CN100412586C - 光纤耦合器的制作方法及装置 - Google Patents
光纤耦合器的制作方法及装置 Download PDFInfo
- Publication number
- CN100412586C CN100412586C CNB031229999A CN03122999A CN100412586C CN 100412586 C CN100412586 C CN 100412586C CN B031229999 A CNB031229999 A CN B031229999A CN 03122999 A CN03122999 A CN 03122999A CN 100412586 C CN100412586 C CN 100412586C
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- CN
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- Prior art keywords
- optical fiber
- engaging zones
- evanescent field
- exposed surface
- electric arc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000013307 optical fiber Substances 0.000 title claims abstract description 116
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000010891 electric arc Methods 0.000 claims abstract description 49
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 239000000835 fiber Substances 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 27
- 239000007789 gas Substances 0.000 claims description 19
- 238000010926 purge Methods 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 claims description 8
- 238000003698 laser cutting Methods 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 239000003570 air Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 230000007613 environmental effect Effects 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 229910052720 vanadium Inorganic materials 0.000 claims description 5
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 230000010287 polarization Effects 0.000 abstract description 7
- 238000004891 communication Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- -1 hydroxyl ions Chemical class 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- Mechanical Coupling Of Light Guides (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims (23)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031229999A CN100412586C (zh) | 2003-04-21 | 2003-04-21 | 光纤耦合器的制作方法及装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031229999A CN100412586C (zh) | 2003-04-21 | 2003-04-21 | 光纤耦合器的制作方法及装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1540377A CN1540377A (zh) | 2004-10-27 |
CN100412586C true CN100412586C (zh) | 2008-08-20 |
Family
ID=34321178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031229999A Expired - Fee Related CN100412586C (zh) | 2003-04-21 | 2003-04-21 | 光纤耦合器的制作方法及装置 |
Country Status (1)
Country | Link |
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CN (1) | CN100412586C (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100422776C (zh) * | 2005-06-17 | 2008-10-01 | 陈南光 | 激光微加工处理全光纤型元件的制作方法 |
CN103969744A (zh) * | 2013-02-04 | 2014-08-06 | 大豪信息技术(威海)有限公司 | 一种光纤熔接机的放电强度校正方法 |
CN103217814B (zh) * | 2013-04-22 | 2015-09-30 | 哈尔滨工程大学 | 一种光纤电光强度调制器及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906810A (en) * | 1987-10-16 | 1990-03-06 | Oy Nokia Ab | Method and a device for the manufacturing of an optical coupler |
JPH03166503A (ja) * | 1989-11-25 | 1991-07-18 | Kyocera Corp | 光分岐結合器の製造装置 |
JPH06250041A (ja) * | 1993-03-01 | 1994-09-09 | Shin Etsu Chem Co Ltd | 光ファイバ型カプラの製造方法およびその装置 |
CN1177403A (zh) * | 1995-03-07 | 1998-03-25 | 西门子公司 | 熔接光纤的熔接设备 |
-
2003
- 2003-04-21 CN CNB031229999A patent/CN100412586C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906810A (en) * | 1987-10-16 | 1990-03-06 | Oy Nokia Ab | Method and a device for the manufacturing of an optical coupler |
JPH03166503A (ja) * | 1989-11-25 | 1991-07-18 | Kyocera Corp | 光分岐結合器の製造装置 |
JPH06250041A (ja) * | 1993-03-01 | 1994-09-09 | Shin Etsu Chem Co Ltd | 光ファイバ型カプラの製造方法およびその装置 |
CN1177403A (zh) * | 1995-03-07 | 1998-03-25 | 西门子公司 | 熔接光纤的熔接设备 |
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Publication number | Publication date |
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CN1540377A (zh) | 2004-10-27 |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SPRING FOUNDATION OF NCTU Free format text: FORMER OWNER: QI Effective date: 20090821 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090821 Address after: No. 1001, University Road, Hsinchu, Taiwan Patentee after: Spring Foundation of NCTU Address before: No. 9, building 25, No. 1, Jianzhong Road, Taiwan, Hsinchu Patentee before: Qi Shen |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080820 Termination date: 20160421 |