CN100382662C - 生产装置 - Google Patents
生产装置 Download PDFInfo
- Publication number
- CN100382662C CN100382662C CNB2004100050543A CN200410005054A CN100382662C CN 100382662 C CN100382662 C CN 100382662C CN B2004100050543 A CNB2004100050543 A CN B2004100050543A CN 200410005054 A CN200410005054 A CN 200410005054A CN 100382662 C CN100382662 C CN 100382662C
- Authority
- CN
- China
- Prior art keywords
- unit
- circuit board
- equipment
- production
- production device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 80
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 238000012544 monitoring process Methods 0.000 claims abstract 2
- 238000005476 soldering Methods 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 27
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 3
- 230000032258 transport Effects 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 230000004907 flux Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000001960 triggered effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011897 real-time detection Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100050543A CN100382662C (zh) | 2004-02-16 | 2004-02-16 | 生产装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100050543A CN100382662C (zh) | 2004-02-16 | 2004-02-16 | 生产装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1658741A CN1658741A (zh) | 2005-08-24 |
CN100382662C true CN100382662C (zh) | 2008-04-16 |
Family
ID=35007922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100050543A Expired - Fee Related CN100382662C (zh) | 2004-02-16 | 2004-02-16 | 生产装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100382662C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220355423A1 (en) * | 2021-05-07 | 2022-11-10 | Ersa Gmbh | Moving unit for moving two soldering assemblies for processing circuits boards, and soldering system for selective wave soldering with a moving unit |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101562302B1 (ko) * | 2009-04-30 | 2015-10-22 | 주식회사 탑 엔지니어링 | 글래스 패널의 더미 낙하방지장치 |
CN103869320A (zh) * | 2012-12-13 | 2014-06-18 | 同致电子企业股份有限公司 | 组装设备、自动组装系统及超声波传感器的自动组装方法 |
CN107022776B (zh) * | 2017-06-12 | 2019-02-05 | 俊杰机械(深圳)有限公司 | 一种pcb板掉板监测装置及电镀装置 |
CN110451211A (zh) * | 2019-09-24 | 2019-11-15 | 天津七所高科技有限公司 | 一种输送线掉件检测装置 |
CN112845116A (zh) * | 2020-12-31 | 2021-05-28 | 深圳茵富思无损检测技术有限公司 | 一种果蔬分选设备用防果杯掉落检测系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03214688A (ja) * | 1990-01-18 | 1991-09-19 | Matsushita Electric Ind Co Ltd | 電子部品の加熱処理装置 |
JPH04216700A (ja) * | 1990-12-17 | 1992-08-06 | Fujitsu Ltd | 薄手プリント基板の搬送装置 |
JPH08134531A (ja) * | 1994-11-02 | 1996-05-28 | Enbish Alum Wheels Co Ltd | 熱処理装置 |
JP2001320163A (ja) * | 2000-05-09 | 2001-11-16 | Matsushita Electric Ind Co Ltd | リフロー装置およびその基板加熱方法 |
-
2004
- 2004-02-16 CN CNB2004100050543A patent/CN100382662C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03214688A (ja) * | 1990-01-18 | 1991-09-19 | Matsushita Electric Ind Co Ltd | 電子部品の加熱処理装置 |
JPH04216700A (ja) * | 1990-12-17 | 1992-08-06 | Fujitsu Ltd | 薄手プリント基板の搬送装置 |
JPH08134531A (ja) * | 1994-11-02 | 1996-05-28 | Enbish Alum Wheels Co Ltd | 熱処理装置 |
JP2001320163A (ja) * | 2000-05-09 | 2001-11-16 | Matsushita Electric Ind Co Ltd | リフロー装置およびその基板加熱方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220355423A1 (en) * | 2021-05-07 | 2022-11-10 | Ersa Gmbh | Moving unit for moving two soldering assemblies for processing circuits boards, and soldering system for selective wave soldering with a moving unit |
US11964345B2 (en) * | 2021-05-07 | 2024-04-23 | Ersa Gmbh | Moving unit for moving two soldering assemblies for processing circuits boards, and soldering system for selective wave soldering with a moving unit |
Also Published As
Publication number | Publication date |
---|---|
CN1658741A (zh) | 2005-08-24 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HESHUO JOINT SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HUASHUO COMPUTER CO LTD Effective date: 20100521 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIPEI CITY, TAIWAN PROVINCE TO: 5/F, NO.76 LIGONG ROAD, BEITOU DISTRICT, TAIPEI CITY, TAIWAN PROVINCE, CHINA |
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TR01 | Transfer of patent right |
Effective date of registration: 20100521 Address after: Taiwan Taipei City Beitou District China meritorious Road No. 76 5 floor Patentee after: Pegatron Corporation Address before: Taipei city of Taiwan Province Patentee before: Huashuo Computer Co., Ltd. |
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C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080416 Termination date: 20120216 |