CN100390316C - n型CVD共掺杂金刚石薄膜的制备方法 - Google Patents
n型CVD共掺杂金刚石薄膜的制备方法 Download PDFInfo
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- CN100390316C CN100390316C CNB2006100234423A CN200610023442A CN100390316C CN 100390316 C CN100390316 C CN 100390316C CN B2006100234423 A CNB2006100234423 A CN B2006100234423A CN 200610023442 A CN200610023442 A CN 200610023442A CN 100390316 C CN100390316 C CN 100390316C
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CNB2006100234423A CN100390316C (zh) | 2006-01-19 | 2006-01-19 | n型CVD共掺杂金刚石薄膜的制备方法 |
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CNB2006100234423A CN100390316C (zh) | 2006-01-19 | 2006-01-19 | n型CVD共掺杂金刚石薄膜的制备方法 |
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CN1804115A CN1804115A (zh) | 2006-07-19 |
CN100390316C true CN100390316C (zh) | 2008-05-28 |
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CNB2006100234423A Expired - Fee Related CN100390316C (zh) | 2006-01-19 | 2006-01-19 | n型CVD共掺杂金刚石薄膜的制备方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102127751B (zh) * | 2011-01-11 | 2012-12-26 | 大连理工大学 | 一种柱状阵列结构硼掺杂金刚石微纳米材料及其制备方法 |
CN103695863B (zh) * | 2013-12-09 | 2016-04-13 | 四川大学 | 一种掺硼金刚石膜/碳膜复合电极材料的制备方法 |
CN109913857A (zh) * | 2019-04-26 | 2019-06-21 | 上海金铎禹辰水环境工程有限公司 | 一种掺杂结构金刚石薄膜及其制备方法 |
CN110565066B (zh) * | 2019-09-17 | 2022-04-19 | 北京阿尔玛斯科技有限公司 | 一种共掺杂金刚石及制备方法与半导体材料、装置 |
CN111593318A (zh) * | 2020-07-13 | 2020-08-28 | 内蒙古科技大学 | 金刚石纳米晶/氮掺杂碳化硅界面相的n型半导体复合薄膜及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1169757A (zh) * | 1994-11-07 | 1998-01-07 | S·纽维勒 | 淀积非常坚固的保护涂层的方法 |
WO2003052174A2 (en) * | 2001-12-14 | 2003-06-26 | Element Six Limited | Boron doped diamond |
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- 2006-01-19 CN CNB2006100234423A patent/CN100390316C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1169757A (zh) * | 1994-11-07 | 1998-01-07 | S·纽维勒 | 淀积非常坚固的保护涂层的方法 |
WO2003052174A2 (en) * | 2001-12-14 | 2003-06-26 | Element Six Limited | Boron doped diamond |
Non-Patent Citations (2)
Title |
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硼硫共掺杂金刚石薄膜的研究. 李荣斌等.功能材料,第35卷第1期. 2004 |
硼硫共掺杂金刚石薄膜的研究. 李荣斌等.功能材料,第35卷第1期. 2004 * |
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CN1804115A (zh) | 2006-07-19 |
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Effective date of registration: 20090424 Address after: 690 Jiangchuan Road, Minhang District, Shanghai, zip code: 200240 Co-patentee after: Shanghai Angdian Industry Co., Ltd Patentee after: Shanghai Dian Ji University Co-patentee after: Shanghai ang Electromechanical Science and Technology Development Co., Ltd. Address before: No. 1201, Jiangchuan Road, Shanghai, China: 200245 Patentee before: Shanghai Dianji University |
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CI01 | Correction of invention patent gazette |
Correction item: Patentee Correct: Shanghai Angdian Electromechanical Science and Technology Development Co., Ltd False: Shanghai ang Electromechanical Science and Technology Development Co., Ltd. Number: 21 Page: 1778 Volume: 25 |
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Free format text: CORRECT: PATENTEE; FROM: SHANGHAI CITY ANGDIAN MECHANO-ELECTRICAL DEVELOPMENT CO.,LTD. TO: SHANGHAIANGDIAN MACHINERY ELECTROMECHANICAL DEVELOPMENT CO., LTD. |
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Granted publication date: 20080528 Termination date: 20150119 |
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