CN100382268C - Electronic component joint device - Google Patents
Electronic component joint device Download PDFInfo
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- CN100382268C CN100382268C CNB2006100794923A CN200610079492A CN100382268C CN 100382268 C CN100382268 C CN 100382268C CN B2006100794923 A CNB2006100794923 A CN B2006100794923A CN 200610079492 A CN200610079492 A CN 200610079492A CN 100382268 C CN100382268 C CN 100382268C
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- electronic unit
- terminal
- magnetic head
- vibration
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The disclosed coupling device (1) for electronic member comprises: a vibrating magnetic head to crimp and connect the terminal on circuit board (2) and the electrode on electronic part (4), a heater (8) to hot cure the insulation resin and stick (2) and (4), and a heat insulation member (9) to prevent hot curing before connection. This invention improves product stability and strength.
Description
Technical field
The present invention relates to the coupling device of electronic unit that circuit board and electronic unit are connected and fixed.
Background technology
One to since, as being under the state of electrical connection in portion of terminal that is formed at the circuit board place and the electrode part that is formed at the electronic unit place, with the method that circuit board and electronic unit are connected and fixed, the whole bag of tricks obtains adopting.For example, utilize mode of vibration crimping splice terminal portion and electrode part such as ultrasonic vibration, the method that circuit board and electronic unit are connected and fixed be widely known by the people (for example: refer to Patent Document 1 and 2).In addition, be under the state of contact in portion of terminal and electrode part, by making the adhesive joint of NCP heat cured insulating resin hot curings such as (Non Conductive Paste), the method that is connected and fixed circuit board and electronic unit also be widely known by the people (for example: refer to Patent Document 3 and 4).
Utilize vibration portion of terminal and electrode part to be carried out the coupling device of crimping electronic component bonded, as disclosed in patent documentation 1 and 2, possess: carry the circuit board lift-launch workbench of circuit board etc. when the vibration magnetic head of the oscillators such as piezoelectric element of generation vibration and crimping engage when having the crimping joint.In addition, in order to heat the circuit board of lift-launch on circuit board lift-launch workbench, carry on the workbench at circuit board heater is set.And, give oscillator for the transfer of radiant heat of cutting off the circuit board lift-launch workbench that produces by heater heats, the coupling device with the thermal insulation upper shield member that covers the vibration magnetic head also obtains proposing (for example: refer to Patent Document 5).
By making the adhesive joint of thermoset insulating resin hot curing, the coupling device of the electronic unit that circuit board and electronic unit are connected and fixed, as disclosed in the patent documentation 3, the circuit board that carries circuit board when having the conveyance magnetic head of conveyance electronic unit on circuit board and adhesive joint carries workbench.In addition, the heater that the insulating resin hot curing is used is set at the conveyance magnetic head and circuit board carries on the workbench.
[patent documentation 1] spy opens the 2005-32944 communique
[patent documentation 2] spy opens the 2004-95747 communique
[patent documentation 3] spy opens the 2001-351949 communique
[patent documentation 4] spy opens the 2003-211677 communique
No. 3475802 communique of [patent documentation 5] special permission
Summary of the invention
Invent problem to be solved
By making the adhesive joint of thermoset insulating resin hot curing, be connected and fixed the method for circuit board and electronic unit, owing to utilize insulating resin adhesive joint circuit board and electronic unit, therefore have the advantage of guaranteeing bond strength easily.But, this method that is connected and fixed, if with the contact-making surface of portion of terminal electrode in contact portion, perhaps with on the contact-making surface of the contacted portion of terminal of electrode part form oxide-film or have dirt, then can produce the conducting problem of unstable of portion of terminal and electrode part.In addition, utilize vibration crimping splice terminal portion and electrode part, the method that circuit board and electronic unit are connected and fixed, owing to can remove the oxide-film or the dirt of contact-making surface, therefore can not produce the portion of terminal that causes by oxide-film or dirt and the unsettled situation of conducting of electrode part in the initial stage of vibration.But in this method, circuit board and electronic unit are only implemented crimping at the pressure contact portion place of portion of terminal and electrode part and are engaged.Therefore, be easy to produce the problem that fully to guarantee the bond strength of circuit board and electronic unit.In addition, its result also can produce the conducting problem of unstable of portion of terminal and electrode part.
Therefore, problem of the present invention is to provide a kind of can make the conducting of portion of terminal and electrode part stable, and can guarantee the concrete structure of coupling device of the electronic unit of circuit board and electronic unit bond strength.
Solve the means of problem
In order to solve above-mentioned problem, the present invention is the coupling device of electronic unit that circuit board and electronic unit are connected and fixed, it is characterized in that, have: the portion of terminal that will be formed on the circuit board is carried out the vibration magnetic head that crimping engages with the electrode part that is formed on the electronic unit place, in order to make the thermoset insulating resin hot curing that is arranged on the circuit board, to be installed in the heater on the vibration magnetic head with the adhesive joint of carrying out circuit board and electronic unit, and be arranged on the heat insulating component between vibration magnetic head and the circuit board; Wherein, utilize vibration that portion of terminal and electrode part are carried out the crimping joint, simultaneously,, circuit board and electronic unit are carried out adhesive joint by insulating resin.
Coupling device of the present invention utilizes vibration crimping splice terminal portion and electrode part, simultaneously, by insulating resin circuit board and electronic unit is carried out adhesive joint.Therefore, can make the conducting of portion of terminal and electrode part stable, can guarantee the bond strength of circuit board and electronic unit simultaneously again.In addition, coupling device of the present invention has the heat insulating component that is arranged between vibration magnetic head and the circuit board.Therefore, before portion of terminal and electrode part crimping engage, prevent owing to be installed in the possibility that is solidified into that the heat effects of the heater at vibration magnetic head place makes the thermoset insulating resin that is arranged on the circuit board.Thereby, can be because of the influence of the insulating resin that has solidified, the crimping of overslaugh portion of terminal and electrode part engages, can be formed at the contact-making surface of portion of terminal electrode in contact portion or with the contact-making surface of the contacted portion of terminal of electrode part on oxide-film or the state that is eliminated of dirt under, portion of terminal and electrode part are engaged.Consequently, can make the conducting of portion of terminal and electrode part stable.In addition, behind portion of terminal and electrode part crimping joint, can insulating resin be solidified, make circuit board and electronic unit adhesive joint by being installed in the heat of the heater that vibrates the magnetic head place.Therefore, can guarantee the bond strength of circuit board and electronic unit, can make the conducting of portion of terminal and electrode part stable.That is, coupling device of the present invention can suitably utilize vibration crimping splice terminal portion and electrode part, simultaneously, utilizes the thermoset insulating resin that is arranged on the circuit board, with circuit board and electronic unit adhesive joint.
In addition, in this specification, " crimping joint " be meant, on one side electrode part is contacted, pressurizes with portion of terminal, one side applies the vibration of ultrasonic vibration etc., and portion of terminal and electrode part are connected and fixed.
In addition, in order to solve above-mentioned problem, the present invention is the coupling device of electronic unit that circuit board and electronic unit are connected and fixed, it is characterized in that, have: the portion of terminal that will be formed on the circuit board is carried out the vibration magnetic head that crimping engages with the electrode part that is formed on the electronic unit place, in order to make the thermoset insulating resin hot curing that is arranged on the circuit board, to be installed in the heater on the vibration magnetic head with the adhesive joint of carrying out circuit board and electronic unit, and the heat insulating component that prevents the insulating resin hot curing before portion of terminal and electrode part crimping engage; Wherein, utilize vibration that portion of terminal and electrode part are carried out the crimping joint, simultaneously, circuit board and electronic unit are carried out adhesive joint by insulating resin.
Coupling device of the present invention utilizes vibration crimping splice terminal portion and electrode part, simultaneously, by insulating resin circuit board and electronic unit is carried out adhesive joint.Therefore, can make the conducting of portion of terminal and electrode part stable, can guarantee the bond strength of circuit board and electronic unit simultaneously again.In addition, coupling device of the present invention has the heat insulating component that portion of terminal of preventing and electrode part crimping engage preceding insulating resin hot curing.Therefore, before portion of terminal and electrode part crimping joint, can prevent because the heat effects of heater is solidified the thermoset insulating resin that is arranged on the circuit board.Thereby, can be because of the influence of the insulating resin that has solidified, the crimping of overslaugh portion of terminal and electrode part engages, can removing be formed on the contact-making surface of portion of terminal electrode in contact portion or with the contact-making surface of the contacted portion of terminal of electrode part on oxide-film or the state of dirt under, portion of terminal and electrode part are engaged.Consequently, can make the conducting of portion of terminal and electrode part stable.In addition, after portion of terminal and electrode part crimping engage, can utilize heater that insulating resin is solidified, make circuit board and electronic unit adhesive joint.Therefore, can guarantee the bond strength of circuit board and electronic unit, can make the conducting of portion of terminal and electrode part stable.That is, coupling device of the present invention can suitably utilize vibration crimping splice terminal portion and electrode part, simultaneously, utilizes the thermoset insulating resin that is arranged on the circuit board, and circuit board and electronic unit are connected and fixed.
Among the present invention, be formed long chi shape with circuit board, simultaneously, portion of terminal engages with the crimping of electrode part and the adhesive joint of circuit board and electronic unit is, with the foregoing circuit plate after carrying out conveyance as the regulation conveyance direction of a direction of foregoing circuit plate long side direction, circuit board is in implement under the halted state; The vibration magnetic head has when the crimping of portion of terminal and electrode part engages, and keeps the parts maintaining part of electronic unit; The more upstream side than the parts maintaining part that heat insulating component only is arranged on the conveyance direction is good.If heat insulating component is arranged on the circuit board conveyance direction more upstream side than the parts maintaining part, then before portion of terminal and electrode part crimping engage, can prevent the curing of thermoset insulating resin.Therefore, constitute like this, can prevent the curing of the insulating resin before crimping engages, and can after crimping engages, insulating resin be solidified rapidly.In addition, can seek simplifying the structure of coupling device.
Among the present invention, heat insulating component supports that to be installed in the magnetic head support member place of vibration magnetic head is good.Constitute like this, then can get rid of the influence of heat insulating component the vibration of vibration magnetic head.Promptly, if heat insulating component is installed in vibration magnetic head place, will make the vibration change of vibration magnetic head from the influence of heat insulating component, still, if heat insulating component is installed in magnetic head support member place, then can not make the vibration change of vibration magnetic head from the influence of heat insulating component.Therefore, utilize the vibration magnetic head that suitable vibration can take place.
Among the present invention, be that gluey state is good with the state before the insulating resin hot curing.Constitute like this, before then crimping engages, portion of terminal and electrode part are engaged easily.Therefore, can implement the crimping joint of portion of terminal and electrode part reliably.Consequently, can make the conducting of portion of terminal and electrode part stable more reliably.
The effect of invention
As described above described, the coupling device of the electronic unit that the present invention relates to can make portion of terminal and electrode part conducting stable, and can guarantee the bond strength of circuit board and electronic unit.
Description of drawings
Fig. 1 is the side view of major part overview structure of coupling device of the electronic unit of the invention process form.
Fig. 2 is the major part overview structure chart of the coupling device represented from Fig. 1 arrow directions X.
Fig. 3 is the major part overview structure chart from the coupling device of Fig. 1 arrow Y direction indication.
Fig. 4 is the key diagram of using from the board state of the electronic unit joint front and back of top explanation the invention process form.
Fig. 5 is the figure that is used to illustrate the engagement state of the circuit board of the invention process form and electronic unit.
Fig. 6 is the stereogram of the head side heater of the invention process form.
Fig. 7 is the part amplification profile that the Z of Fig. 3 is partly amplified expression.
Fig. 8 is the part amplification profile of the W-W section of Fig. 7.
Fig. 9 is the stereogram of the head side heater of other examples of the present invention.
Figure 10 is the part amplification profile that the periphery of the head side heater of other examples of the present invention constitutes.
Symbol description
1 coupling device
2 COF are with (circuit board)
3 portion of terminal
4 IC chips (electronic unit)
5 electrode part
6 insulating resins
7 vibration magnetic heads
8,58 head side heaters (heater)
9 heat insulating components
14 pressure contact portions
14b adsorption plane (parts maintaining part)
16 magnetic head support member
V conveyance direction
Concrete example
Below, describe being used to implement optimal morphology of the present invention with reference to the accompanying drawings.
Fig. 1 is the side view of major part overview structure of coupling device 1 of the electronic unit of the invention process form.Fig. 2 is the major part overview structure chart along the coupling device 1 of Fig. 1 arrow directions X.Fig. 3 is the major part overview structure chart along the coupling device 1 of Fig. 1 arrow Y direction.Fig. 4 is the key diagram of using from circuit board 2 states of the electronic unit 4 joint front and back of top explanation the invention process form.Fig. 5 is used to illustrate the circuit board 2 of the invention process form and the figure of the engagement state of electronic unit 4.Fig. 6 is the stereogram of the head side heater 8 of the invention process form.Fig. 7 amplifies the part amplification profile of representing with the Z portion of Fig. 3.Fig. 8 is the part amplification profile of the W-W section of presentation graphs 7.
(formation of the coupling device of electronic unit)
The coupling device 1 of the electronic unit of this form, as shown in Figure 4 and Figure 5, the portion of terminal 3 of utilizing ultrasonic vibration will be formed on the circuit board 2 engages with electrode part 5 crimping that are formed on electronic unit 4 places, simultaneously behind portion of terminal 3 and electrode part 5 crimping joint, further by being arranged on the heat cured insulating resin 6 on the circuit board 2, with circuit board 2 and electronic unit 4 adhesive joint.Such coupling device 1, as shown in Figure 1 to Figure 3, have portion of terminal 3 and electrode part 5 are carried out the vibration magnetic head 7 that crimping engages, thereby carry out the adhesive joint of circuit board 2 and electronic unit 4 in order to make insulating resin 6 hot curings, and be installed in the head side heater 8 that vibrates magnetic head 7 places, and be arranged on the heat insulating component 9 between circuit board 2 and the vibration magnetic head 7.In addition, coupling device 1 as shown in figures 1 and 3, has the circuit board that is arranged on circuit board 2 belows and carries workbench 10.
The circuit board 2 of this form is meant that the COF (Chip On Film orChip On Flexible Circuit Board) of flexible resin(a) circuit board is with.Therefore, hereinafter, circuit board 2 is recited as COF is with 2.In addition, the electronic unit 4 of this form is meant the IC chip.Therefore, hereinafter, electronic unit 4 is recited as IC chip 4.
COF is with 2, as shown in Figure 4, forms long chi shape.More particularly, COF is with 2, and (illustrated left and right directions) is interconnected to form long chi shape by a plurality of circuit board wafer 2a on its long side direction.On the surface of each circuit board wafer 2a, as shown in Figure 5, be pre-formed the wiring figure 2b of regulation.In addition, on the surface of each circuit board wafer 2a, with 2 and the front operation of the joint operation of IC chip 4, portion of terminal 3 and insulating resin 6 are set by COF.That is, the COF before crimping engages is with on 2, with the spacing P of regulation, portion of terminal 3 and insulating resin 6 is set on long side direction.Portion of terminal 3 with wiring figure 2b conducting state, be arranged on each circuit board wafer 2a.In addition, in Fig. 4 and Fig. 5, for the notion of portion of terminal 3 is described, portion of terminal 3 is illustrated roughly, but in fact, dozens of is set at the surface of each circuit board wafer 2a than illustrated littler portion of terminal 3, again, also has the portion of terminal 3 that will surpass hundred to be arranged on the surface of each circuit board wafer 2a.
Portion of terminal 3 engage with the crimping of electrode part 5 and the COF by insulating resin 6 with the adhesive joint of 2 (circuit board wafer 2a) with IC chip 4, be with COF with 2 to as the COF of the conveyance direction V (illustrated right-hand) of regulation with a direction of 2 long side directions, only P partly carries out conveyance at interval, the state that stops implements.Carry out this conveyance repeatedly and stop, making COF with 2 and the joint (being connected and fixed) of IC chip 4 continuously carry out.That is, portion of terminal 3 engage with the crimping of electrode part 5 and COF with 2 with the adhesive joint of IC chip 4, be to conveyance direction V, after only the P part is with 2 with regard to conveyance COF at interval, when it is stopped, implementing.Each circuit board wafer 2a, the regulation operation that process IC chip 4 is connected after fixing, 2c is separated by separated part.In addition, as shown in Figure 4, distolateral up and down at COF respectively with 2 diagram, with predetermined distance on long side direction, forms a plurality of, be used for being meshed with the engagement projections part (diagram omission) of circuit board conveyance structure, with COF with 2 engaging hole 2d to conveyance direction V conveyance.More particularly, in spacing P, for example, 5 engaging hole 2d are set equally spaced.In addition, in Fig. 4, for convenience, only added symbol at the circuit board wafer 2a of a part, the separated part 2c of a part and the engaging hole 2d place of a part.
The insulating resin 6 of this form is meant that the state before the hot curing is the NCP of pasty state.That is, insulating resin 6, after the crimping of portion of terminal 3 and electrode part 5 engages, utilize the heat of head side heater 8 to carry out hot curing before, be pasty state.
Vibration magnetic head 7 constitutes, and ultrasonic vibration takes place portion of terminal 3 and electrode part 7 are carried out the crimping joint.This vibration magnetic head 7 possesses: have the vibration generating unit 12 of ticker (diagram is omitted) that the piezoelectric element etc. in source takes place as ultrasonic vibration, the vibration enlarging section 13 that the vibrating electrode arm that is amplified by the ultrasonic vibration that vibration generating unit 12 is taken place constitutes, be fixed in vibration enlarging section 13, make portion of terminal 3 and electrode part 5 carry out the pressure contact portion 14 of crimping, and be fixed in vibration enlarging section 13, when the vibration of vibration magnetic head 7 with the sliding component described later 20 flat rectangular-shaped sliding parts 15 of slips mutually.
Adsorption hole 14a is configured to rectilinear form on the direction (above-below direction of Fig. 2) that intersects vertically with 2 conveyance direction V with COF, and adjoin each other form a plurality of.Adsorption plane 14b is formed with the above-below direction of Fig. 2 oblong-shaped as long side direction, and the width of its long side direction is roughly the same with the above-below direction width of Fig. 2 of vibration enlarging section 13.The 1st drop face 14c is also identical with adsorption plane 14b, is formed with the above-below direction of Fig. 2 oblong-shaped as long side direction, and the width of its long side direction is roughly the same with the above-below direction width of Fig. 2 of vibration enlarging section 13.The 2nd drop face 14d is formed with the above-below direction of Fig. 2 oblong-shaped as long side direction, and the width of its long side direction is narrower than the above-below direction width of Fig. 2 of vibration enlarging section 13.In addition, the width of the short side direction of the 1st drop face 14c is narrower than the width of the short side direction of adsorption plane 14b.In addition, the width of the short side direction of the 2nd drop face 14d is wideer slightly than the width of the short side direction of adsorption plane 14b.
Vibration magnetic head 7 is supported by magnetic head support member 16.More particularly, vibration magnetic head 7 as shown in figures 1 and 3, is supported by magnetic head support member 16 by heat insulating component 17, installation component 18 and two dividing plates 19.
Magnetic head support member 16 shown in Fig. 1 waits, forms the writing board shape of rectangle by stainless steel and other metal materials, is set to be parallel to each other with 2 surface with COF.This magnetic head support member 16 is connected to omits illustrated driving mechanism, can move on the vertical direction of above-below direction, left and right directions and the paper of Fig. 1.That is, the vibration magnetic head of being supported by magnetic head support member 16 7 can move on the vertical direction of above-below direction, left and right directions and the paper of Fig. 1.In addition, above the diagram of magnetic head support member 16, the air of cooling usefulness is circulated other parts of the driving mechanism that heat that vibration magnetic head 7 sides take place is not delivered to connect magnetic head support member 16 etc.
Heat insulating component 17 is formed the writing board shape of rectangle by the machinable ceramic of highly processable.For example, the heat insulating component 17 of this form is formed by mica ceramics.In order to prevent that the heat that head side heater 8 produces from transmitting to magnetic head support member 16, this heat insulating component 17 is fixed on below the diagram of magnetic head support member 16.
As shown in figures 1 and 3, the upper end of two dividing plates 19 be set at respectively installation component 18 among Fig. 1 about two directions distolateral, and be arranged in the approximate centre position of the left and right directions of Fig. 3 installation component 18.In addition, vibration enlarging section 13 is installed in the lower end of two dividing plates 19.More particularly, vibration enlarging section 13 is installed in the lower end of two dividing plates 19, makes the approximate centre position on the left and right directions of approximate centre position and Fig. 1 of installation component 18 on the left and right directions of Fig. 1 of vibration enlarging section 13 consistent substantially.
In addition, the approximate centre position that the writing board shape of rectangle, the sliding component 20 that possesses the lubricated face with lubrification are fixed on the lower surface of installation component 18 will be formed.This sliding component 20 contacts with the upper surface of the sliding part 15 of vibration magnetic head 7, slides mutually with sliding part 15 during 7 vibrations of vibration magnetic head.
Here, on the long side direction of vibration magnetic head 7, the part that is provided with two dividing plates 19 becomes the part that the amplitude that vibrates magnetic head 7 is roughly zero what is called joint respectively.In addition, on the long side direction of vibration magnetic head 7, the part (that is the part of sliding part 15 and sliding component 20, is set) that is provided with pressure contact portion 14 becomes the part of the so-called antinode of the amplitude maximum of vibrating magnetic head 7.Therefore, even 7 vibrations of vibration magnetic head, the installation component 18 that is separately installed with two dividing plate 19 upper ends vibrates hardly.In addition, as the sliding part 15 of amplitude maximum of vibration magnetic head 7 and the contact portion of sliding component 20, when vibration magnetic head 7 vibrated, sliding part 15 and sliding component 20 can slide stably.
On each heater retaining member 21, shown in Fig. 3 and Fig. 7 etc.,, form two from the recessed laterally maintenance space 21c of the medial surface of heater retaining member 21 in order to keep head side heater 8.Forming these two parts that keep space 21c, be separately installed with the spring retaining member 22 cylindraceous that keeps compression helical spring 23, compression helical spring 23 is as the loaded members that head side heater 8 is carried on the vibration enlarging section 13.In interior all sides of this spring retaining member 22, compression helical spring 23 is held with the state of compression, and compression helical spring 23 is carried in vibration 13 places, enlarging section with head side heater 8.
Around head side heater 8, be provided with buffer component 25.More particularly, as shown in Figure 7 and Figure 8, by being the aluminium foil 26 of paper tinsel shape metal material and the buffer component 25 that constitutes for the polyimide film of film like insulating material (polyimides band) 27, be wrapped in head side heater 8 around.As shown in Figure 7, aluminium foil 26 winds with one circuit half in a clockwise direction in the periphery of head side heater 8, and polyimide film 27 is in the periphery of aluminium foil 26, counterclockwise to wind with one circuit half.And, as shown in Figure 7, and the medial surface (left surface of Fig. 7) and vibration enlarging section 13 of vibration enlarging section 13 contacted head side heaters 8 between, aluminium foil 26 and polyimide film 27 are provided with two-layer respectively.
As shown in Figure 8, aluminium foil 26 is wound in the periphery of head side heater 8, so that one end (being right-hand member among Fig. 8) is roughly consistent with the end face that is connected with lead 24 of head side heater 8.In addition, polyimide film 27 is wrapped in the periphery of aluminium foil 26, so that one end (being right-hand member among Fig. 8) is more outstanding to the diagram right side than the end face that is connected with lead 24 of head side heater 8, will cover the leading section 24a of lead 24 at least.Like this, polyimide film 27, can and vibration enlarging section 13 contacted head side heaters 8 and vibration bring into play cushioning effect between the enlarging section 13, simultaneously, also can bring into play the insulating effect that head side heater 8 and vibration magnetic head 7 is carried out electric insulation.
Here, because constitute buffer component 25 by aluminium foil 26 and polyimide film 27, so, can keep the buffering effect of buffer component 25 for more time.That is, compare with polyimide film 27, aluminium foil 26 can be kept buffering effect for more time, compares with the situation that only constitutes buffer component 25 by polyimide film 27, by using aluminium foil 26, can keep the buffering effect of buffer component 25 for more time.In addition, in this form, it is the periphery that aluminium foil 26 is wrapped in head side heater 8, polyimide film 27 is wrapped in that the periphery of aluminium foil 26 constitutes, but, also can be the periphery that polyimide film 27 is wrapped in head side heater 8, the periphery that aluminium foil 26 is wrapped in polyimide film 27 constitutes.In addition, substitute aluminium foil 26, also can use Copper Foil, silver foil or goldleaf to constitute buffer component 25, substitute polyimide film 27, also can use the polyether-ketone film to constitute buffer component 25.
In addition, at the state that heater retaining member 21 is fixed on installation component 18, compression helical spring 23 contacts with the central part of head side heater 8, and head side heater 8 is carried in vibration 13 places, enlarging section, head side heater 8 contacts with vibration magnetic head 7 by buffer component 25.That is, heater retaining member 21 at the active force that utilizes compression helical spring 23, makes head side heater 8 and vibrates under the magnetic head 7 contacted states by buffer component 25, is set at two side 13b, 13c of vibration enlarging section 13.By constituting in this wise, even in order to make insulating resin 6 hot curings, head side heater 8 is installed in the so-called antinode portions of vibrating magnetic head 7 divides on the approaching position, also can suppress the phenomenon that influence owing to head side heater 8 causes vibrating the ultrasonic vibration disorder of magnetic head 7.In addition, the ultrasonic vibration that vibration magnetic head 7 takes place is relaxed to the transmission of head side heater 8, and the deterioration of head side heater 8 is prevented from.
Heat insulating component 9 is provided with in order to prevent insulating resin 6 hot curings before portion of terminal 3 and electrode part 5 crimping engage.This heat insulating component 9 is by the influence of the heat by head side heater 8 and the inorganic material that does not produce dust forms writing board shape.For example, heat insulating component 9, the material that forms by the thin plate of heat of immersion thermosetting resin being carried out the heating of stacked back, pressurization in reinforcing materials such as glass fibre is perhaps sneaked into inorganic bond material in the short fiber reinforcing material, go forward side by side the horizontal high voltage punching press and the material that forms waits and forms.
Heat insulating component 9 is installed on the magnetic head support member 16.In this form, shown in Fig. 1 waited, heat insulating component 9 paralleled with 2 surface for making its surface and COF, is installed in dividing plate 31 places of two columns that are fixed in magnetic head support member 16.In addition, shown in Fig. 1 waited, heat insulating component 9 on conveyance direction V, only was arranged on the upstream side more than adsorption plane 14b.More particularly, an end face (right side among Fig. 1) 9a of configuration heat insulating component 9, make its upstream side adjacent with the 1st drop face 14c that forms at adsorption plane 14b upstream side, and another end face of heat insulating component 9 (left side among Fig. 1) 9b side upper surface is nearby fixed by two dividing plates 31.In addition, as shown in Figure 1, on conveyance direction V, be provided with heat insulating component 9, make the other end 9b of heat insulating component 9 be in more upstream side (diagram left side) than the upstream side end face (diagram left end) of heater retaining member 21.
And then heat insulating component 9 is configured to, and the upper surface of an one end face 9a side is relative with the 2nd drop face 14d of pressure contact portion 14, and on illustrated above-below direction, and the lower surface 9c of heat insulating component among Fig. 19 is in the upside more than adsorption plane 14b.By constituting in this wise, when portion of terminal 3 and electrode part 5 crimping engage, be arranged on COF by the front operation and can not interfere mutually with heat insulating component 9 with portion of terminal 3 and insulating resin 6 on 2.
In addition, as shown in Figure 2, heat insulating component 9 is formed, and the width of the above-below direction of its Fig. 2 is greater than the width of the above-below direction of vibration enlarging section 13.And heat insulating component 9 is set to, and makes the overhang from the 13c from the side of the overhang of the side 13b of vibration enlarging section 13 and diagram below of diagram top roughly the same.In addition, as shown in Figure 2, owing to and omit relation between illustrated other structures, the width of the diagram above-below direction of heat insulating component 9 is less than the diagram upper surface of the heater retaining member 21 of the diagram upside that is installed in vibration enlarging section 13 be installed in distance between the diagram lower surface of heater retaining member 21 of diagram downside of vibration enlarging section 13.But, in order to prevent that more effectively the insulating resin 6 before portion of terminal 3 and electrode part 5 engage from solidifying, make the width of the diagram above-below direction of heat insulating component 9 with formation, greater than the diagram upper surface of the heater retaining member 21 of the diagram upside that is installed in vibration enlarging section 13 and the heat insulating component 9 that is installed in distance between the diagram lower surface of heater retaining member 21 of diagram downside of vibration enlarging section 13 for good.
Dividing plate 31 forms the hexagon prism shape by metal materials such as SUS stainless steel or brass.Two dividing plates 31, the interval that (that is, the above-below direction of Fig. 2) vacates regulation on the paper vertical direction of Fig. 1 is parallel to each other, and, adjacent with two side 13b, 13c of vibration enlarging section 13, be fixed on the magnetic head support member 16.In addition, two dividing plates 31 are fixed in magnetic head support member 16 at the upstream side of heater retaining member 21 on conveyance direction V.
Circuit board carries workbench 10, when portion of terminal 3 and electrode part 5 crimping engage, possesses: have and carry COF with the lift-launch anchor clamps 32 of 2 lift-launch face 32a and the workbench side heater 33 that anchor clamps 32 are carried in heating.At the upstream side of the lift-launch anchor clamps 32 of conveyance direction V, form from carrying face 32a upstream side and the inclined plane 32b that tilts to the below of Fig. 1.In addition, circuit board carries workbench 10 and has the illustrated driving mechanism of omission, and circuit board carries workbench 10 and can move on the above-below direction of Fig. 1.
(method that is connected and fixed of COF band and IC chip)
In the coupling device 1 that constitutes as described above, as described below, carry out COF with 2 and being connected and fixed of IC chip 4.
At first, at the upstream side of vibration magnetic head 7, insulating resin 6 by embedding (coating) COF with 2 portion of terminal 3 around.By the part of embedding, utilize and omit illustrated circuit board transport mechanism, by repeatedly COF being with 2 conveyances, stopping, being arrived assigned position by conveyance.That is, on conveyance direction V, COF is with 2 to be arrived by conveyance, is formed at the position of the electrode part 5 on the IC chip 4 that is kept by 7 absorption of vibration magnetic head and is formed on COF roughly to be in consistent location with the portion of terminal 3 on 2.And conveyance COF was with 2 o'clock, and vibration magnetic head 7 is in the state that has risen, and carried anchor clamps 32 and be in the state that has descended, thereby can not hinder COF with 2 conveyance.After this, carry anchor clamps 32 and rise, COF is with 2 to be equipped on the lift-launch face 32a.In addition, use to omit illustrated camera combination, carry out COF with 2 contraposition.
On the other hand, vibration magnetic head 7 keeps IC chip 4 in advance at adsorption plane 14b place.More particularly, omit illustrated turning device and from omit the illustrated accurate semiconductor die sheet material of cutting off, take out an IC chip 4, make in the table of this IC chip 4 and overturn, simultaneously, with the adsorption plane 14b of IC chip 4 conveyances to vibration magnetic head 7.And vibration magnetic head 7 by utilizing adsorption plane 14b absorption IC chip 4, receives IC chip 4 from turning device, and IC chip 4 is remained on adsorption plane 14b place.Under this state, the words that COF finishes with 2 contraposition, vibration magnetic head 7 descends, the electrode part 5 that will remain on the IC chip 4 of adsorption plane 14b on one side contacts, pressurizes with portion of terminal 3, contact site to portion of terminal 3 and electrode part 5 applies ultrasonic vibration on one side, and portion of terminal 3 and electrode part 5 are carried out the crimping joint.When this crimping engaged, the frequency of the ultrasonic vibration that the contact site of portion of terminal 3 and electrode part 5 is applied was, for example, and 10kHz～60kHz.
When portion of terminal 3 engages with electrode part 5 crimping, be delivered to COF with the insulating resin 6 on 2 by IC chip 4 by the heat of the vibration magnetic head 7 of head side heater 8 heating.In addition, the heat of head side heater 8 is delivered to COF with the insulating resin 6 on 2 as radiant heat.And, after the crimping of portion of terminal 3 and electrode part 5 engages and finishes, insulating resin 6 beginning hot curings, COF is with 2 and the insulating resin 6 bonded joints of IC chip 4 by hot curing.By insulating resin 6, COF is with 2 and IC chip 4 bonded joints, then COF with 2 and IC chip 4 be connected and fixed end.In addition, the heat curing temperature of insulating resin 6 is, for example, and 150 ℃～200 ℃.
COF with 2 and IC chip 4 be connected and fixed finish after, the vibration magnetic head 7 that then rises perhaps descends and carries anchor clamps 32.And, COF is with 2 only conveyance prescribed distance P, just with similarly above-mentioned, carry out COF with 2 and being connected and fixed of next IC chip 4.
(the main effect of this form)
As described above, the coupling device 1 of this form has and is arranged on vibration magnetic head 7 and COF with the heat insulating component 9 between 2.That is the heat insulating component 9 that, has insulating resin 6 hot curings before portion of terminal of preventing 3 and electrode part 5 crimping engage.Therefore, before portion of terminal 3 and electrode part 5 crimping joint, can prevent because the influence of the heat of head side heater 8 makes thermoset insulating resin 6 that the phenomenon of solidifying take place.Thereby, can be because of the influence of the insulating resin 6 that has solidified, the crimping of overslaugh portion of terminal 3 and electrode part 5 engages, can be to be formed on the contact-making surface with portion of terminal 3 electrode in contact portions 5, perhaps with the contact-making surface of electrode part 5 contacted portion of terminal 3 on oxide-film or the state that is eliminated of dirt, portion of terminal 3 and electrode part 5 crimping are engaged.Consequently, can make the conducting of portion of terminal 3 and electrode part 5 stable.In addition, after portion of terminal 3 and electrode part 5 crimping engage, insulating resin 6 is solidified, make COF be with 2 and IC chip 4 adhesive joint.Therefore, can guarantee that COF with 2 and the bond strength of IC chip 4, can make the conducting of portion of terminal 3 and electrode part 5 stable.That is, the coupling device 1 of this form can suitably utilize ultrasonic vibration crimping splice terminal portion 3 and electrode part 5, simultaneously, utilize to be arranged on COF with the thermoset insulating resin 6 on 2, with COF be with 2 and IC chip 4 carry out adhesive joint.
Here, for example, shown in the coupling device of putting down in writing in the above-mentioned patent documentation 3, only by making the adhesive joint of thermoset insulating resin hot curing, in the coupling device that circuit board and electronic component are connected and fixed, the adsorption plane of the electronic unit of the conveyance magnetic head of conveyance electronic unit is identical with the area size degree of electronic unit.Therefore, even because heater, the conveyance magnetic head is heated, and the heat of conveyance magnetic head also can not make the insulating resin generation hot curing of upstream side.Relative therewith, constitute the vibration enlarging section 13 of the vibration magnetic head 7 of this form, for the vibration deterioration that vibration generating unit 12 is taken place, form long elongated rectangular shape on 2 long side direction at COF.Therefore, big with the relative COF of bottom surface 13a of vibration enlarging section 13 with 2 relative area, and crimping is difficult to guarantee to vibrate the bottom surface 13a of enlarging section 13 and COF with the distance between 2 when engaging.Thereby, under the influence of the heat that vibrates magnetic head 7, make the insulating resin 6 before portion of terminal 3 and electrode part 5 crimping engage that hot curings take place easily.But, because the coupling device 1 of this form has the heat insulating component 9 of insulating resin 6 hot curings before portion of terminal of preventing 3 and the electrode part 5 crimping joint, therefore, before portion of terminal 3 and electrode part 5 crimping joint, prevent on one side because the influence of the heat of head side heater 8 is solidified heat cured insulating resin 6, Yi Bian the situation that makes portion of terminal 3 and electrode part 5 carry out the crimping joint becomes possibility.
In this form, heat insulating component 9 only is arranged on conveyance direction V and goes up the upstream side more than adsorption plane 14b.Therefore, with heat insulating component 9 also be set at conveyance direction V go up than adsorption plane 14b more the situation in downstream compare, can not only prevent that the insulating resin 6 before portion of terminal 3 and electrode part 5 crimping engage from solidifying, and also can solidify insulating resin 6 rapidly simultaneously after crimping engages.In addition, can make simplifying the structure of coupling device 1.
In this form, heat insulating component 9 is installed in magnetic head support member 16 places that support vibration magnetic head 7 by dividing plate 31.Therefore, can get rid of the influence that heat insulating component 9 brings the vibration of vibration magnetic head 7.That is, if heat insulating component 9 is installed in vibration magnetic head 7 places, then because the influence of heat insulating component 9, the vibration of vibration magnetic head 7 produces change, and if adopt the structure of this form, can not make the vibration of vibration magnetic head 7 produce change from the influence of heat insulating component 9.Therefore, can use vibration magnetic head 7 to produce suitable vibration.
In this form, heat insulating component 9, the material that can not produced dust by the heat effects that is subjected to head side heater 8 forms.Therefore, can prevent to cause the generation of the problems such as poor flow of portion of terminal 3 and electrode part 5 owing to the reason of dust.
In this form, insulating resin 6 is meant that the state before the hot curing is the NCP of pasty state.Therefore, crimping can make portion of terminal 3 and electrode part 5 engage easily before engaging.Thereby the crimping that can carry out portion of terminal 3 and electrode part 5 reliably engages, and can make the conducting of portion of terminal 3 and electrode part 5 stable more reliably.
(other example)
Above-mentioned form is example of suitable form of the present invention, but is not limited thereto, and can carry out various distortion in the scope of not changing main idea of the present invention.For example, in the above-mentioned form, the upper surface of the other end 9b side of heat insulating component 9 is fixed in two dividing plates 31.But, shown in the double dot dash line of Fig. 1, also can be to the other end 9b of the further prolong insulation member 9 of upstream side of conveyance direction V.In this case, for example, can form heat insulating component 9, make it and more the whole bottom surface 13a of the vibration enlarging section 13 of upstream side is relative than adsorption plane 14b.
In addition, in the above-mentioned form, heat insulating component 9 only is arranged on conveyance direction V and goes up the upstream side more than adsorption plane 14b.But, also heat insulating component can be arranged on downstream more than adsorption plane 14b.And then, more promptly carry out for the curing that makes the insulating resin 6 after crimping engages, also can more append the head side heater in the downstream than adsorption plane 14b.
And then in the above-mentioned form, insulating resin 6 is meant that the state before the hot curing is the NCP of pasty state, but insulating resin 6 also can be NCF (Non Conductive Film).And then also have, circuit board 2 is not defined as the flexible resin(a) circuit board, can be the circuit board of high rigidity such as pottery yet, and what be applicable to structure of the present invention can.In addition, be fastened on the electronic unit 4 of circuit board 2, be not defined as the IC chip, also can use surface acoustic wave device, other electronic unit such as resistive element.
And then also have, in the above-mentioned form, head side heater 8 is ceramic heaters, but replaces ceramic heater, can also use the head side heater 58 that is made of cartridge heater as shown in Figure 9.This head side heater 58, for example, maintain in the can of sheath shape under the state of heaters such as kuromore, the part of the encapsulation heater 59 by will being filled with the good high-purity inorganic insulation thing powder of heat conduction in its slit is imbedded flat rectangular-shaped aluminium flake 60 inside and is formed.From encapsulation heater 59, draw the lead 61 that is covered with dielectric film.
With above-mentioned homomorphosis, also can around this head side heater 58, as shown in figure 10, buffer component 65 be set.The lead 61 of drawing from encapsulation heater 59 is insulated film and coats, there is no need to use insulating material as buffer component 65, therefore, as buffer component 65, for example, can use the heat release thin plate of making by the method for utilizing the thermal decomposition macromolecule membrane to carry out carbonization with the high directionality graphite formation of constructing near single crystals.As the heat release thin plate of this buffer component 65, twined for 3 weeks half in the periphery of head side heater 58.In the form shown in Figure 10, and between medial surface of vibration enlarging section 13 contacted head side heaters 58 (face in left side among Figure 10) and the vibration enlarging section 13, be provided with 4 layers of heat release thin plate as buffer component 65.In addition, as buffer component 65, also can use as the aluminium foil of the metal material of paper tinsel shape or Copper Foil, silver foil, goldleaf etc.In addition, as buffer component 65, can also use the insulating material of film like such as polyimide film or polyether-ketone film.In addition, in Figure 10, for the formation of above-mentioned homomorphosis, additional identical symbol.
Claims (8)
1. the coupling device of an electronic unit is the device that is connected and fixed circuit board and electronic unit, it is characterized in that having:
The portion of terminal that is formed on the foregoing circuit plate is carried out the vibration magnetic head that crimping engages with the electrode part that is formed on above-mentioned electronic unit place,
In order to make the thermoset insulating resin hot curing that is arranged on the foregoing circuit plate, to be installed in the heater on the above-mentioned vibration magnetic head with the adhesive joint of carrying out foregoing circuit plate and above-mentioned electronic unit, and be arranged on the heat insulating component between above-mentioned vibration magnetic head and the foregoing circuit plate;
Wherein, utilize vibration that above-mentioned portion of terminal and above-mentioned electrode part are carried out the crimping joint, simultaneously,, foregoing circuit plate and above-mentioned electronic unit are carried out adhesive joint by above-mentioned insulating resin.
2. the coupling device of electronic unit as claimed in claim 1, it is characterized in that, described circuit board is formed long chi shape, simultaneously, described portion of terminal engages with the crimping of described electrode part and the adhesive joint of described circuit board and described electronic unit is, with the foregoing circuit plate after carrying out conveyance as the regulation conveyance direction of a direction of foregoing circuit plate long side direction, circuit board is in implement under the halted state;
Described vibration magnetic head has, and when the crimping of above-mentioned portion of terminal and above-mentioned electrode part engages, keeps the parts maintaining part of above-mentioned electronic unit,
Described heat insulating component only is arranged on more upstream side on the above-mentioned conveyance direction, more above-mentioned parts maintaining part.
3. the coupling device of electronic unit as claimed in claim 1 or 2 is characterized in that, described heat insulating component is installed on the magnetic head support member of supporting above-mentioned vibration magnetic head.
4. the coupling device of electronic unit as claimed in claim 1 or 2 is characterized in that, the state before the hot curing of described insulating resin is gluey state.
5. the coupling device of an electronic unit is the device that is connected and fixed circuit board and electronic unit, it is characterized in that having:
The portion of terminal that is formed on the foregoing circuit plate is carried out the vibration magnetic head that crimping engages with the electrode part that is formed on above-mentioned electronic unit place,
In order to make the thermoset insulating resin hot curing that is arranged on the foregoing circuit plate, to be installed in the heater on the above-mentioned vibration magnetic head with the adhesive joint of carrying out foregoing circuit plate and above-mentioned electronic unit, and, prevent that above-mentioned portion of terminal and above-mentioned electrode part crimping from engaging the heat insulating component of preceding above-mentioned insulating resin hot curing;
Wherein, utilize vibration that above-mentioned portion of terminal and above-mentioned electrode part are carried out the crimping joint, simultaneously,, foregoing circuit plate and above-mentioned electronic unit are carried out adhesive joint by above-mentioned insulating resin.
6. the coupling device of electronic unit as claimed in claim 5, it is characterized in that, described circuit board is formed long chi shape, simultaneously, described portion of terminal engages with the crimping of described electrode part and the adhesive joint of described circuit board and described electronic unit is, with the foregoing circuit plate after carrying out conveyance as the regulation conveyance direction of a direction of foregoing circuit plate long side direction, circuit board is in implement under the halted state;
Described vibration magnetic head has, and when the crimping of above-mentioned portion of terminal and above-mentioned electrode part engages, keeps the parts maintaining part of above-mentioned electronic unit,
Described heat insulating component only is arranged on more upstream side on the above-mentioned conveyance direction, more above-mentioned parts maintaining part.
7. as the coupling device of claim 5 or 6 described electronic units, it is characterized in that described heat insulating component is installed on the magnetic head support member of supporting above-mentioned vibration magnetic head.
8. as the coupling device of claim 5 or 6 described electronic units, it is characterized in that the state before the hot curing of described insulating resin is gluey state.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005147994A JP4681351B2 (en) | 2005-05-20 | 2005-05-20 | Electronic component joining equipment |
| JP2005147994 | 2005-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1866489A CN1866489A (en) | 2006-11-22 |
| CN100382268C true CN100382268C (en) | 2008-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100794923A Expired - Fee Related CN100382268C (en) | 2005-05-20 | 2006-05-09 | Electronic component joint device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4681351B2 (en) |
| KR (1) | KR100770569B1 (en) |
| CN (1) | CN100382268C (en) |
| TW (1) | TW200642023A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100861952B1 (en) * | 2007-04-02 | 2008-10-09 | 삼성전자주식회사 | Bonding device |
| TWI514489B (en) | 2013-05-23 | 2015-12-21 | Shinkawa Kk | Electronic part mounting apparatus and manufacturing method of electronic parts |
| TWI512856B (en) * | 2013-07-10 | 2015-12-11 | Shinkawa Kk | Bonding stage and manufacturing method thereof |
| JP6106320B2 (en) * | 2016-06-24 | 2017-03-29 | 東レエンジニアリング株式会社 | Mounting device |
| CN112858724A (en) * | 2021-04-13 | 2021-05-28 | 中国航空工业集团公司北京长城计量测试技术研究所 | Heat insulation test fixture for acceleration sensor temperature response calibration |
| TWI810887B (en) * | 2022-04-12 | 2023-08-01 | 南茂科技股份有限公司 | Inner lead bonding apparatus and inner lead bonding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300180A (en) * | 1999-11-24 | 2001-06-20 | 欧姆龙株式会社 | Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| JP2003282632A (en) * | 2002-03-27 | 2003-10-03 | Matsushita Electric Ind Co Ltd | Method and system for packaging electronic component |
| JP2004103896A (en) * | 2002-09-11 | 2004-04-02 | Matsushita Electric Ind Co Ltd | Electronic component packaging equipment and electronic component packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3133094B2 (en) * | 1991-04-23 | 2001-02-05 | 株式会社日立製作所 | TCP connection method for LCD and connection device therefor |
| WO1999001519A1 (en) * | 1997-07-04 | 1999-01-14 | Nippon Zeon Co., Ltd. | Adhesive for semiconductor components |
| MY120077A (en) * | 1998-06-26 | 2005-08-30 | Ibiden Co Ltd | Multilayer printed wiring board having a roughened inner conductor layer and production method thereof |
| JP3475802B2 (en) * | 1998-09-02 | 2003-12-10 | 松下電器産業株式会社 | Electronic component bonding equipment |
| JP2000133672A (en) | 1998-10-28 | 2000-05-12 | Seiko Epson Corp | Semiconductor device, its manufacture, circuit board, and electronic apparatus |
| JP2002151551A (en) * | 2000-11-10 | 2002-05-24 | Hitachi Ltd | Flip-chip mounting structure, semiconductor device therewith and mounting method |
| JP3721559B2 (en) * | 2002-03-28 | 2005-11-30 | 東レエンジニアリング株式会社 | Chip mounting method |
| JP3750639B2 (en) * | 2002-08-01 | 2006-03-01 | 松下電器産業株式会社 | Electronic component bonding apparatus and bonding tool |
| JP2006324579A (en) * | 2005-05-20 | 2006-11-30 | Athlete Fa Kk | Electronic component bonding device |
| JP4668683B2 (en) * | 2005-05-20 | 2011-04-13 | アスリートＦａ株式会社 | Joining head cleaning device and electronic component joining device |
| JP4733441B2 (en) * | 2005-06-27 | 2011-07-27 | アスリートＦａ株式会社 | Electronic component joining equipment |
-
2005
- 2005-05-20 JP JP2005147994A patent/JP4681351B2/en not_active Expired - Fee Related
-
2006
- 2006-04-25 KR KR1020060037042A patent/KR100770569B1/en not_active IP Right Cessation
- 2006-05-09 CN CNB2006100794923A patent/CN100382268C/en not_active Expired - Fee Related
- 2006-05-16 TW TW095117232A patent/TW200642023A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300180A (en) * | 1999-11-24 | 2001-06-20 | 欧姆龙株式会社 | Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| JP2003282632A (en) * | 2002-03-27 | 2003-10-03 | Matsushita Electric Ind Co Ltd | Method and system for packaging electronic component |
| JP2004103896A (en) * | 2002-09-11 | 2004-04-02 | Matsushita Electric Ind Co Ltd | Electronic component packaging equipment and electronic component packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI300603B (en) | 2008-09-01 |
| JP4681351B2 (en) | 2011-05-11 |
| KR20060120407A (en) | 2006-11-27 |
| CN1866489A (en) | 2006-11-22 |
| JP2006324581A (en) | 2006-11-30 |
| TW200642023A (en) | 2006-12-01 |
| KR100770569B1 (en) | 2007-10-29 |
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