TW201007863A - Device and method for joining parts together - Google Patents

Device and method for joining parts together Download PDF

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Publication number
TW201007863A
TW201007863A TW098118911A TW98118911A TW201007863A TW 201007863 A TW201007863 A TW 201007863A TW 098118911 A TW098118911 A TW 098118911A TW 98118911 A TW98118911 A TW 98118911A TW 201007863 A TW201007863 A TW 201007863A
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Taiwan
Prior art keywords
component
tcp
substrate
metal terminal
tool
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TW098118911A
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Chinese (zh)
Inventor
Masahiro Suzuki
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Shibaura Mechatronics Corp
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Publication of TW201007863A publication Critical patent/TW201007863A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A device for joining parts together is provided with a backup tool (6) for supporting a portion at which metal terminals of both a substrate (3) and a TCP (5) are opposed to and superposed on each other, a pressing tool (7) mounted above the backup tool so as to be able to be driven in the vertical direction, receiving ultrasonic vibration from an ultrasonic vibrator (13), and driven downward to press the substrate and the TCP, which are superposed on each other, to join the metal terminals together by the ultrasonic vibration, and a sheet-like member (25) mounted between the pressing tool and the combination of the substrate and the TCP, which are superposed on each other, and consisting of a material for transmitting the ultrasonic vibration, which is applied to the pressing tool when the pressing tool joins together the metal terminals of both the substrate and the TCP, to the substrate and the TCP.

Description

201007863 六、發明說明： 【發明所屬之技術領域】 發明領域 本發月係種金屬端子連接的零件之接合裝置及接合 方法’係關於利用超音波振動將第1零件之金屬端子與第2 零件之金屬端子接合者。 【先前技】 ©發明背景 例如’將第2零件之TCP(TapeCarrierPackage，捲帶式 封裝)連接於第1零狀電路基板時，會透過異向性導電構 件將違TCP重疊於該電路基板，然後藉加壓工具將該等加 ' 壓加熱。藉此，使該異向性導電構件融化硬化，並在已藉 該異向性導電構件包含的金屬粒子將該Tcp電連接於該電 路基板的狀態下，將該TCP接著固定於該電路基板。 此時，若因加壓工具融化而從Tcp溢出之異向性導電 〇 構件附著於加壓工具之加壓面而硬化，有時會造成加壓面 的平坦度^:損，而使該TCP之封裝精確度下降。因此，該 加壓工具之加壓面與該TCP之間會加入由氟樹脂等耐熱性 樹脂形成之帶狀保護片。 用於基板與TCP連接之異向性導電構件相當價昂。因 此，可利用超音波振動將該基板之金屬端子與該TCP之金 屬端子接合，以替代異向性導電構件。 專利文獻1所揭露者，係利用可賦予超音波振動之加壓 工具，將作為第2零件之半導體晶片加壓接合於作為第1零 3 201007863 件之基板。即，該專利文獻丨係將半導體晶片吸附保持於加 壓工具之加壓面，並將此半導體晶片朝該基板加壓，藉此 將形成於基板之金屬端子（引線）與設置於半導體晶片上之 金屬端子（凸塊）共熔結合。 專利文獻1 :曰本專利公開公報特開2006-156813號 【明内容】 發明概要 發明欲解決之課題 藉超音波振動將形成於基板之金屬端子與設置於半導 © 體晶片之金屬端子接合時，若僅將半導體晶片吸附保持於 已職予超音波振動之加壓工具，單純地將此半導體晶片朝 基板加壓的話，有時超音波振動的加壓工具之加壓面易對 — 半導體晶片發生滑動，使得賦予在加壓工具之超音波振動 無法有效地傳播至半導體晶片。 因此，會有例如無法確實地將半導體晶片接合於基 板，或為了讓兩者確實地接合而必須延長生產時間，導致 生產性降低的情形。 ® 又，若在彼此的金屬端子結束共熔結合後，仍持續地 對半導體晶片施予超音波振動’將有在半導體晶片之表面 造成傷痕，而使半導體晶片損傷之虞。 本發明係提供一種零件之接合裝置與接合方法，可在 利用超音波振動接合設置於第丨零件與第2零件之金屬端子 時，確實且有效地進行這些金屬端子之接合。 用以欲解決課題之手段 4 201007863 本發明為—種零件之接合裝置，係將設置於第丨零件之 金屬端子與3又置於第2零件之金屬端子接合者，其特徵在於 具備：支持體，係支揮使該^零件與該第2零件彼此的金 屬端子相對向而重叠之部分者；加壓工具，係由設於前述 支持體的上方而可朝上下方向驅動之超音波振動器賦予超 音波振動，且將朝下降方向驅動而重疊的該第！零件與第2 科加壓，域該超音波㈣㈣等零件彼此的金屬端子 _ 加以接合者；及’片狀構件，係安農於該加壓工具與已重 疊的該第旧件及第2零件之間，並由—材料所形成，該材 料可將當該加壓工具接合該第以件與第2零件之金屬端子 時所賦予在该加壓工具之超音波振動，傳播至該第i、第2 - 零件。 本發明為一種接合的零件之接合方法，係將設置於第^ 零件之金屬端子與設置於第2零件之金屬端子者，其特徵在 於具備以下步驟：使彼此的金屬端子相對向，且使該第1零 Ο 件與該第2零件重疊；及，透過由可傳播超音波振動至該第 1、第2零件之材料所形成之片狀構件，以加壓工具加壓已 重疊之該第1零件與該第2零件，並藉該超音波振動來接合 該第1、第2零件之金屬端子。 發明效果 依據本發明，利用已賦予超音波振動之加壓工具對已 重疊之第1零件與第2零件加壓時，係在第丨、第2零件與加 壓工具之間，加入由可將已賦予在加壓工具之超音波振動 傳播至第1零件與第2零件之材料所形成的片狀構件。 5 201007863 已賦予在加壓工具之超音波振201007863 VI. Description of the Invention: [Technical Field of the Invention] Field of the Invention The present invention relates to a joint device and a joining method for a metal terminal to which a terminal is connected, and relates to a metal terminal and a second component of a first component by ultrasonic vibration. Metal terminal connector. [Prior Art] In the case of connecting a TCP (Tape Carrier Package) of a second component to a first zero-shaped circuit board, the TCP is overlaid on the circuit board by the anisotropic conductive member, and then The pressure is heated by a pressurizing tool. Thereby, the anisotropic conductive member is melted and hardened, and the TCP is subsequently fixed to the circuit board in a state where the Tcp is electrically connected to the circuit board by the metal particles included in the anisotropic conductive member. At this time, if the anisotropic conductive crucible member overflowing from the Tcp due to the melting of the press tool adheres to the pressurizing surface of the press tool and is hardened, the flatness of the pressurizing surface may be damaged, and the TCP may be caused. The package accuracy is reduced. Therefore, a strip-shaped protective sheet made of a heat-resistant resin such as a fluororesin is added between the pressurizing surface of the pressurizing tool and the TCP. Anisotropic conductive members for the connection of the substrate to the TCP are quite expensive. Therefore, the metal terminal of the substrate can be bonded to the metal terminal of the TCP by ultrasonic vibration instead of the anisotropic conductive member. According to Patent Document 1, a semiconductor wafer as a second component is press-bonded to a substrate as a first zero 3 201007863 by a pressurizing tool capable of imparting ultrasonic vibration. That is, the patent document discloses that a semiconductor wafer is adsorbed and held on a pressing surface of a press tool, and the semiconductor wafer is pressed toward the substrate, thereby forming a metal terminal (lead) formed on the substrate and being disposed on the semiconductor wafer. The metal terminals (bumps) are fused together. [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-156813 [Brief Description of the Invention] SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The metal terminal formed on a substrate is bonded to a metal terminal provided on a semiconductor wafer by ultrasonic vibration. If only the semiconductor wafer is adsorbed and held by a pressurizing tool that has been subjected to ultrasonic vibration, and the semiconductor wafer is simply pressed toward the substrate, the pressurizing surface of the ultrasonic vibrating pressurizing tool may be easily used - the semiconductor wafer Sliding occurs so that ultrasonic vibration imparted to the pressurizing tool cannot be efficiently propagated to the semiconductor wafer. Therefore, for example, it is impossible to reliably bond the semiconductor wafer to the substrate, or it is necessary to extend the production time in order to allow the two to be surely joined, resulting in a decrease in productivity. Further, if the metal terminals of the respective ends are eutectic bonded, the ultrasonic vibration is continuously applied to the semiconductor wafer, which causes scratches on the surface of the semiconductor wafer and damages the semiconductor wafer. The present invention provides a joining device and a joining method for a component, which can reliably and efficiently join the metal terminals when the metal terminals of the second component and the second component are joined by ultrasonic vibration. Means for Solving the Problem 4 201007863 The present invention relates to a bonding device for a component, in which a metal terminal provided in a second component and a metal terminal of a second component are joined, and a support is provided. a portion in which the metal member of the second component and the second component are opposed to each other is overlapped, and the pressurizing tool is provided by an ultrasonic vibrator that is driven upward in the upper side of the support body. Ultrasonic vibration, which will be driven in the downward direction and overlapped! The part and the second section are pressurized, the metal terminal _ of the parts such as the ultrasonic (four) (four) and the other are joined; and the 'sheet member is the same as the pressing tool and the overlapped old part and the second part Between the material and the material, the material can impart ultrasonic vibration to the pressing tool when the pressing tool joins the metal terminal of the first member and the second component, and propagates to the ith, 2nd - Parts. The present invention provides a method of joining joined parts, wherein the metal terminal provided in the second part and the metal terminal provided in the second part are characterized in that the metal terminals are opposed to each other and the metal terminal is provided The first member overlaps with the second member; and the sheet member formed by the material that can propagate the ultrasonic vibration to the first and second members is superimposed by the pressing tool. The component and the second component are joined to the metal terminals of the first and second components by the ultrasonic vibration. According to the present invention, when the first component and the second component that have been overlapped are pressurized by the pressing tool that has been subjected to ultrasonic vibration, the second component and the second component are added between the pressing tool and the pressing tool. A sheet member formed by propagating ultrasonic vibration of the press tool to the materials of the first part and the second part has been provided. 5 201007863 Ultrasonic vibration has been given to the pressurizing tool

各零件的毀損。 圖式簡單說明 故，可透過片狀構件將已 效地傳播至第1、第2零件 第1圖為顯示本發明其中_實施例之接合I置的組裝 裝置之概略構造側面圖。 第2A圖為顯示藉由加壓工具將TCp朝基板加壓前之狀 態的說明圖。 第2B圖為顯示已藉由加壓工具而透過片狀構件將Tcp 朝基板加壓之狀態的說明圖； 第2C圖為顯示已從第2B圖之狀態，藉由加壓工具將 TCP更加朝基板加壓之狀態的說明圖。 【實施方式;J 用以實施發明之最佳形態 以下’參考圖式就本發明之其中一實施例加以說明。 第1圖顯示作為零件連接裝置之組裝裝置的概略構 造’此組裝裝置具有裝置本體卜此裝置本體丨設有XY台2， 作為可朝水平X、Y方向驅動之平台。對此XY台2供給例如 液晶胞等作為第1零件之基板3，並在使一側部從XY台2上 面突出之狀態下，藉由例如真空吸附等固定手段保持在XY 台2上面。 如第2A圖所示，該基板3之一側部之上面以預定之間隔 設有複數第1金屬端子3a。作為第2電子零件之複數TCP5(僅 201007863 圖不1個）在4基板3之-側部，藉由例如熱固性或熱塑性樹 月9形成之片狀接著劑4，使以預定間隔設置於gTCp5之第2 金屬端子5a與第丨金屬端子3a相對向而暫時連接。 即’ TCP5係利用接著劑4保持於基板3，並使這些金屬 端子3a、5a彼此相對向地重疊。而，接著劑4雖僅設置於基 板3與TCP5接觸的部份’但亦可設置成遍及基板3之一侧部 之上面全長。 〇 如第1圖所示，該裝置本體1設有作為支持體之支撐工 具6 ’該支持體係藉由其上端面來支撐被保持於該χγ台2之 基板3之一側部下面。與此支撐工具6之上端面所支持之基 板3之側部暫時連接的該TCP5，藉由加壓工具7下端之加壓 面7a，以後述的方式被加壓並接合固定。 該加壓工具7内藏有加熱器7b。此加熱器7b會在已加壓 藉由接著劑4與基板3暫時連接之TCP5時，將此加壓工具7 加熱至該接著劑4可融化硬化之溫度，例如50(TC左右。 〇 該加壓工具7透過後述超音波振動器11而設置於加壓 頭8的下面。該加壓頭8可沿著線性導件9朝著圖中箭頭所示 之Z方向，即上下方向滑行，並藉由Z驅動源10朝Z方向驅 動。 該超音波振動器U具有金屬製之角柱狀喇0八 (H〇rn)12，此味j叭12的上面被固定於該加壓頭8之下面，且 下面一體地設有該加壓工具7。該制叭12之一端與振動元件 13連結，並由無圖示之振動器對此振動元件13施予例如 40kHz之高頻率電壓。 7 201007863 藉此，該振動元件13會進行超音波振動，並將該振動 透過伽\12傳播至該加壓工具7。在此實施例中，加壓工具 7係朝水平方向，即橫向振動。 於該裝置本體1之該加壓工具7之下方，且位在該支撐 工具6的上方，沿著水平方向設有軌道構件以。於裝置本髏 1，可沿著該軌道構件21裝卸卡式帶22。 當將該卡式帶22沿著圖中箭頭χ所示的方向裝設於裝 置本體！時，在預定位置設在該卡式帶22之制動器（無圖承） 將與設在雜4本體〗之抵接部（無_)㈣。藉此，將該 卡式帶22定位。 該卡式帶22具有藉由連結軸23以預定間隔連結之一對 矩形狀侧板24(僅圖示-邊）。連結轴23至少連結該側板^ 之四個角部。 一對側板24的長邊方向之一端部捲裝有片狀構件25， 片狀構件25之幅寬為與該基板w之—側部等長以上，且轴 狀供給捲軸26設置成可相對該侧板24旋轉且裝卸。 在該側板24的長邊方向之另一端部設有捲繞捲轴^， 捲繞捲轴28係透過複數巾繼雜π來捲繞已捲裝於該供給 捲軸26之片狀構件25。將卡式帶22裝設於裝置本體1的預定 位置時，該捲繞滾軸28係連結於設在裝置本體丨之無圖示的 捲繞驅動源。因此，只要使轉回驅動源動作，便可將已捲 裳於該供給錄26之Μ構件Μ減至雜繞捲軸28。 該片狀構件25係由一材料所形成，該材料係於邊使該 超音波振動器11動作’邊利用該加壓工具7之加壓面^對已 201007863 重疊於基板WiTCP5加壓時’可將透過喇叭12從振動元件 13傳播至該加壓工具7之超音波振動，有效地由此加壓工具 7之加壓面7a傳播至該TCP5。 該片狀構件25係形成於凹凸上之面，該凹凸係例如上 面與下面與該加壓工具7之加壓面7a與該TCP5之上面接觸 且具有較高之摩擦阻力，並具有一當收到來自加壓工具7之 超音波振動時，不易朝振動方向（水平方向）彈性變形之硬 度’且，以對設於加壓工具7之加熱器7b之熱度具有耐熱性 之材料為佳，例如編織玻璃纖維的玻璃布或編織碳纖維的 碳布等。 接下來’針對利用上述構成之組裝裝置，接合固定已 - 用接著劑4暫時連接於基板3之TCP5時的作用，參考第 2 A~2C圖加以說明。 第2A圖顯示TCP5已藉由接著劑4暫時連接於基板3之 狀態’將該XY台定位，使已供給載置於χγ台2之基板3之 φ 一側部下面支撐於支撐工具6之上端面，且已暫時連接於該 基板3之一側部上面的該TCP5與加壓工具7之加壓面％相對 向0 然後’若已使超音波振動器11動作來對加壓工具7賦予 超音波振動，便使Z驅動源1〇動作而使加壓頭8如第2B圖所 示般下降’並藉由設置於該加壓頭8之加壓工具7的加壓面 7a’透過片狀構件25將以預定間隔設置於基板3之一側部之 複數TCP5同時加壓。此時，係利用設於加壓工具7之加壓 器7b的熱’將已暫時連接於基板3之TCp5i接著劑4加熱。 9 201007863 接著劑4係由熱固性樹脂所形成。因此，當藉由加壓工 具7加熱融化而流動性增加後，會因到達預定溫度而硬化。 藉此，接著劑4會將TCP5接著固定於基板3。 接著劑4一旦融化，會從TCP5溢出並附著於加壓工具7 之加壓面7a後硬化，而有加壓面7a的平坦度降低並使加壓 精確度降低之虞。但是，由於利用片狀構件25可阻止從 TCP5溢出的接著劑4附著於加壓面7a，因此可防止該加壓面 7a之平坦度因接著劑4而受損。 在TCP5藉由接著劑4接著固定於基板貨之前，利用加壓 工具7來加壓TCP5，藉此，如第2C圖所示般，TCP5之第2 金屬端子5a會與基板3之第1金屬端子33接觸。 在此狀態下，當振動元件13的超音波振動藉由加壓工 具7並透過TCP5而傳播至第丨金屬端子33與第2金屬端子化 時，該第1金屬端子3a與第2金屬端子％會因此超音波振動 而進行共熔結合。此時，利用加壓工具7藉加熱器几而加 熱，可促進該第1金屬端子3a與第2金屬端子元的共熔結合。 該加壓工具7的超音波振動透過片狀構件25而傳播至 TCP5。此片狀構件25係利用可將超音波振動由加壓工具7 有效地傳播至TCP5的材料及材質來形成。 即，只要疋可傳播超音波振動的硬度，以及不會與加 壓工具7之加壓面7a及片狀構件25的上面產生滑動、且摩擦 力會增大的凹凸狀面，也就是若片狀構件25為例如玻璃布 或碳布，便可因其編結處的凹凸而使摩擦力增加。因此， 可將TCP5之第2金屬端子5a有效且確實地共溶結合於基板3 201007863 之第1金屬端子3a。 該片狀構件25具有耐熱性。所以，即使在利用已藉加 熱器7b加熱之加壓工具7來加壓TCP5時被加熱，也不會因 熱影響而損傷。 TCP5之第2金屬端子5a共熔結合於基板3之第1金屬端 子3a之後，如上所述，該接著劑4會硬化並將TCP5接著固定 於基板3。若TCP5藉由接著劑4接著固定於基板3，因為不 易對已共熔結合的第1金屬端子3a和第2金屬端子5a之連接 部分施加應力，故即使例如對TCP5施加外力，亦可防止這 些端子3a、5a之電連接狀態受損。即，TCP5不易從基板3 剝離。 • 在上述之其中一實施例中，是以將作為第2電子零件之 - TCP連接於作為第1電子零件之基板之一側為例加以說 明’然而第1電子零件與第2電子零件的種類並未受限，重 點為只要是彼此具有金屬端子且要求將該等金屬端子電連 φ 接之2個電子零件，即可適用本發明之接合裝置及接合方 法0 又’若將玻璃布或碳布等纖維用於片狀構件，則可使 片狀構件具有透氣性。因此，可於加壓工具之加壓面開口 形成吸附孔，並透過該片狀構件將第2零件吸附保持於此吸 附孔’而在此狀態下將第2零件朝第1零件加壓。此時，第2 了為半導體晶片等’而第1零件可為導線架(Lead Frame) 或捲帶式承載器(Tape Carrier)等，零件的種類並未受限。 又’雖為利用超音波振動器對加壓工具賦予超音波振 11 201007863 動後再使加壓頭下降，但對加壓工具賦予超音波振動之時 機亦可在加壓工具加壓電子零件後立刻。 I：圖式簡單說明3 第1圖為顯示本發明其中一實施例之接合裝置的組裝 裝置之概略構造側面圖。 第2A圖為顯示藉由加壓工具將TCP朝基板加壓前之狀 態的說明圖。 第2B圖為顯示已藉由加壓工具而透過片狀構件將TCP 朝基板加壓之狀態的說明圖； 第2C圖為顯示已從第2B圖之狀態，藉由加壓工具將 TCP更加朝基板加壓之狀態的說明圖。 【主要元件符號說明】 1...裝置本體 9...線性導件 2…XY台 10...Z驅動源 3…基板(第1電子零件） 11...超音波振動器 3a...第1金屬端子 12·.·味j η八(Horn) 4...接著劑 13...振動元件 5... TCP(第2電子零件） 21...軌道構件 5a...第2金屬端子 22...卡式帶 6...支撐工具 23...連結軸 7...加壓工具 24...側板 7a...加壓面 25...片狀構件 7b...加熱器 26...供給捲軸 8...加壓頭 27...中繼滚軸 12 201007863 28...捲繞捲軸Damage to each part. The drawings are simply described as being able to effectively propagate to the first and second parts through the sheet member. Fig. 1 is a schematic side view showing the assembly of the assembly I of the present invention. Fig. 2A is an explanatory view showing a state before the TCp is pressed toward the substrate by a pressurizing tool. Fig. 2B is an explanatory view showing a state in which Tcp is pressed toward the substrate by the sheet member by the pressurizing tool; Fig. 2C is a view showing that the TCP has been further turned by the pressing tool from the state of Fig. 2B An explanatory diagram of a state in which the substrate is pressurized. [Embodiment] J is the best mode for carrying out the invention. Hereinafter, one embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a schematic configuration of an assembly device as a component connecting device. The assembly device has a device body. The device body is provided with an XY table 2 as a platform that can be driven in the horizontal X and Y directions. In the XY stage 2, for example, a substrate 3 as a first component such as a liquid crystal cell is supplied, and the one side portion is protruded from the upper surface of the XY stage 2, and is held on the upper surface of the XY stage 2 by a fixing means such as vacuum suction. As shown in Fig. 2A, a plurality of first metal terminals 3a are provided on the upper surface of one side portion of the substrate 3 at predetermined intervals. The plurality of TCPs 5 (only one of the 201007863 drawings) as the second electronic component are placed on the side portion of the fourth substrate 3 by a sheet-like adhesive 4 formed of, for example, thermosetting or thermoplastic tree 9 to be placed at a predetermined interval in the gTCp5. The second metal terminal 5a is temporarily connected to the second metal terminal 3a. That is, the TCP 5 is held by the substrate 3 by the adhesive 4, and these metal terminals 3a and 5a are opposed to each other. On the other hand, the adhesive 4 is provided only in the portion where the substrate 3 is in contact with the TCP 5, but may be provided over the entire upper surface of one side of the substrate 3. 〇 As shown in Fig. 1, the apparatus body 1 is provided with a support tool 6' as a support body. The support system is supported by the upper end surface to be held under one side of the substrate 3 of the χγ table 2. The TCP 5 temporarily connected to the side portion of the substrate 3 supported by the upper end surface of the support tool 6 is pressed and fixed by a pressurizing surface 7a at the lower end of the pressurizing tool 7, as will be described later. The pressurizing tool 7 has a heater 7b built therein. When the heater 7b pressurizes the TCP 5 temporarily connected to the substrate 3 by the adhesive 4, the pressing tool 7 is heated to a temperature at which the adhesive 4 can be melted and hardened, for example, 50 (TC or so. The pressing tool 7 is disposed on the lower surface of the pressing head 8 through the ultrasonic vibrator 11 described later. The pressing head 8 can slide along the linear guide 9 in the Z direction indicated by the arrow in the figure, that is, in the up and down direction, and borrow The Z-drive source 10 is driven in the Z direction. The ultrasonic vibrator U has a metal columnar column 8 (H〇rn) 12, and the upper surface of the pad 12 is fixed under the pressing head 8. The pressurizing tool 7 is integrally provided on the lower side. One end of the horn 12 is coupled to the vibrating member 13, and a vibrating element (not shown) is applied with a high frequency voltage of, for example, 40 kHz. 7 201007863 The vibrating element 13 performs ultrasonic vibration and propagates the vibration through the gamma 12 to the pressing tool 7. In this embodiment, the pressing tool 7 vibrates in a horizontal direction, that is, laterally. 1 below the pressing tool 7, and located above the supporting tool 6, along the horizontal The track member is provided to the device body 1, and the cassette tape 22 can be attached and detached along the track member 21. When the card tape 22 is mounted on the device body in the direction indicated by the arrow 图 in the figure The brake (not shown) provided at the predetermined position on the cassette 22 will be placed at the abutment portion (not _) (4) of the body 4, whereby the cassette 22 is positioned. The belt 22 has a pair of rectangular side plates 24 (only the sides are shown) joined by a connecting shaft 23 at predetermined intervals. The connecting shaft 23 connects at least four corner portions of the side plates ^. The longitudinal direction of the pair of side plates 24 One of the end portions is provided with a sheet-like member 25 having a width equal to or longer than the side portion of the substrate w, and the shaft-shaped supply reel 26 is provided to be rotatable relative to the side plate 24 and detachable. The other end portion of the side plate 24 in the longitudinal direction is provided with a winding reel 2, and the winding reel 28 winds the sheet-like member 25 that has been wound around the supply reel 26 by passing through a plurality of nips. When the belt 22 is installed at a predetermined position of the apparatus body 1, the winding roller 28 is coupled to a winding drive (not shown) provided in the apparatus body Therefore, as long as the driving back to the driving source is actuated, the member that has been wound on the supply record 26 can be reduced to the winding reel 28. The sheet member 25 is formed of a material which is tied to the side. When the ultrasonic vibrator 11 is operated, the pressurizing surface of the pressurizing tool 7 is used to superimpose the 201007863 on the substrate WiTCP5, and the transmissive horn 12 can be transmitted from the vibrating element 13 to the pressurizing tool 7 The sonic vibration is effectively transmitted to the TCP 5 by the pressing surface 7a of the pressurizing tool 7. The sheet member 25 is formed on the surface of the unevenness, such as the upper and lower surfaces and the pressurizing tool 7 The face 7a is in contact with the upper surface of the TCP 5 and has a high frictional resistance, and has a hardness which is not easily elastically deformed in the vibration direction (horizontal direction) when receiving ultrasonic vibration from the pressurizing tool 7 It is preferable that the heat of the heater 7b provided in the pressurizing tool 7 is heat-resistant, for example, a glass cloth woven with glass fibers or a carbon cloth woven with carbon fibers. Next, the action of the above-described assembly device for bonding and fixing the TCP 5 temporarily connected to the substrate 3 by the adhesive 4 will be described with reference to Figs. 2A to 2C. 2A is a view showing that the TCP 5 has been temporarily connected to the substrate 3 by the adhesive 4, and the XY stage is positioned so as to be supported on the support tool 6 under the φ side portion of the substrate 3 placed on the χγ table 2 The end face, and the TCP 5 which has been temporarily connected to the upper side of one side of the substrate 3, is opposite to the pressing surface % of the pressurizing tool 7 and then 'if the ultrasonic vibrator 11 has been actuated to give the pressurizing tool 7 super When the sound is vibrated, the Z driving source 1 is operated to lower the pressing head 8 as shown in FIG. 2B and is transmitted through the sheet by the pressing surface 7a' of the pressing tool 7 provided in the pressing head 8. The member 25 simultaneously pressurizes a plurality of TCPs 5 disposed at one side of the substrate 3 at predetermined intervals. At this time, the TCp5i adhesive 4 which has been temporarily connected to the substrate 3 is heated by the heat ' provided by the pressurizer 7b of the pressurizing tool 7. 9 201007863 The second agent 4 is formed of a thermosetting resin. Therefore, when the fluidity is increased by the heating and melting by the pressurizing tool 7, it is hardened by reaching a predetermined temperature. Thereby, the adhesive 4 will fix the TCP 5 to the substrate 3 next. When the subsequent agent 4 is melted, it overflows from the TCP 5 and adheres to the pressing surface 7a of the pressurizing tool 7, and is hardened, and the flatness of the pressurizing surface 7a is lowered to lower the pressurization accuracy. However, since the adhesive 4 overflowing from the TCP 5 can be prevented from adhering to the pressurizing surface 7a by the sheet member 25, the flatness of the pressurizing surface 7a can be prevented from being damaged by the adhesive 4. The TCP 5 is pressurized by the pressurizing tool 7 before the TCP 5 is fixed to the substrate by the adhesive 4, whereby the second metal terminal 5a of the TCP 5 and the first metal of the substrate 3 are as shown in FIG. 2C. Terminal 33 is in contact. In this state, when the ultrasonic vibration of the vibrating element 13 is transmitted to the second metal terminal 33 and the second metal terminal by the pressurizing tool 7 and transmitted through the TCP 5, the first metal terminal 3a and the second metal terminal are %. Therefore, the ultrasonic vibration is combined to perform eutectic bonding. At this time, the pressurizing tool 7 is heated by the heater to promote the eutectic bonding of the first metal terminal 3a and the second metal terminal. The ultrasonic vibration of the pressurizing tool 7 is transmitted to the TCP 5 through the sheet member 25. The sheet member 25 is formed by using a material and a material that can effectively propagate ultrasonic vibration by the pressurizing tool 7 to the TCP 5. In other words, the ridge can propagate the hardness of the ultrasonic vibration, and the uneven surface that does not slip with the pressing surface 7a of the pressurizing tool 7 and the upper surface of the sheet member 25, and the frictional force increases. The member 25 is, for example, a glass cloth or a carbon cloth, and the frictional force can be increased by the unevenness at the knitting portion. Therefore, the second metal terminal 5a of the TCP 5 can be effectively and surely co-dissolved to the first metal terminal 3a of the substrate 3 201007863. The sheet member 25 has heat resistance. Therefore, even when the TCP 5 is pressurized by the pressurizing tool 7 heated by the heater 7b, it is not damaged by the influence of heat. After the second metal terminal 5a of the TCP 5 is fused and bonded to the first metal terminal 3a of the substrate 3, as described above, the adhesive 4 is hardened and the TCP 5 is subsequently fixed to the substrate 3. When the TCP 5 is fixed to the substrate 3 by the adhesive 4, it is difficult to apply stress to the connection portion between the eutectic first metal terminal 3a and the second metal terminal 5a. Therefore, even if an external force is applied to the TCP 5, for example, it is possible to prevent these. The electrical connection state of the terminals 3a, 5a is impaired. That is, the TCP 5 is not easily peeled off from the substrate 3. In one of the above embodiments, the TCP as the second electronic component is connected to one side of the substrate as the first electronic component. However, the types of the first electronic component and the second electronic component are described. It is not limited, and the main point is that the bonding device and the bonding method of the present invention can be applied as long as they have two metal parts that have metal terminals and are electrically connected to each other. When a fiber such as cloth is used for the sheet member, the sheet member can be made gas permeable. Therefore, the adsorption hole can be formed in the opening of the pressurizing surface of the pressurizing tool, and the second member can be sucked and held by the sheet member through the sucking hole, and the second member can be pressurized toward the first member in this state. In this case, the second component is a semiconductor wafer or the like, and the first component may be a lead frame or a tape carrier, and the type of the component is not limited. In addition, although the ultrasonic vibration is applied to the pressurizing tool by the ultrasonic vibrator 11 201007863, the pressing head is lowered, but the timing of imparting ultrasonic vibration to the pressing tool can also be performed after the pressing tool presses the electronic component. Immediately. I: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic side view showing an assembly apparatus of a joining apparatus according to an embodiment of the present invention. Fig. 2A is an explanatory view showing a state before the TCP is pressed toward the substrate by a pressurizing tool. Fig. 2B is an explanatory view showing a state in which TCP is pressed toward the substrate by the sheet member by the pressurizing tool; Fig. 2C is a view showing that the TCP has been further turned by the pressing tool from the state of Fig. 2B An explanatory diagram of a state in which the substrate is pressurized. [Description of main component symbols] 1...device body 9...linear guide 2...XY stage 10...Z drive source 3...substrate (first electronic part) 11...ultrasonic vibrator 3a.. .1st metal terminal 12···味j η八(Horn) 4...Binder 13...Vibration element 5...TCP (2nd electronic component) 21...Track member 5a... 2 metal terminal 22... cassette tape 6... support tool 23... connection shaft 7... pressure tool 24... side plate 7a... pressure surface 25... sheet member 7b. ..heater 26...feed reel 8...pressurizing head 27...relay roller 12 201007863 28...winding reel

Claims (1)

201007863 七、甲睛專利範圍： 1· 一種轉之接合裝置，係接合設於第 與設於第2零㈣金料子者，其龍在料備 屬端ΐ:係支撑使該第1零件與該第2零件彼此的金 屬知子相對向而重疊之部分者；201007863 VII, the scope of the patent of the eye: 1 · A transfer joint device, which is connected to the second and fourth (four) gold material, the dragon is in the material preparation end: the support makes the first part and the a portion in which the metal members of the second part are opposed to each other; 方向2卫具，係由設於前述支持體的上方而可朝上下 之超音波振動叫予超音波振動，且將朝下降 °驅動而重㈣該第1零件與第2零件加壓，並藉該超 曰波振動將該等零件彼此的金相子加以接合者·及 片狀構件’係、安裝於該加壓工具與已重疊的該第！ $件及第2零件之間，並由一材料所形成，該材料可將 田該加壓卫具接合該第1零件與第2零件之金屬端子「士 所賦予在該加壓工具之超音波振動 ’傳播至該第1 . 零件。The direction 2 Guard is a supersonic vibration that can be oscillated upwards and above by the ultrasonic wave provided above the support body, and is driven by the lowering and is heavy (4) the first part and the second part are pressurized and borrowed. The super-chopping vibration is used to bond the metal phases of the components to each other, and the sheet-like member is attached to the pressing tool and the superposed one! Between the piece and the second part, and formed by a material, the material can be joined to the metal terminal of the first part and the second part by the pressing force guard. The vibration 'propagates to the first part. 如申吻專利範圍第1項之零件之接合裝置，其中該片狀 構件係編織硬質纖維而形成。 3.如申晴專利範圍第2項之零件之接合裝置，其中該片狀 構件由玻璃纖維所形成。 .如申4專利範項之零件之接合裝 置，其中已重疊 零件間設有接著劑，且該加壓工具 設有加熱該接著劑之加熱器； 藉由該加壓工具加壓該第1零件與第2零件而接合 ^些金屬端子時’係使該接著劑融化且硬化來接著固定 該第1零件與第2零件。 14 201007863 5. —種零件之接合方法，係接合設於第1零件之金屬端子 與設於第2零件的金屬端子者，其特徵在於具備以下步 驟： 使彼此的金屬端子相對向，且使該第1零件與該第2 零件重疊；及 透過由可傳播超音波振動至該第1、第2零件之材料 所形成之片狀構件，以加壓工具加壓已重疊之該第1零 件與該第2零件，並藉該超音波振動來接合該第1、第2 零件之金屬端子。 6. 如申請專利範圍第5項之零件之接合方法，其中包含一 於欲重疊的該第1零件與該第2零件之間加入接著劑的 步驟； 且，該接著劑在藉該加壓工具加壓該第1零件與該 第2零件時，會被加熱融化且硬化，而接著固定該第1零 件與第2零件。 15An engaging device for a part of the first aspect of the patent, wherein the sheet member is formed by weaving a hard fiber. 3. The joining device for a part according to item 2 of the Shenqing patent scope, wherein the sheet member is formed of glass fiber. The bonding device of the part of the patent of claim 4, wherein an adhesive is disposed between the overlapped parts, and the pressing tool is provided with a heater for heating the adhesive; and the first part is pressurized by the pressing tool When the metal terminals are joined to the second component, the adhesive is melted and cured, and then the first component and the second component are fixed. 14 201007863 5. The bonding method of the component is a metal terminal provided in the first component and a metal terminal provided in the second component, and is characterized in that the metal terminal is opposed to each other and the metal terminal is placed The first part overlaps with the second part; and the first part that is superposed by the pressing tool is pressed by the sheet member formed by the material that can propagate the ultrasonic vibration to the first and second parts The second component is joined to the metal terminals of the first and second parts by the ultrasonic vibration. 6. The joining method of a part of claim 5, comprising the step of adding an adhesive between the first part and the second part to be overlapped; and the adhesive is borrowing the pressing tool When the first component and the second component are pressed, they are heated and melted and hardened, and then the first component and the second component are fixed. 15
TW098118911A 2008-06-13 2009-06-06 Device and method for joining parts together TW201007863A (en)

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