1222157 玖 '發明說明 丄發月:日ϋ翻細之技術領域、先前撕、內容、麵方式卿麵） 發明所屬之技術領域 本發明係關於一種無塵室之機台配置方式，尤指一 種適用於平面顯示器產業之無塵室機台配置方式。 二、先前技術 一在半導體或平面顯示器之相關產業中，一用以製作 半導體元件或顯示器之基板典型地，會經過如微影、蝕 刻、脫除光阻、表面處理、清洗、沈積等製程，而各製泰 程分別在一獨立之製程機台中進行。一般而言，每個製 程機台如蝕刻機台m、光阻脫除機台112、清洗機台ιΐ3 及薄膜形成機台目前均係以獨立形式存在，而且會佔據 無塵至較大的空間，一如圖1所示。這種配置，對於空間 有限之的工業廠區而言，空間利用效率不佳，同時間接 地導致產品生產成本提高。 另一方面，由於傳統機台配置中，每一個機台均為 獨立的機台，而在各機台之間的基板運輸目前是藉由先 將基板搬運至AGV ( automatic guided vehicle )，再藉由 擎 AGV移動運送至另一機台，或者暫時將基板置於一儲存 櫃131中。而AGV在運送當中需要一特定之走道121空 間，因此此種配置及流程將會更進一步地佔據更多的空 間。目前之機台配置，通常會將考慮到將相關性質製程 機器放在相鄰之位置之方式，以減少相互間之污染，例 如將相關座製程或相關乾製程之機台配置在一起，如圖1 所示，相關光阻脫除機台112就常配置於相鄰於清洗機台 5 1222157 113之機台配置。但是這種配置方式，通常沒有考慮到製 程流程之流暢性，所以於製造過程中，需要把基板迁迴 重複地運送於相隔較遠之機台間，浪費許多製造時間於 運送之過程，造成生產效率降低及成本升高。 再者，在一般機台之操作或者維修的情形下，將會 有人員在AGV運送走道上行走，因此人員被AGV撞擊之 危險性增高，同時，由於人員在製程機台附近走動，所 以也會增加微粒子（particle)掉落於基板上的機率，降低 產品的良率。 此外，在光阻脫除製程當中，脫除機台僅能提供單 純的光阻脫除功能，沒有辦法取代清洗機台在製程上的 機台。然而，在全球生產成本降低、壓低毛利率的趨勢 之下，如何以最少資源做最有效之利用，已經成為各個 半導體相關製造廠努力的目標，因此如何設計出一最佳 空間、機台利用效率之機台配置以及整合式機台，是亟 待改善的目標。 三、發明内容 本發明之主要目的係在提供一種無塵室之機台配置 方式，俾能減少機台配置佔用之體積，合理化機台配置， 降低運送時間以提升基板運送速度，增加製程流程流暢 性，並提高空間利用率。 本發明之另一目的係在提供一種無塵室之機台配置 方式’俾能減低因為人員走動而造成微粒子掉落於產品 6 1222157 =會’提高生產良率，降低人員碰撞之風 低 生產成本。 本^月之又-目的係在提供—種同時具有清洗，脫 除及钱刻功叙整合式之_脫除表處清洗機台，俾能 視需要地繞行略過非必須之製程，增加使用彈性，減少 相同功能機台組之佔用空間，降低完成相同製程之機台 組成本’並提高機台使用效率。 本毛明之再一目的係在提供一種整合式之蝕刻脫除 表處清洗機台，俾能在不需要進行蝕刻製程時，使得基 板可以繞行蝕刻製程室，直接進入下一製程。 為達成上述之主要目的，本發明之無塵室之製程機 台配置，係配合至少一基板，包括··複數個曝光機台， 係對該基板進行曝光製程；複數沈積機台，係對該基板 進行沈積製程；複數個蝕刻脫除清洗整合機台，其中每 一蝕刻脫除清洗整合機台係位於該曝光機台與該沈積機 台間’用以對該基板進行餘刻、脫除及清洗製程；以及 一空中基板運輸裝置（OHS)，係跨越該曝光機台，該沈積 機台以及該蝕刻脫除清洗整合機台之頂部，用以輸送該 基板於該曝光機台，該沈積機台以及該蝕刻脫除清洗整 合機台間；其中，該曝光機台、該蝕刻脫除清洗整合機 台以及該沈積機台間，係利用該空中基板運輸裝置（OHS) 運輸基板以使得該基板先經過該曝光機台進行曝光製 程，再經過該蝕刻脫除清洗整合機台以進行蝕刻、脫除、 表面處理及清洗製程，最後進入該沈積機台以進行沈積 製程。 7 為達到本發明之又一目的，本發明之整合式蝕刻脫 除清洗機台，係配合至少一基板，包括：一蝕刻製程室； 一脫除製程室；一清洗製程室；以及一基板繞行運輸裝 置；其中，該蝕刻製程室、該脫除製程室、該清洗製程 室係依序排列相連，且該基板係藉由該基板繞行運輸裝 置之傳送，進入一清洗製程室進行清洗，或選擇性地進 入該#刻製程室，該脫除製程室，及該清洗製程室。 簡言之’本發明主要係提供一種無塵室中之機台配 置方式’ 一方面可以免除使用AGV、進而減少AGV走道 之空間’另一方面，藉由儲存櫃阻絕工作人員直接接近 機台而造成微粒子掉落的機會。同時，將同一程序之製 程機台擺成一列，藉由儲存櫃之機械手臂或者OHS運送 待加工基板，增加生產效率。 此外’本發明亦提供一種整合式的機台，將蝕刻、 脫除光阻、表面處理以及清洗等製程步驟，從原先各自 獨立的機台，整合至同一機台，以節省空間的利用，同 時設置一繞行運輸裝置，使得當基板不需要經過蝕刻製 程時，可藉由繞行運輸裝置運送至下一製程。該基板繞 行運輸裝置無限制，其可為任何可選擇性地進入或繞行 (bypass)該餘刻製程室，該脫除製程室，或該清洗製程室 之運輸裝置，較佳為一具有一第一基板運輸裝置及一第 二基板運輸裝置之運輸裝置。其中該第二基板運輸裝置 係裝置於該蝕刻製程室之上方，並以一升降機構連接於 該第一基板運輸裝置，使得該基板可選擇性地經由該第 二基板運輸裝置，在不需進入該蝕刻製程室下，運送至 該脫除製程室。更佳為該第一基板運輸裝置係為一滾輪 運輸裝1: I亥第二基板運輸裝置係為一滾輪運輸裝 置。本發明I合式餘刻⑽除清洗機台可選擇性地視需要 地增加包括有運輸裝置、蝕刻室、DIW潤洗、乾空氣風 刀、緩衝液室、光阻脫除室、化學潤洗、乾燥單元、有 機去除、清洗、、乾燥單元等，以增加其功能並提高 使用彈性。 四、實施方式 需要注意的是，本發明之整合式機台之基板運輸裝 置並無限制，T為習知之輸送帶運輸裝置、雜運輸裝 置等’較佳為一滾輪運輸裝置；本發明所適用之基板並 無限制，可為一般半導體中之矽基板或者LCD顯示裝置 產業中之玻璃基板，較佳係為一玻璃基板。 為能讓貴審查委員能更瞭解本發明之技術内容，特 舉二較佳具體實施例說明如下。 實施例一 睛先參見圖2，此係本發明實施例一之機台配置示意 圖。在本實施例中，主要將同類型製程之機台擺在同一 列’藉由儲存櫃之機械手臂或者〇HS來搬運加工基板。 在圖中可見’主要分為四種機台，分別為光微影機台 211、餘刻及光阻脫除機台212，以及薄膜沈積機台213， 彼此之間以一儲存櫃隔開，並且完全不使用AGV，因此 1222157 不需要AGV走道，大幅增加了空間配置之利用效率。各 機台之間的基板搬運，交由儲存櫃221之機械手臂執行， 或者藉由OHS 222來搬運，更進一步減少因為人員接近或 者AGV移動之間可能造成微粒子落於基板上的機會，同 時降低了人員與AGV碰撞之機會，也因而提高了產品的 良率。再者，本配置方式係以〇HS作搬運載具，是以可 以大幅免除使用AGV作為搬運載具時，基板搬進搬出機 台所暴露於空氣中產生粒子污染之機會。更有甚者，本 實施例之配置，可以在薄膜形成後，將基板以〇HS運送 至光微影機台211，並運送至相鄰之餘刻或光阻脫除機台 212。因為配置中蝕刻及光阻脫除機台212相鄰於光微影 機台211，所以可以避免迂迴之運輸浪費，提高生產流程 之流暢性及合理性。 實施例二 請參見圖3，此係本發明實施例二之機台配置示意 圖。在本實施例中，係將同一層之製程機台如薄膜沈積 311、微影312以及蝕刻脫除313等，放在同一個儲存櫃321 的動線上，其優點係藉由相連的儲存櫃而免除AGV於上 下貨時暴露於空氣中，造成particle掉落於基板上。另一 方面，本實施例亦可去除AGV走道所佔之空間，減少設 備空間成本，亦同時可避免人員被AGV撞擊。同時藉由 儲存櫃切或⑽322之輸送，人員不需走到機台前^ 作’亦減少了人員走動所帶來的微粒子。並且，藉著將 同層製程機台至於同—條製程線上，可減少產品搬運時 10 1222157 間。再者，本實施例之配置，可以在薄膜形成後，將基 板以OHS運送至光微影機台2 u，並運送至相鄰之蝕刻或 光阻脫除機台212。因為配置中蝕刻及光阻脫除機台212 相鄰於光微影機台211，所以可以避免迂迴之運輸浪費， 提高生產流程之流暢性及合理性。 實施例三 請參見圖4，此係本發明實施例三之整合式機台示意 圖。如刖所述，為了提高每一機台之生產力，本實施例 所提出之整合式機台412，可將蝕刻、光阻脫除、表面處 理以及清洗等製程整合於同一機台中，一方面提高此機 台之生產力，另一方面也減少了多餘之機台空間，降低 了設備成本。該整合式機台412之前接有一光微影機台 411，後續有一薄膜沈積機台413，同時每一機台都連接 於一儲存櫃421，並且藉由一機械手臂422將加工之玻璃 基板送進儲存櫃421之進貨埠423。 實施例四 請參見圖5 ’此係本發明實施例四之示意圖。在本實 施例中主要係展示本發明之整合式機台，除了能夠整合 各製程之外，更可以因為某些特定製程並非每次都需 要，而設計一繞行裝置（bypass)機構，得以選擇性地將基 板送入特定製程室或繞行省略其中之製程。 本實施例中係針對蝕刻製程設計一繞行滾輪裝置 52。在正常的製程當中，會使用到蝕刻製程，因此玻璃 11 基板係以滾輪運輸裝置5 1傳送經過每一製程。然而，在 某些特定情況下，蝕刻製程並非必須，此時若依然將玻 璃基板送入蝕刻製程，不啻是一種時間以及成本上的浪 費’且不符合目前製程，而導致玻璃基板的損傷，因此 另設置了一繞行滾輪裝置52，使得玻璃基板53可以經由 此繞行滾輪裝置52略過蝕刻製程，直接前往下一製程。1222157 "Explanation of the invention: The month of the invention: the technical field of sundial thinning, the previous tear, the content, and the method of the surface) The technical field to which the invention belongs The present invention relates to a machine configuration method for a clean room, especially an applicable Clean room machine configuration in the flat panel display industry. 2. Prior Technology 1. In the semiconductor or flat display related industries, a substrate used to make a semiconductor element or display typically undergoes processes such as lithography, etching, photoresist removal, surface treatment, cleaning, and deposition. Each Thai process is performed in a separate process machine. Generally speaking, each process machine such as the etching machine m, the photoresist removal machine 112, the cleaning machine ιΐ3, and the film forming machine currently exist in an independent form, and will occupy a large space from dust-free. , As shown in Figure 1. This configuration, for industrial plants with limited space, has poor space utilization efficiency and indirectly leads to higher product production costs. On the other hand, in the traditional machine configuration, each machine is an independent machine, and the substrate transportation between each machine is currently carried by first transferring the substrate to an AGV (automatic guided vehicle), and then borrowing it. Moving by AGV to another machine, or temporarily placing the substrate in a storage cabinet 131. AGV needs a special aisle 121 space during transportation, so this configuration and process will further occupy more space. The current machine configuration usually takes into consideration the way that related process machines are placed next to each other to reduce mutual pollution. For example, the machines of related seat processes or related dry processes are configured together, as shown in the figure. As shown in FIG. 1, the relevant photoresist removal machine 112 is often arranged adjacent to the machine 5 1222157 113. However, this configuration method usually does not take into account the smoothness of the process flow. Therefore, in the manufacturing process, the substrate needs to be moved back and repeatedly to be transported between remote machines, which wastes a lot of manufacturing time during the transportation process, resulting in production. Reduced efficiency and increased costs. In addition, in the case of general machine operation or maintenance, there will be people walking on the AGV transport aisle, so the risk of being hit by the AGV will increase. At the same time, because people move near the process machine, they will also Increase the probability of particles falling on the substrate and reduce the yield of the product. In addition, in the photoresist removal process, the removal machine can only provide a single photoresist removal function, and there is no way to replace the machine in the process of cleaning the machine. However, under the trend of reducing global production costs and lowering gross profit margins, how to use the least resources to make the most effective use has become the goal of various semiconductor manufacturers. Therefore, how to design an optimal space and machine utilization efficiency The machine configuration and integrated machine are the goals that need to be improved urgently. 3. Summary of the Invention The main purpose of the present invention is to provide a machine configuration method for a clean room, which can reduce the volume occupied by the machine configuration, rationalize the machine configuration, reduce the transport time to increase the substrate transport speed, and increase the smooth process flow. And improve space utilization. Another object of the present invention is to provide a clean room machine configuration method, which can reduce particles falling on the product due to people walking around. 1222157 = will 'improve production yield and reduce personnel collision wind. Low production costs. . The purpose of this month is to provide an integrated cleaning and removal machine with cleaning, removal, and money-cutting functions, which can bypass unnecessary processes if necessary, and increase Use flexibility, reduce the space occupied by the same function machine group, reduce the cost of the machine to complete the same process, and improve machine efficiency. Another objective of this Maoming is to provide an integrated etching and surface cleaning machine, which can make the substrate bypass the etching process chamber and go directly to the next process when the etching process is not needed. In order to achieve the above-mentioned main objective, the process machine configuration of the clean room of the present invention is matched with at least one substrate, including a plurality of exposure machines, which are used to perform the exposure process on the substrate; and a plurality of deposition machines, which are used to the The substrate is subjected to a deposition process; a plurality of etching, removing, and cleaning integration machines, each of which is located between the exposure machine and the deposition machine, is used to perform etching, removal, and removal of the substrate. Cleaning process; and an aerial substrate transport device (OHS), which spans the top of the exposure machine, the deposition machine, and the etching removal cleaning integration machine, to transport the substrate to the exposure machine, the deposition machine And the etching and cleaning integration machine; among the exposure machine, the etching and cleaning integration machine, and the deposition machine, the substrate is transported by the OHS to make the substrate First go through the exposure machine to perform the exposure process, then go through the etching removal cleaning integration machine to perform the etching, removal, surface treatment and cleaning processes, and finally enter the deposition machine To perform the deposition process. 7 In order to achieve another object of the present invention, the integrated etching removal cleaning machine of the present invention is equipped with at least one substrate, including: an etching process chamber; a removal process chamber; a cleaning process chamber; and a substrate winding The transporting device; wherein the etching process room, the removal process room, and the cleaning process room are sequentially connected, and the substrate is transported by the substrate around the transport device to enter a cleaning process room for cleaning. Or selectively enter the #lithography process room, the removal process room, and the cleaning process room. In short, 'the present invention mainly provides a machine configuration method in a clean room.' On the one hand, the use of AGV can be eliminated, thereby reducing the space of the AGV aisle. 'On the other hand, the storage cabinet prevents workers from directly accessing the machine. Chance of causing particles to fall. At the same time, the processing machines of the same procedure are arranged in a row, and the substrates to be processed are transported by the robot arm of the storage cabinet or OHS, increasing the production efficiency. In addition, the present invention also provides an integrated machine, which integrates the process steps of etching, photoresist removal, surface treatment, and cleaning from the original independent machines to the same machine to save space. A bypass transportation device is provided so that when the substrate does not need to be subjected to an etching process, the substrate can be transported to the next process by the bypass transportation device. The substrate bypass transport device is not limited, and it can be any transport device that can selectively enter or bypass the off-cut process room, the removal process room, or the cleaning process room. A first substrate transporting device and a second substrate transporting device. The second substrate transporting device is installed above the etching process chamber, and is connected to the first substrate transporting device by a lifting mechanism, so that the substrate can be selectively passed through the second substrate transporting device without entering. The etching process chamber is transported to the removal process chamber. More preferably, the first substrate transportation device is a roller transportation device 1: The second substrate transportation device is a roller transportation device. According to the present invention, the combined I-type cleaning and cleaning machine can optionally be added to include a transport device, an etching chamber, a DIW rinse, a dry air knife, a buffer solution chamber, a photoresist removal chamber, a chemical rinse, Drying unit, organic removal, cleaning, drying unit, etc. to increase its function and improve the use flexibility. Fourth, the embodiment needs to be noted that the substrate transport device of the integrated machine of the present invention is not limited, and T is a conventional conveyor transport device, miscellaneous transport device, etc. 'preferably a roller transport device; the invention is applicable to The substrate is not limited, and may be a silicon substrate in a general semiconductor or a glass substrate in an LCD display device industry, and preferably a glass substrate. In order to make your reviewing committee better understand the technical content of the present invention, the second preferred embodiment is described below. First Embodiment Referring to FIG. 2 at first, this is a schematic diagram of a machine configuration according to the first embodiment of the present invention. In this embodiment, machines of the same type are mainly placed in the same row ', and the substrates are processed by the robot arm of the storage cabinet or the OHS. It can be seen in the figure that there are mainly four types of machines, namely the photolithography machine 211, the relief and photoresist removal machine 212, and the thin film deposition machine 213, which are separated from each other by a storage cabinet. And AGV is not used at all, so 1222157 does not need AGV aisle, which greatly increases the utilization efficiency of space allocation. The substrate transfer between each machine is performed by the robot arm of the storage cabinet 221, or by OHS 222, which further reduces the chance of particles falling on the substrate due to personnel approaching or AGV movement, while reducing The opportunity for personnel to collide with the AGV has also improved the yield of the product. In addition, this configuration method uses 0HS as a carrier, which can greatly avoid the chance of particle contamination in the air exposed to the board when the substrate is moved into and out of the machine when using AGV as a carrier. What's more, in the configuration of this embodiment, after the film is formed, the substrate can be transported to the photolithography machine 211 at 0HS, and can be transported to the adjacent time or photoresist removal machine 212. Because the etching and photoresist removal machine 212 is adjacent to the photolithography machine 211 in the configuration, the circuitous waste of transportation can be avoided, and the smoothness and rationality of the production process can be improved. Second Embodiment Please refer to FIG. 3, which is a schematic diagram of a machine configuration according to a second embodiment of the present invention. In this embodiment, process machines of the same layer, such as film deposition 311, lithography 312, and etching removal 313, are placed on the moving line of the same storage cabinet 321. The advantage is that the connected storage cabinets The AGV is prevented from being exposed to the air during loading and unloading, causing particles to fall on the substrate. On the other hand, this embodiment can also remove the space occupied by the AGV aisle, reduce the equipment space cost, and at the same time prevent personnel from being hit by the AGV. At the same time, by cutting through the storage cabinet or transporting the 输送 322, personnel do not need to walk to the front of the machine ^ work 'also reduces the particles brought about by people's movement. In addition, by placing the same-level process machines on the same process line, the product handling time can be reduced by 10 1222157. Furthermore, in the configuration of this embodiment, after the film is formed, the substrate can be transported to the photolithography machine 2u by OHS and to the adjacent etching or photoresist removal machine 212. Because the etching and photoresist removal machine 212 is adjacent to the photolithography machine 211 in the configuration, the circuitous waste of transportation can be avoided, and the smoothness and rationality of the production process can be improved. Embodiment 3 Please refer to FIG. 4, which is a schematic diagram of an integrated machine according to Embodiment 3 of the present invention. As mentioned above, in order to improve the productivity of each machine, the integrated machine 412 proposed in this embodiment can integrate processes such as etching, photoresist removal, surface treatment, and cleaning in the same machine, improving on the one hand The productivity of this machine, on the other hand, reduces the excess machine space and reduces equipment costs. The integrated machine 412 is preceded by a light lithography machine 411, followed by a thin film deposition machine 413. At the same time, each machine is connected to a storage cabinet 421, and the processed glass substrate is sent by a robotic arm 422. Enter the storage port 423 in the storage cabinet 421. Embodiment 4 Please refer to FIG. 5 ′ This is a schematic diagram of Embodiment 4 of the present invention. In this embodiment, the integrated machine of the present invention is mainly shown. In addition to being able to integrate the various processes, it is also possible to design a bypass mechanism to select a specific process because it is not necessary every time. Feed the substrate into a specific process chamber or bypass the process which is omitted. In this embodiment, an orbiting roller device 52 is designed for the etching process. In the normal process, an etching process is used, so the glass 11 substrate is transported through each process by a roller transport device 51. However, in some specific cases, the etching process is not necessary. If the glass substrate is still sent into the etching process at this time, it is not a waste of time and cost. In addition, a detour roller device 52 is provided, so that the glass substrate 53 can skip the etching process and go directly to the next process through the detour roller device 52.
更進一步討論本實施例中之整合式機台，此機台可 視需要地增加包括有運輸裝置、蝕刻室、DIW潤洗、乾 空氣風刀、緩衝液室、光阻脫除室、化學潤洗、乾燥單 元、有機去除、清洗、CJ、乾燥單元等，以增加其功能 並提高使用彈性。其主要係將以往平面運輸之各步驟轉 而以遥擇性地立體方式堆疊運輸，所以可以視銬 行通過特定製程室減少平面空間的利用。另一方面藉: 整合式機台大幅度減少機台的購置成本。The integrated machine in this embodiment is further discussed. This machine can be optionally added to include a transport device, an etching chamber, a DIW rinse, a dry air knife, a buffer chamber, a photoresist removal chamber, and a chemical rinse. , Drying unit, organic removal, cleaning, CJ, drying unit, etc. to increase its function and improve the use flexibility. It mainly converts the previous steps of plane transportation to remotely selective three-dimensional stacking transportation, so you can reduce the use of plane space through the specific process room depending on the handcuffs. On the other hand: The integrated machine greatly reduces the purchase cost of the machine.
品要注意的是，在本實施例中，玻璃基板在繞行 輪裝置52與滾輪運輸裝置51之間的切換，乃是 打滾輪裝置52之升降而達成。請參見圖6，此係^實施 之部分俯視圖。在本圖中，繞行滾輪裝置52之各滾輪5 係與滾輪運輸裳置51之各滾輪511錯開，使得當繞行滾 裝置52降下至與滾輪運輸裝置51等高時，可錯開各滾專 而繼續運行，如圖7A、圖7B所示。此時，原本位： ^滾輪U52上之玻縣板可轉而經由滾輪運輸裝置^ 則傳遞，等到該玻璃基板完全離開繞行滾輪裝置μ之肩 一滾輪時，繞行滾輪裝置52即可上升回到原有位置。济 12 1222157 置51轉換至繞行 反之《，當朗基板欲由滚 滾輪裝置52時，亦採取相同之步驟= 所主張之權利範圍自應以申請 _、而已，本發明 僅限於上述實施例。 &所述為準，而非 五、圖式簡單說明 圖1係習知之無塵室機台配置示意圖。 圖2係本發明實施例一之無塵室機台配置示意圖。 圖3係本發明貫施例二之無塵室機台配置示意圖。 圖4係本發明實施例三之整合式機台示意圖。 圖5係本發明實施例四之示意圖。 圖6係本發明實施例四之部分俯視圖。 圖7A、7B係本發明實施例四之繞行滾輪裝置升降示意圖。 六、圖號說明 Π1蝕刻機台 121 AGV走道 211光微影機台 221儲存櫃 311薄膜沈積機台 321儲存櫃 411光微影機台 312微影機台 322 OHS 412整合式機台 313蝕刻脫除機台 413薄膜沈積機台It should be noted that, in this embodiment, the switching of the glass substrate between the bypass wheel device 52 and the roller transport device 51 is achieved by the lifting and lowering of the roller device 52. Please refer to FIG. 6, which is a partial plan view of the implementation. In this figure, the rollers 5 of the bypass roller device 52 are staggered from the rollers 511 of the roller transportation rack 51, so that when the bypass roller device 52 is lowered to the same height as the roller transportation device 51, the rollers can be staggered. And continue to run, as shown in Figure 7A, Figure 7B. At this time, the original position: ^ The glass plate on the roller U52 can be transferred via the roller transport device ^, and when the glass substrate completely leaves a roller on the shoulder of the bypass roller device μ, the bypass roller device 52 can rise Back to the original position. The 121222157 set 51 to switch to the detour. Conversely, when the Lang substrate wants to use the roller device 52, the same steps are taken = the scope of the claimed right should be applied for, and the invention is only limited to the above embodiments. & Whatever is described, not the fifth, the diagram is simply explained Figure 1 is a schematic diagram of a conventional clean room machine configuration. FIG. 2 is a schematic configuration diagram of a clean room machine according to the first embodiment of the present invention. FIG. 3 is a schematic diagram of a clean room machine configuration according to Embodiment 2 of the present invention. FIG. 4 is a schematic diagram of an integrated machine according to a third embodiment of the present invention. FIG. 5 is a schematic diagram of a fourth embodiment of the present invention. Fig. 6 is a partial plan view of a fourth embodiment of the present invention. 7A and 7B are schematic diagrams of lifting and lowering of a bypass roller device according to a fourth embodiment of the present invention. Description of drawing number Π1 etching machine 121 AGV walkway 211 light lithography machine 221 storage cabinet 311 film deposition machine 321 storage cabinet 411 light lithography machine 312 lithography machine 322 OHS 412 integrated machine 313 In addition to machine 413 film deposition machine
U2光阻脫除機台113清洗機台 131儲存櫃 212蝕刻及光阻脫213薄膜沈積機台 除機台 222 OHS 13 1222157 421 儲存櫃 422 機械手臂 423進貨埠 51 滾輪運輸裝置 511 滾輪 52 繞行滚輪裝置 521 滾輪 53 玻璃基板U2 photoresist removal machine 113 cleaning machine 131 storage cabinet 212 etching and photoresist 213 film deposition machine removal machine 222 OHS 13 1222157 421 storage cabinet 422 robot arm 423 loading port 51 roller transport device 511 roller 52 bypass Roller device 521 Roller 53 Glass substrate
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