CN100427879C - 波纹缺陷检查掩模、波纹缺陷检查装置及方法、以及光掩模的制造方法 - Google Patents

波纹缺陷检查掩模、波纹缺陷检查装置及方法、以及光掩模的制造方法 Download PDF

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Publication number
CN100427879C
CN100427879C CNB2005100758119A CN200510075811A CN100427879C CN 100427879 C CN100427879 C CN 100427879C CN B2005100758119 A CNB2005100758119 A CN B2005100758119A CN 200510075811 A CN200510075811 A CN 200510075811A CN 100427879 C CN100427879 C CN 100427879C
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CN
China
Prior art keywords
defect
moire
pattern
moiré
patterns
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Expired - Fee Related
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CNB2005100758119A
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English (en)
Chinese (zh)
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CN1702429A (zh
Inventor
村井诚
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Hoya Corp
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Hoya Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
CNB2005100758119A 2004-05-28 2005-05-30 波纹缺陷检查掩模、波纹缺陷检查装置及方法、以及光掩模的制造方法 Expired - Fee Related CN100427879C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004159765A JP4480001B2 (ja) 2004-05-28 2004-05-28 ムラ欠陥検査マスク、ムラ欠陥検査装置及び方法、並びにフォトマスクの製造方法
JP2004159765 2004-05-28
JP2004-159765 2004-05-28

Publications (2)

Publication Number Publication Date
CN1702429A CN1702429A (zh) 2005-11-30
CN100427879C true CN100427879C (zh) 2008-10-22

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Family Applications (1)

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CNB2005100758119A Expired - Fee Related CN100427879C (zh) 2004-05-28 2005-05-30 波纹缺陷检查掩模、波纹缺陷检查装置及方法、以及光掩模的制造方法

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Country Link
US (1) US7538867B2 (enExample)
JP (1) JP4480001B2 (enExample)
KR (1) KR100677692B1 (enExample)
CN (1) CN100427879C (enExample)
TW (1) TWI263772B (enExample)

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US20070174012A1 (en) * 2006-01-25 2007-07-26 Badger Karen D Method Of Determining Photomask Inspection Capabilities
JP4831607B2 (ja) * 2006-03-31 2011-12-07 Ｈｏｙａ株式会社 パターン欠陥検査方法及びフォトマスクの製造方法
JP4771871B2 (ja) * 2006-06-15 2011-09-14 Ｈｏｙａ株式会社 パターン欠陥検査方法、パターン欠陥検査用テストパターン基板、及びパターン欠陥検査装置、並びにフォトマスクの製造方法、及び表示デバイス用基板の製造方法
KR101587176B1 (ko) * 2007-04-18 2016-01-20 마이크로닉 마이데이타 에이비 무라 검출 및 계측을 위한 방법 및 장치
SG149763A1 (en) * 2007-07-12 2009-02-27 Applied Materials Israel Ltd Method and system for evaluating an object that has a repetitive pattern
US7940386B1 (en) * 2007-07-13 2011-05-10 Kla-Tencor Corporation Scatterometry target employing non-periodic defect features to enhance or optimize target sensitivity to a parameter of interest
US20090199152A1 (en) * 2008-02-06 2009-08-06 Micronic Laser Systems Ab Methods and apparatuses for reducing mura effects in generated patterns
JP2010019639A (ja) * 2008-07-09 2010-01-28 Lasertec Corp ムラ検出装置及びパターン検査装置
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JP5556071B2 (ja) * 2009-07-09 2014-07-23 凸版印刷株式会社 評価用パターンを形成したフォトマスクおよびムラ検査装置の性能評価方法
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JP5866912B2 (ja) * 2011-09-16 2016-02-24 凸版印刷株式会社 パターンの描画条件導出方法及びパターン描画装置
US8780097B2 (en) 2011-10-20 2014-07-15 Sharp Laboratories Of America, Inc. Newton ring mura detection system
EP2972589B1 (en) 2013-03-12 2017-05-03 Micronic Mydata AB Mechanically produced alignment fiducial method and alignment system
WO2014140047A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
CN104914133B (zh) * 2015-06-19 2017-12-22 合肥京东方光电科技有限公司 摩擦缺陷检测装置
CN105241638A (zh) * 2015-09-09 2016-01-13 重庆平伟光电科技有限公司 基于视觉的led模块亮度均匀性快速检测方法
CN105306843B (zh) * 2015-10-20 2018-05-25 凌云光技术集团有限责任公司 一种图像传感器的坏点处理方法及系统
KR102418581B1 (ko) 2015-10-21 2022-07-08 삼성전자주식회사 패턴 생성 방법 및 이를 수행하기 위한 패턴 발생기
CN106802523B (zh) * 2017-01-25 2019-10-29 星源电子科技(深圳)有限公司 修复液晶面板显性横向线性不良的方法
CN110416103B (zh) * 2018-04-28 2021-09-28 上海微电子装备（集团）股份有限公司 一种残胶标准片及其制备方法
CN109739072B (zh) * 2019-02-22 2021-02-09 深圳市路维光电股份有限公司 光罩曝光控制方法
CN109814328B (zh) * 2019-03-28 2022-06-10 京东方科技集团股份有限公司 虚拟掩膜板、掩膜板及其制作方法

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CN1365445A (zh) * 2000-03-24 2002-08-21 奥林巴斯光学工业株式会社 缺陷检测装置
JP2003297888A (ja) * 2002-03-26 2003-10-17 Isoa Inc 光学的検査方法及び光学的検査システム

Also Published As

Publication number Publication date
KR20060048094A (ko) 2006-05-18
JP2005338620A (ja) 2005-12-08
JP4480001B2 (ja) 2010-06-16
TW200602616A (en) 2006-01-16
KR100677692B1 (ko) 2007-02-02
US20050280805A1 (en) 2005-12-22
US7538867B2 (en) 2009-05-26
CN1702429A (zh) 2005-11-30
TWI263772B (en) 2006-10-11

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Granted publication date: 20081022

Termination date: 20140530