.g. transistors, solid-state diodes with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Theoretical Computer Science (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02076112.8 | 2002-03-21 | ||
EP02076112 | 2002-03-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1643681A CN1643681A (zh) | 2005-07-20 |
CN100431140C true CN100431140C (zh) | 2008-11-05 |
Family
ID=28051802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB038065630A Expired - Fee Related CN100431140C (zh) | 2002-03-21 | 2003-03-20 | 具有保护性安全涂层的半导体器件及其制造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7173323B2 (zh) |
EP (1) | EP1490902B1 (zh) |
JP (1) | JP2005521262A (zh) |
CN (1) | CN100431140C (zh) |
AT (1) | ATE477590T1 (zh) |
AU (1) | AU2003209602A1 (zh) |
DE (1) | DE60333739D1 (zh) |
WO (1) | WO2003081668A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1451871A2 (en) * | 2001-11-28 | 2004-09-01 | Koninklijke Philips Electronics N.V. | Semiconductor device, and means for checking the authenticity |
JP2007528121A (ja) * | 2003-07-11 | 2007-10-04 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 機密性を要する半導体製品、特にスマートカード・チップ |
US20080128022A1 (en) * | 2006-11-15 | 2008-06-05 | First Solar, Inc. | Photovoltaic device including a tin oxide protective layer |
WO2011046769A1 (en) | 2009-10-14 | 2011-04-21 | Lockheed Martin Corporation | Protective circuit board cover |
US8947889B2 (en) | 2010-10-14 | 2015-02-03 | Lockheed Martin Corporation | Conformal electromagnetic (EM) detector |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5689138A (en) * | 1994-10-31 | 1997-11-18 | U.S. Philips Corporation | Integrated microwave semiconductor device with active and passive components |
JPH10270583A (ja) * | 1997-03-25 | 1998-10-09 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
CN1198009A (zh) * | 1997-03-31 | 1998-11-04 | 日本电气株式会社 | 具有端面对分通孔和内区通孔的半导体器件组件 |
CN1201255A (zh) * | 1997-05-30 | 1998-12-09 | 摩托罗拉公司 | 具有封装材料的电子元件组件及其形成方法 |
US6137173A (en) * | 1998-06-30 | 2000-10-24 | Intel Corporation | Preventing backside analysis of an integrated circuit |
WO2000063836A1 (fr) * | 1999-04-19 | 2000-10-26 | Schlumberger Systemes | Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire |
US6144106A (en) * | 1996-10-04 | 2000-11-07 | Dow Corning Corporation | Electronic coatings |
US6198155B1 (en) * | 1998-06-10 | 2001-03-06 | U.S. Philips Corporation | Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60170239A (ja) * | 1984-02-15 | 1985-09-03 | Nec Corp | 半導体装置 |
-
2003
- 2003-03-20 EP EP03744942A patent/EP1490902B1/en not_active Expired - Lifetime
- 2003-03-20 JP JP2003579277A patent/JP2005521262A/ja active Pending
- 2003-03-20 AU AU2003209602A patent/AU2003209602A1/en not_active Abandoned
- 2003-03-20 WO PCT/IB2003/001025 patent/WO2003081668A1/en active Application Filing
- 2003-03-20 AT AT03744942T patent/ATE477590T1/de not_active IP Right Cessation
- 2003-03-20 DE DE60333739T patent/DE60333739D1/de not_active Expired - Lifetime
- 2003-03-20 US US10/508,745 patent/US7173323B2/en not_active Expired - Lifetime
- 2003-03-20 CN CNB038065630A patent/CN100431140C/zh not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5689138A (en) * | 1994-10-31 | 1997-11-18 | U.S. Philips Corporation | Integrated microwave semiconductor device with active and passive components |
US6144106A (en) * | 1996-10-04 | 2000-11-07 | Dow Corning Corporation | Electronic coatings |
JPH10270583A (ja) * | 1997-03-25 | 1998-10-09 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
CN1198009A (zh) * | 1997-03-31 | 1998-11-04 | 日本电气株式会社 | 具有端面对分通孔和内区通孔的半导体器件组件 |
CN1201255A (zh) * | 1997-05-30 | 1998-12-09 | 摩托罗拉公司 | 具有封装材料的电子元件组件及其形成方法 |
US6198155B1 (en) * | 1998-06-10 | 2001-03-06 | U.S. Philips Corporation | Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device |
US6137173A (en) * | 1998-06-30 | 2000-10-24 | Intel Corporation | Preventing backside analysis of an integrated circuit |
WO2000063836A1 (fr) * | 1999-04-19 | 2000-10-26 | Schlumberger Systemes | Dispositif a circuit integre securise contre des attaques procedant par destruction controlee d'une couche complementaire |
Also Published As
Publication number | Publication date |
---|---|
US20050140003A1 (en) | 2005-06-30 |
ATE477590T1 (de) | 2010-08-15 |
DE60333739D1 (de) | 2010-09-23 |
US7173323B2 (en) | 2007-02-06 |
WO2003081668A1 (en) | 2003-10-02 |
EP1490902B1 (en) | 2010-08-11 |
EP1490902A1 (en) | 2004-12-29 |
CN1643681A (zh) | 2005-07-20 |
AU2003209602A1 (en) | 2003-10-08 |
JP2005521262A (ja) | 2005-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: KONINKLIJKE PHILIPS ELECTRONICS N.V. Effective date: 20071109 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071109 Address after: Holland Ian Deho Finn Applicant after: Koninkl Philips Electronics NV Address before: Holland Ian Deho Finn Applicant before: Koninklijke Philips Electronics N.V. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081105 Termination date: 20130320 |