CN100358092C - Pull-down mechanism for supporting centre - Google Patents
Pull-down mechanism for supporting centre Download PDFInfo
- Publication number
- CN100358092C CN100358092C CNB2004100490115A CN200410049011A CN100358092C CN 100358092 C CN100358092 C CN 100358092C CN B2004100490115 A CNB2004100490115 A CN B2004100490115A CN 200410049011 A CN200410049011 A CN 200410049011A CN 100358092 C CN100358092 C CN 100358092C
- Authority
- CN
- China
- Prior art keywords
- sheet material
- thimble
- pedestal
- down mechanism
- thimbles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a pull-down mechanism for support thimbles, which is applied to a removable reactor. A base plate of the removable reactor is provided with a plurality of thimbles which are respectively provided with one base. The pull-down mechanism at least comprises a lifting mechanism and a sheet material fixed on the lifting mechanism with fixed height, wherein the sheet material is provided with a plurality of openings through which the bases of the thimbles pass, and the openings respectively extend at least one slit through which the thimbles pass. The present invention utilizes the sheet material with the advantage of little deformation as the pull-down mechanism for the support thimbles, and therefore, the present invention can greatly improve the problem that the thimbles do not drop down easily and can effectively solve the problem that substrates break pieces because of unfavorable transfer to reduce the number of discarded substrates and reduce the operation time of a machine table.
Description
Technical field
The present invention relates to a kind of transmission mechanism of bracing or strutting arrangement, and be particularly related to the drop-down transmission mechanism of a kind of support pin (pin).
Background technology
No matter be in the semiconductor integrated circuit or the manufacture process of flat-panel screens, the employed reactor of many processing procedures is designed to the drawing out type reactor of single or multilayer reduplicative forms.The reactor of drawing out type reactor and board main body or the transmission mechanism of reactor and thimble is separable, its thimble that is used for supporting workpiece (as making the used silicon substrate of semiconductor integrated circuit, or making the glass substrate of flat-panel screens) is to adopt separable indirect drive mechanism.Prior art is that the transmission mechanism by support pin is sent into substrate in the reactor or taken out substrate in the autoreactor, and the action schematic illustration of whole transmission please refer to Figure 1A-1E.
In Figure 1A, substrate 100 is being supported by mechanical arm 110, and preparation will be sent in the reactor.Some openings 130 are arranged in the base plate 120 of reactor, and supplying has the thimble 140 of pedestal 150 to stretch in the reactor via opening 130 down.In Figure 1B, mechanical arm 110 is sent into substrate 100 in the reactor, and the pedestal 150 that is withstood thimble 140 by elevating mechanism (not shown on the figure) lifts, and the opening 130 of base plate 120 that passes reactor is to support substrate 100.In Fig. 1 C, mechanical arm 110 is moved to outside the reactor again, stays substrate 100 in reactor, and elevating mechanism descends then, allows the thimble 140 that supportting substrate 100 utilize the weight of itself and pedestal 150 to descend voluntarily.
In Fig. 1 D, on substrate 100, form after the film with chemical vapour deposition technique, move on the elevating mechanism and withstand pedestal 150 thimble 140 is up moved, make on it and move to prop up substrate 100.Then, in the mechanical arm 110 shift-in reactors, substrate 100 is accepted in the below that extends substrate 100.In 1E figure, mechanical arm 110 is being with substrate 100 to shift out outside the reactor, and elevating mechanism descends then, allows thimble 140 utilize the weight of itself and pedestal 150 to descend voluntarily.
Enter and shift out in the process of reactor in whole base plate 100, because the pedestal 150 of elevating mechanism and thimble 140 can't be fixed together, so elevating mechanism can't drive thimble 140 with pedestal 150 declines when descending.Therefore thimble 140 often has the situation about having some setbacks that descends to take place, and causes substrate 100 because of the transmission fragmentation that has some setbacks.
In No. 521861 patent of the novel patent of TaiWan, China, there is the pull down mechanism of openly utilizing two steel wires to improve the problem that thimble descends and has some setbacks.But in practical application, steel wire falls the pedestal that does not fasten thimble partially because of deformation sometimes, and therefore the problem that thimble descends and has some setbacks still can take place.
Summary of the invention
Therefore purpose of the present invention is exactly that a kind of pull down mechanism of support pin is being provided, in order to reduce scrapping number and improving rate of finished products of substrate.
Another object of the present invention is that a kind of pull down mechanism of support pin is being provided, in order to reduce substrate fragmentation probability to increase the service time of board.
According to above-mentioned purpose of the present invention, a kind of pull down mechanism of support pin is proposed, be applied on the drawing out type reactor.The base plate of this drawing out type reactor has several thimbles, and these thimbles have a larger-size pedestal respectively.This pull down mechanism comprises an elevating mechanism and a sheet material that is fixed in a level altitude on the elevating mechanism at least.This sheet material has several openings holding above-mentioned thimble respectively one by one, and extends at least one slit respectively from these openings.The pedestal that the size of above-mentioned opening is enough to hold thimble passes through, and the width of slit is between the width of thimble and pedestal.
According to above-mentioned purpose of the present invention, the pull down mechanism of another kind of support pin is proposed, be applied on the drawing out type reactor.The base plate of this drawing out type reactor has several thimbles, and these thimbles have a larger-size pedestal respectively; This pull down mechanism comprises an elevating mechanism and a level altitude at least and is fixed in first sheet material and second sheet material on the elevating mechanism; First side of this first sheet material has several first breach, and first side of first side of second sheet material and first sheet material is arranged to form a slit with an interval adjacent parallel; First side of this second sheet material also has several second breach, and these second breach respectively with above-mentioned relative several openings that form of first breach to hold above-mentioned thimble respectively one by one.Wherein the diameter of above-mentioned opening is greater than the diameter of the pedestal of thimble, and the width of above-mentioned slit is between the diameter of thimble and pedestal.
By the content of the invention described above as can be known, the advantage that the present invention utilizes sheet material to be difficult for deformation is used as the pull down mechanism of support pin, therefore can improve the problem that thimble descends and has some setbacks significantly.So, can solve substrate effectively, reducing the number that substrate is scrapped, and increase the duration of runs of board because of the have some setbacks problem of fragmentation of transmission.
Description of drawings
Figure 1A-1E is the support pin transmission mechanism of existing CVD (Chemical Vapor Deposition) reactor.
Fig. 2-4 is the schematic top plan view according to the pull down mechanism of a kind of support pin of preferred embodiment of the present invention.
The number in the figure explanation
100: substrate
110: mechanical arm
120: the base plate of reactor
130: opening
140: thimble
150: pedestal
200,300,400: sheet material
210: breach
310,410: opening
220,320,420: slit
230,330,430: fixture
Embodiment
Cause the problem of substrate fragmentation at above-mentioned because of thimble descends to having some setbacks, the invention provides a kind of drop-down transmission mechanism of support pin, thimble can be descended smoothly, but also can increase the duration of runs of board to reduce substrate fragmentation number.
Please refer to Fig. 2-4, it illustrates the schematic top plan view according to the pull down mechanism of a kind of support pin of preferred embodiment of the present invention.In Fig. 2, utilize two sheet materials 200 that have breach 210 to be combined into the pull down mechanism of support pin.This two sheet material 200 is fixed on the elevating mechanism of thimble pedestal below against fixture 230 (for example screw), and two sheet materials 200 do not have driving fit to form slit 220 each other.
The diameter of the opening that two above-mentioned breach 210 are formed is greater than the diameter of thimble pedestal, and the width of slit 220 will be between the diameter of thimble and its pedestal.So, the pedestal of thimble can pass the opening of being made up of two breach 210 from top to bottom, thimble is moved toward slit 220 places again, allows thimble enter in the slit 220, and the below that pedestal then is arranged in slit 220 allows thimble can be fixed on slit 220.And the height of pull down mechanism, can be according to the height of thimble, add vertical and have that the sidewall of suitable height cooperates in the circumferential perimeter of two boards material 200 with sheet material 200.
When the elevating mechanism of thimble pedestal below rises, still withstand the pedestal of thimble by elevating mechanism, allow thimble rise with supporting substrate, can not touch thimble by the formed pull down mechanism of sheet material.When elevating mechanism descended, the sheet material 200 of pull down mechanism just can pressed the pedestal of thimble, and auxiliary thimble makes its decline.
The pull down mechanism of above-mentioned support pin can also be varied to other similar feasible configurations, as shown in Figure 3-4.In Fig. 3, directly use a sheet material 300, directly form opening 310 thereon, and respectively form a slit 320, and utilize fixture 330 (for example screw) to be fixed on the elevating mechanism of thimble pedestal below in the both sides of each opening 310.In Fig. 4, also be to utilize a sheet material 400, directly form opening 410 thereon, and form a slit 420, and utilize fixture 430 (for example screw) to be fixed on the elevating mechanism of thimble pedestal below in a side of opening 410.Same as above, the diameter of opening 310,410 is greater than the diameter of thimble pedestal, pass through in order to the pedestal of thimble, and the width of slit 320,420 will be between thimble diameter and susceptor diameter.
By the invention described above preferred embodiment as can be known, the advantage that the present invention utilizes sheet material to be difficult for deformation is used as the pull down mechanism of support pin, therefore can improve the problem that thimble descends and has some setbacks significantly.So, can solve substrate effectively, reducing the number that substrate is scrapped, and increase the duration of runs of board because of the have some setbacks problem of fragmentation of transmission.
Claims (4)
1. the pull down mechanism of support pin is applied on the drawing out type reactor, and the base plate of this drawing out type reactor has several thimbles, and each thimble has the bigger pedestal of diameter respectively, and this pull down mechanism comprises at least:
One elevating mechanism; And
At least one sheet material is fixed on this elevating mechanism with a level altitude, have several openings on this sheet material to hold those thimbles respectively one by one, extend at least one slit from each opening, the pedestal that the size of those openings is enough to hold thimble passes through, and the width of described slit is between the width of thimble and pedestal.
2. the pull down mechanism of support pin as claimed in claim 1 is characterized in that, described level altitude is higher than the height of described pedestal at least.
3. the pull down mechanism of support pin is applied on the drawing out type reactor, and the base plate of this drawing out type reactor has several thimbles, and each thimble has the bigger pedestal of diameter respectively, and this pull down mechanism comprises at least:
One elevating mechanism;
One first sheet material, first side of this first sheet material has several first breach, is fixed on the fixed pedestal with a level altitude; And
One second sheet material, one first side of this second sheet material and first side of first sheet material are arranged to form a slit with an interval adjacent parallel, first side of second sheet material has several second breach, those second breach respectively with relative several openings that form of several first breach of described first sheet material to hold those thimbles respectively one by one, and second sheet material is fixed on this fixed pedestal with described level altitude, wherein the diameter of those openings is greater than the diameter of the pedestal of thimble, and the width of this slit is between the diameter of thimble and pedestal.
4. the pull down mechanism of support pin as claimed in claim 3 is characterized in that, described level altitude is higher than the height of described pedestal at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100490115A CN100358092C (en) | 2004-06-14 | 2004-06-14 | Pull-down mechanism for supporting centre |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100490115A CN100358092C (en) | 2004-06-14 | 2004-06-14 | Pull-down mechanism for supporting centre |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1713339A CN1713339A (en) | 2005-12-28 |
| CN100358092C true CN100358092C (en) | 2007-12-26 |
Family
ID=35718895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100490115A Expired - Fee Related CN100358092C (en) | 2004-06-14 | 2004-06-14 | Pull-down mechanism for supporting centre |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100358092C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374716A (en) * | 2015-11-20 | 2016-03-02 | 南通富士通微电子股份有限公司 | Thimble device for preventing magnetic thimbles from deviating |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000100791A (en) * | 1998-09-24 | 2000-04-07 | Sony Corp | Resist removal device |
| JP2000100915A (en) * | 1998-09-25 | 2000-04-07 | Seiko Epson Corp | Semiconductor manufacturing apparatus |
| US6104002A (en) * | 1995-05-12 | 2000-08-15 | Tokyo Electron Limited | Heat treating apparatus |
| JP2002025904A (en) * | 2000-05-01 | 2002-01-25 | Tokyo Electron Ltd | Heat treatment equipment and substrate treatment device |
| US6435798B1 (en) * | 1999-04-09 | 2002-08-20 | Asm Japan K.K. | Semiconductor processing apparatus with substrate-supporting mechanism |
-
2004
- 2004-06-14 CN CNB2004100490115A patent/CN100358092C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6104002A (en) * | 1995-05-12 | 2000-08-15 | Tokyo Electron Limited | Heat treating apparatus |
| JP2000100791A (en) * | 1998-09-24 | 2000-04-07 | Sony Corp | Resist removal device |
| JP2000100915A (en) * | 1998-09-25 | 2000-04-07 | Seiko Epson Corp | Semiconductor manufacturing apparatus |
| US6435798B1 (en) * | 1999-04-09 | 2002-08-20 | Asm Japan K.K. | Semiconductor processing apparatus with substrate-supporting mechanism |
| JP2002025904A (en) * | 2000-05-01 | 2002-01-25 | Tokyo Electron Ltd | Heat treatment equipment and substrate treatment device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1713339A (en) | 2005-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100549359B1 (en) | Apparatus and method for thin die detachment | |
| JP5813432B2 (en) | Die bonder and bonding method | |
| JP2000237983A (en) | Board chuck device | |
| CN100358092C (en) | Pull-down mechanism for supporting centre | |
| TWI253676B (en) | A pin set for a reactor | |
| TWI604557B (en) | Wafer catching equipment | |
| JP3817894B2 (en) | Chip push-up device and die bonding device using the same | |
| CN219525470U (en) | Automatic jacking chuck mechanism for screen pad printing | |
| CN112420588A (en) | Equipment and method for improving adsorption stability of Taiko sheet | |
| JP4230178B2 (en) | Semiconductor chip peeling apparatus and method | |
| WO2002033743A1 (en) | Wafer holder, wafer support member, wafer holding device, and heat treating furnace | |
| KR20090085262A (en) | Die attach equipment operating reverse pyramid type and operation method thereof | |
| JPH11130250A (en) | Substrate carrying device attached with pitch change | |
| JPH0376139A (en) | Upward pushing movement of semiconductor element | |
| JP2006004956A (en) | Die pickup device | |
| US20050016469A1 (en) | Downward mechanism for support pins | |
| CN218447864U (en) | Transfer mechanism of silicon chip | |
| JP2011204868A (en) | Method of transferring semiconductor chip and semiconductor device manufacturing apparatus using the same | |
| CN112230454B (en) | Method and device for preventing substrate from being scratched | |
| JP2000323437A (en) | Semiconductor chip separating device | |
| JP5214739B2 (en) | Chip peeling method, semiconductor device manufacturing method, and chip peeling apparatus | |
| JP7384489B2 (en) | Substrate support assembly and substrate processing equipment | |
| JP2013222715A (en) | Pickup method and pickup device | |
| CN216487963U (en) | Wafer bonding equipment that separates | |
| CN219534503U (en) | Protection device for wafer double-sided process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071226 Termination date: 20160614 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |