CN100416755C

CN100416755C - Method for processing silicon piece using wet corrosion apparatus

Info

Publication number: CN100416755C
Application number: CNB2005101112880A
Authority: CN
Inventors: 仓凌盛; 荣毅
Original assignee: Shanghai Hua Hong NEC Electronics Co Ltd
Current assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority date: 2005-12-08
Filing date: 2005-12-08
Publication date: 2008-09-03
Anticipated expiration: 2025-12-08
Also published as: CN1979762A

Abstract

The invention makes public a kind of method to treat silicon by using a wetting method to erode equipment, the method uses the move in position and the move out position of equipment to be as the loading platform of the empty box, makes the disposal groove of the equipment treat move silicon at the same time, the method of the invention do not need to rebuild any hardwares, but can improve by 20% of the utilization efficiency of the wetting erosion equipment.

Description

Utilize the method for wet etching device processes silicon chip

Technical field

The present invention relates to the semiconductor integrated circuit manufacturing process technology field, relate in particular to a kind of method of utilizing wet etching device processes silicon chip.

Background technology

Along with the semiconductor fabrication techniques automaticity improves constantly, the various equipment that are used to produce have all been realized automatic conveyance, handle automatically, and the device that wherein is used for wet-cleaned/etching technics also is like this.Present wet method equipment all is the form of so-called wet treatment platform (WET BENCH), has just disposed the technology groove of a plurality of difference in functionalitys in an equipment, can make different PROCESS FOR TREATMENT according to technological requirement.In order to improve equipment yield, the wet treatment platform mostly is that (whole a collection of 25 pieces of silicon chips are as handling unit for the employing batch processing mode, rather than Dan Mei handles), so need carry out reviewing, silicon chip is poured out from the conveyance film magazine, re-use the direct gripping silicon chip of manipulator and enter technology groove processing (perhaps pour processing film magazine special-purpose in the equipment into, this film magazine of manipulator gripping enters technology groove and handles).Usually in wet method equipment, plummer and the rewinding device of putting sky conveyance film magazine can be set, satisfy above requirement.Therefore the quantity of handling silicon chip simultaneously can be subjected to can holding in the equipment restriction of film magazine quantity.

The wet etching equipment of the main product WS-820 series of Danippon Screen is when operation at present, and silicon chip drops into back silicon chip after dropping into plummer partly to carry out the reviewing operation by inlet and moves into the treatment trough etching.Corresponding empty conveyance film magazine moves to the outlet plummer by film magazine conveyance track simultaneously.Wait for after silicon chip is handled and refund the conveyance film magazine, take out of by outlet at last in outlet plummer portion.The treating capacity of goods is subjected to exporting the restriction of plummer in the whole process, just can finish the entire process process because the conveyance film magazine of silicon chip correspondence must be delivered to outlet side.At outlet side, have only 2 groups of plummers in the equipment.So improve one's methods as a kind of, the designer has also utilized 1 group of plummer of inlet portion to place empty film magazine, after corresponding silicon chip processing is over, utilizes film magazine conveyance track again it to be transplanted on export department silicon chip is refunded.Though can improve service efficiency like this, the cost of paying is expensive than the device fabrication expense, and has taken more purification plant area.

Also there are many equipment to adopt and move into/take out of the method for designing that mouth is integrated in a part.As the etching apparatus of KAIJO company, after the conveyance path that silicon chip is handled enters from inlet, on rewinding device, silicon chip is separated with film magazine.Silicon chip is sent to treatment trough corrosion afterwards, and empty film magazine is then standby to the empty film magazine plummer by conveyance.Can find because this kind equipment has all concentrated on discrepancy, reviewing, the part of depositing film magazine together, because spatial limitation to deposit 4 film magazines, has so just limited its disposal ability at most only.Because even more treatment trough is arranged, can't not handle if there are enough plummers to put film magazine yet.Compare its advantage of last scheme and be that equipment manufacturing cost is low, occupation space is few, but has lost the part producing ability.

Summary of the invention

The technical problem to be solved in the present invention is to overcome the deficiencies in the prior art, and a kind of method of utilizing wet etching device processes silicon chip that occupies little space and can improve service efficiency is provided.

In order to solve the problems of the technologies described above, the present invention is achieved through the following technical solutions:

A kind of method of utilizing wet etching device processes silicon chip, the wet method equipment of 2 empty film magazine plummers, 2 treatment troughs, 2 rinsing bowls and a drying machine is disposed in employing, and every batch of silicon chip time in treatment trough and rinsing bowl is basic identical with the dry time, and this method comprises:

(a) after first silicon chip dropped into treatment trough one, the first empty film magazine was placed on sky film magazine plummer;

(b) second batch of silicon chip continues to drop into, and this moment, first silicon chip was moved in the rinsing bowl one;

(c) second film magazine that second batch of silicon chip is housed is finished reviewing on rewinding device, and second batch of silicon chip moved into treatment trough two processing, and the second empty film magazine is moved into sky film magazine plummer and deposited, and first silicon chip continues to clean in rinsing bowl one;

(d) utilize the taking out of mouthful as empty film magazine plummer of equipment, then first film magazine of sky is moved to and taken out of mouth, vacate the position of sky film magazine plummer, the 3rd film magazine of adorning the 3rd batch of silicon chip is moved into rewinding device and is carried out reviewing, the 3rd batch of silicon chip enters treatment trough one, and the 3rd empty film magazine is moved to sky film magazine plummer;

(e) first silicon chip enters drying machine and carries out drying, and second batch of silicon chip moved into rinsing bowl two and cleaned;

(f) first silicon chip is dry intact, is moved to rewinding device and refunds transport apparatus behind first film magazine, and second batch of silicon chip moved into the drying machine drying, and the 3rd batch of silicon chip moved into rinsing bowl one cleaning, and the 4th film magazine of adorning the 4th batch of silicon chip begins to continue to drop into.

The method of utilizing wet etching device processes silicon chip of the present invention, by depositing more film magazine with the plummer of equipment outlet, make equipment can carry out multiple batches of silicon chip simultaneously and handle, thereby utilize the treatment trough that disposes in the equipment to greatest extent, and do not need to carry out the transformation of any hardware aspect.Utilize method of the present invention, the service efficiency of wet etching equipment has improved 20%.

Description of drawings

Fig. 1 is the schematic diagram of step of the present invention (a);

Fig. 2 is the schematic diagram of step of the present invention (b);

Fig. 3 is the schematic diagram of step of the present invention (c);

Fig. 4 is the schematic diagram of step of the present invention (d);

Fig. 5 is the schematic diagram of step of the present invention (d) and step (e);

Fig. 6 is first schematic diagram of step of the present invention (f);

Fig. 7 is second schematic diagram of step of the present invention (f).

Embodiment

Can be used for semiconductor wet equipment by transport method provided by the invention, it can increase the quantity of treatment articles simultaneously to multi-form equipment, improves the equipment service efficiency.

In being arranged, the wet method equipment of following configuration has 2 empty film magazine plummers:

Treatment trough 1+ rinsing bowl 1+ treatment trough 2+ rinsing bowl 2+ drying machine

Time in every pair of treatment trough+rinsing bowl (for fear of because the problem of time difference can only have 1 batch of goods in every pair of groove, guarantee must move in the tank after corroding and clean) is basic identical with the dry time.Therefore be subjected to the restriction that the sky film magazine is deposited, can only handle 2 batches of goods simultaneously at most.And if adopted method of the present invention, can in 2 pairs of treatment troughs and drying machine, handle 3 batches of goods simultaneously simultaneously, improved production efficiency.

With continuous input goods, processing time and drying time all are in 15 minutes the experiment, according to traditional transport method, just can't continue to drop into operation after dropping into two batches of goods, after a collection of goods come out after must waiting for 20 minutes.Such the 3rd batch of goods need just can be finished second batch of after finishing 40 minute, promptly need 100 minutes to finish 3 batches of goods altogether, adopt the inventive method can obtain the effect of finishing continuously with the interval of per 20 minutes (the 15 minutes+conveyance in processing section 5 minutes).As follows in detail, the total time of continuous 3 batches of goods: for first from put into finish be 40 minutes (move into 5 minutes+handle 15 minutes+dry 15 minutes+took out of 5 minutes), finish after this 20 minutes for second batch, the 3rd batch after second batch 20 minutes intact, promptly altogether with finishing 3 batches of goods in 80 minutes.

Be to carry out the conveyance mode to change on the wet method equipment that KAIJO company is produced below, to improve the example of equipment service efficiency, detailed process such as Fig. 1-7 is represented.In Fig. 1, after the 1st batch of silicon chip dropped into, empty film magazine 10 was placed on sky film magazine plummer 3, and silicon chip 11 enters treatment trough 1; Then, in Fig. 2, the 2nd batch of silicon chip 13 continues to drop into, and this moment, silicon chip 11 was moved in the rinsing bowl 1; Then, as shown in Figure 3, second batch of goods film magazine 12 that silicon chip 13 is housed finished reviewing on rewinding device 9, and silicon chip 11 continues to clean in rinsing bowl 1; In Fig. 4, empty film magazine 12 is moved into sky film magazine plummer 3 and is deposited, silicon chip 13 is moved into treatment trough 26 and is handled, because this space-time film magazine plummer 3 does not have the room to put the sky film magazine again, so under transport method before, the film magazine 14 of adorning the 3rd batch of silicon chip 15 can only wait for and move into mouthful 1, and method of the present invention is used and taken out of mouthfuls 2 as an empty film magazine lay down location; Then, as shown in Figure 5, empty film magazine 10 by move to as empty film magazine mounting table take out of mouthfuls 2, vacate the position of sky film magazine plummer 3, so, the film magazine 14 of adorning the 3rd batch of silicon chip 15 is moved into rewinding device 9 and is carried out reviewing, at this moment, silicon chip 1 enters drying machine 8 and carries out drying, and silicon chip 13 is moved into rinsing bowl 27 and cleaned, silicon chip 15 enters treatment trough 1, and empty film magazine 14 is moved to sky film magazine plummer 3; In Fig. 6, silicon chip 11 dryings are over, and move rewinding device 9 to and refund film magazine 10, and silicon chip 13 is moved into drying machine 8 and carried out drying, and silicon chip 15 is moved into rinsing bowl 1 and begun to clean, and this section has the operation simultaneously of 3 batches of silicon chips in the period; In Fig. 7, the silicon chip of handling 11 is loaded into film magazine 10 transport apparatus, and silicon chip 13 beginnings are dry, and silicon chip 15 begins to clean, and is adorning the film magazine 16 of the 4th batch of silicon chip 17

Drop into the beginning operation, order is constantly handled in proper order.

The total time of continuous 3 batches of goods is: first from put into finish be 40 minutes (move into 5 minutes+handle 15 minutes+dry 15 minutes+took out of 5 minutes), finish after this 20 minutes for second batch, the 3rd batch after second batch 20 minutes intact, promptly altogether with finishing 3 batches of goods in 80 minutes.Can obviously improve the production capacity of equipment.

Claims

1. method of utilizing wet etching device processes silicon chip, the wet method equipment of 2 empty film magazine plummers, 2 treatment troughs, 2 rinsing bowls and a drying machine is disposed in employing, and every batch of silicon chip time in treatment trough and rinsing bowl is basic identical with the dry time, and this method comprises:

(a) after first silicon chip (11) dropped into treatment trough one (4), empty first film magazine (10) was placed on sky film magazine plummer (3);

(b) second batch of silicon chip (13) continues to drop into, and first silicon chip this moment (11) is moved in the rinsing bowl one (5);

(c) second film magazine (12) that second batch of silicon chip (13) is housed is finished reviewing on rewinding device (9), second batch of silicon chip (13) moved into treatment trough two (6) and handled, empty second film magazine (12) is moved into sky film magazine plummer (3) and is deposited, and first silicon chip (11) continues to clean in rinsing bowl one (5);

(d) the 3rd film magazine (14) of adorning the 3rd batch of silicon chip (15) is being moved into mouthful (1) wait until second batch of silicon chip (13) transport apparatus;

(e) first silicon chip (11) enters drying machine (8) and carries out drying, and second batch of silicon chip (13) moved into rinsing bowl two (7) and cleaned;

(f) first silicon chip (11) is dry intact, is moved to rewinding device (9) and refunds first film magazine (10) back transport apparatus, and second batch of silicon chip (13) moved into drying machine (8) drying,

It is characterized in that, in the described step (d), that utilizes equipment takes out of mouthful (2) as empty film magazine plummer, then first film magazine (10) of sky is moved to and taken out of mouthful (2), vacate the position of sky film magazine plummer (3), the 3rd film magazine (14) of adorning the 3rd batch of silicon chip (15) is moved into rewinding device (9) and is carried out reviewing, and the 3rd batch of silicon chip (15) enters treatment trough one (4), and empty the 3rd film magazine (14) is moved to sky film magazine plummer (3); In the described step (f), first silicon chip (11) is dry intact, moved to rewinding device (9) and refunded first film magazine (10) back transport apparatus, second batch of silicon chip (13) moved into drying machine (8) drying, the 3rd batch of silicon chip (15) moved into rinsing bowl one (5) and cleaned, and the 4th film magazine (16) of adorning the 4th batch of silicon chip (17) begins to continue to drop into.