CN105374716A - Thimble device for preventing magnetic thimbles from deviating - Google Patents
Thimble device for preventing magnetic thimbles from deviating Download PDFInfo
- Publication number
- CN105374716A CN105374716A CN201510810917.2A CN201510810917A CN105374716A CN 105374716 A CN105374716 A CN 105374716A CN 201510810917 A CN201510810917 A CN 201510810917A CN 105374716 A CN105374716 A CN 105374716A
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- CN
- China
- Prior art keywords
- thimble
- thimbles
- backshank
- magnetic
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
The invention discloses a thimble device for preventing magnetic thimbles from deviating. Thimbles and thimble caps are used in a matching way; the thimble caps are provided with thimble holes; the thimbles and the thimble holes are arranged in one-to-one correspondence; the thimbles comprise thimble points, thimble bodies which are connected with the thimble points, and thimble tails which are connected with the thimble bodies from top to bottom in sequence; and the thimble tails and the thimble bodies form boss structures. In the thimble device for preventing the magnetic thimbles from deviating provided by the invention, the bottoms of the thimbles are enlarged, so that the bottom sizes of the thimbles are greater than the diameters of the thimble holes of the thimble caps. The thimble tails of the thimbles are enlarged, so that the magnetic contact areas of the thimbles are increased, and the adsorption acting force of a magnet on the thimbles is increased on one hand. On the other hand, the increased sizes of the thimble tails are greater than the diameters of the thimble holes in the thimble caps, so that the thimbles can be effectively prevented from penetrating through the thimble holes during use, and being separated from the thimble caps. Thus, the problem of deviation of the magnetic thimbles can be solved effectively.
Description
Technical field
The disclosure relates generally to flip-chip encapsulation field, is specifically related to magnetic thimble, particularly relates to a kind of push pin device preventing magnetic pin flying needle.
Background technology
Be illustrated in figure 1 traditional thimble structure, the magnetic thimble that traditional load or flip-chip use is fixed thimble by screw and is developed, and just changes in the required precision of thimble, and ensures bottom thimble smooth, be applied on magnetic thimble base.
But, above-mentioned traditional thimble 1 is adsorbed on base by the magnet of base completely, leaning out at thimble assists chip to help in the process of its demoulding, because film is to the package action of thimble, if the active force of film is greater than the active force of magnet, base is when reset, and traditional thimble 1 has tunicle to wrap up the risk of extracting thimble cap out; If 2 to Fig. 5 is thimble operating diagram in prior art, when traditional thimble 1 is at initial position, tradition thimble 1 by normal sorption on magnet base 2, chip 5 demoulding is assisted when traditional thimble 1 leans out thimble cap 3, film 4 can wrap up traditional thimble 1, in thimble cap 3 reseting procedure, the parcel power of film 4 to traditional thimble 1 is greater than the absorption affinity of magnet base 2 to traditional thimble 1, and traditional thimble 1 can be drawn out of thimble cap 3; When thimble cap 3 resets, magnet base 2 can lack traditional thimble 1, cause magnetic pin flying needle.
Summary of the invention
In view of above-mentioned defect of the prior art or deficiency, expect to provide a kind of thimble preventing magnetic pin flying needle.
There is provided a kind of push pin device preventing magnetic pin flying needle on the one hand, thimble and thimble cap with the use of, described thimble cap is provided with pin hole, described thimble and described pin hole one_to_one corresponding are arranged, described thimble comprises from top to bottom successively: needle point, the thimble body be connected with described needle point, the backshank be connected with described thimble body, described backshank and described thimble body form boss structure, and described boss structure upper end width is less than lower end width.
The push pin device of magnetic pin flying needle that prevents provided by the invention increases bottom thimble, the size bottom thimble is made to be greater than the pinhole diameter of thimble cap, by increasing the backshank of thimble, increase the magnetic contact area of thimble, increase magnet effectively prevents magnetic pin flying needle problem to the adsorption of thimble.
Accompanying drawing explanation
By reading the detailed description done non-limiting example done with reference to the following drawings, the other features, objects and advantages of the application will become more obvious:
Fig. 1 is thimble structure schematic diagram in prior art;
Fig. 2-Fig. 5 is thimble using state schematic diagram in prior art;
Fig. 6 is thimble structure schematic diagram of the present invention;
Fig. 7-Figure 10 is thimble using state schematic diagram of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the application is described in further detail.Be understandable that, specific embodiment described herein is only for explaining related invention, but not the restriction to this invention.It also should be noted that, for convenience of description, illustrate only in accompanying drawing and invent relevant part.
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the application in detail in conjunction with the embodiments.
Please refer to Fig. 6 and Fig. 7, the invention provides a kind of push pin device of placing magnetic pin flying needle, thimble 6 and thimble cap 3 with the use of, described thimble cap 3 is provided with pin hole, described thimble 6 is arranged with described pin hole one_to_one corresponding, described thimble 6 comprises from top to bottom successively: needle point 61, the thimble body 62 be connected with described needle point 61, the backshank 63 be connected with described thimble body 62, described backshank 63 forms boss structure with described thimble body 62, and described boss structure upper end width is less than lower end width.
Thimble in the present invention coordinates thimble cap to use together usually, and the backshank of thimble is become up-small and down-big boss structure with thimble body design, can effectively prevent thimble to be drawn out the pin hole of thimble cap when in use.
Optionally, described backshank 63 cross section is circular or polygon.
Optionally, described backshank 63 cross-sectional width is greater than described pinhole diameter.Pinhole diameter on the ratio thimble cap designed by described backshank is slightly large, when thimble will be drawn out thimble cap, by the stop of backshank, stops thimble to be drawn out thimble cap.
As shown in Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10, in the present invention when initial position, thimble 6 by normal sorption on magnet base 2, when thimble 6 lean out thimble cap 3 assist chip 5 demoulding time, film 4 can wrap up thimble 6 equally, in thimble cap 3 reseting procedure, even if the parcel power of film 4 pairs of thimbles 1 is greater than the absorption affinity of magnet base 2 pairs of thimbles 1, due to the existence of backshank 63, and the width of described backshank 63 is greater than the diameter of pin hole on thimble cap 3, backshank 63 can be held thimble 6 and stop that thimble leans out pin hole; After thimble cap 3 resets, thimble 6, because the magnetic adsorptive power of magnet base 2 is got back on magnet base 2, therefore can not cause the situation of magnetic pin flying needle.
Optionally, described needle point 61, described thimble body 62 and described backshank 63 are formed in one structure.
Optionally, described thimble 6 is magnetic material.When in use, be fixed by the absorption affinity of magnet base, thimble is magnetic material to described thimble, is generally iron, ensures that magnet base is to the suction-operated of described thimble; Described thimble, thimble body and backshank are one-body molded simultaneously, ensure that the service quality of thimble, thimble body will be made with backshank to be separated the problem causing magnetic pin flying needle because of the absorption affinity of film and the magnetive attraction of magnet base.
Optionally, described backshank cross-sectional width is 0.15-0.2mm.
Optionally, described backshank thickness is 0.8-0.1mm.Thimble in the present invention helps when chip package to use during demoulding chip, its volume is smaller, and gap between each thimble is also not too large, so the design of the backshank width of thimble and thickness needs between certain scope, the use of thimble just can be made more convenient
The push pin device of magnetic pin flying needle that prevents provided by the invention increases bottom thimble, the size bottom thimble is made to be greater than the pinhole diameter of thimble cap, by increasing the backshank of thimble, on the one hand, increase the magnetic contact area of thimble, increase magnet to the adsorption of thimble; On the other hand, the size of the thimble backshank of increase is greater than the diameter of pin hole on thimble cap, effectively can prevent thimble in use through pin hole, detach thimble cap; The above-mentioned problem that effectively can prevent magnetic pin flying needle.
More than describe and be only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art are to be understood that, invention scope involved in the application, be not limited to the technical scheme of the particular combination of above-mentioned technical characteristic, also should be encompassed in when not departing from described inventive concept, other technical scheme of being carried out combination in any by above-mentioned technical characteristic or its equivalent feature and being formed simultaneously.The technical characteristic that such as, disclosed in above-mentioned feature and the application (but being not limited to) has similar functions is replaced mutually and the technical scheme formed.
Claims (7)
1. one kind prevents the push pin device of magnetic pin flying needle, thimble and thimble cap with the use of, described thimble cap is provided with pin hole, described thimble and described pin hole one_to_one corresponding are arranged, and it is characterized in that, described thimble comprises from top to bottom successively: needle point, the thimble body be connected with described needle point, the backshank be connected with described thimble body, described backshank and described thimble body form boss structure, and described boss structure upper end width is less than lower end width.
2. the push pin device preventing magnetic pin flying needle according to claim 1, is characterized in that, described backshank cross section is circular or polygonized structure.
3. the push pin device preventing magnetic pin flying needle according to claim 2, is characterized in that, described backshank cross-sectional width is greater than described pinhole diameter.
4. the push pin device preventing magnetic pin flying needle according to claim 1, is characterized in that, described needle point, described thimble body and described backshank are formed in one structure.
5. the push pin device preventing magnetic pin flying needle according to claim 4, is characterized in that, described thimble is magnetic material.
6. the push pin device preventing magnetic pin flying needle according to claim 1, is characterized in that, described backshank cross-sectional width is: 0.15-0.2mm.
7. the push pin device preventing magnetic pin flying needle according to claim 1, is characterized in that, described backshank thickness is 0.8-0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510810917.2A CN105374716A (en) | 2015-11-20 | 2015-11-20 | Thimble device for preventing magnetic thimbles from deviating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510810917.2A CN105374716A (en) | 2015-11-20 | 2015-11-20 | Thimble device for preventing magnetic thimbles from deviating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105374716A true CN105374716A (en) | 2016-03-02 |
Family
ID=55376786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510810917.2A Pending CN105374716A (en) | 2015-11-20 | 2015-11-20 | Thimble device for preventing magnetic thimbles from deviating |
Country Status (1)
| Country | Link |
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| CN (1) | CN105374716A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093575A (en) * | 2017-05-08 | 2017-08-25 | 大连佳峰自动化股份有限公司 | Thimble system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1713339A (en) * | 2004-06-14 | 2005-12-28 | 中华映管股份有限公司 | Pull-down mechanism for supporting centre |
| US20060216665A1 (en) * | 2005-03-25 | 2006-09-28 | Tokyo Electron Limited | Heating apparatus, coating and development apparatus, and heating method |
| CN200976727Y (en) * | 2006-11-24 | 2007-11-14 | 比亚迪股份有限公司 | Device for positioning PCB |
| CN102254852A (en) * | 2011-08-23 | 2011-11-23 | 南通富士通微电子股份有限公司 | Thimble cap of die bonder |
| CN103331243A (en) * | 2013-05-28 | 2013-10-02 | 上海宏力半导体制造有限公司 | Heat treatment chamber of coating equipment |
-
2015
- 2015-11-20 CN CN201510810917.2A patent/CN105374716A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1713339A (en) * | 2004-06-14 | 2005-12-28 | 中华映管股份有限公司 | Pull-down mechanism for supporting centre |
| US20060216665A1 (en) * | 2005-03-25 | 2006-09-28 | Tokyo Electron Limited | Heating apparatus, coating and development apparatus, and heating method |
| CN200976727Y (en) * | 2006-11-24 | 2007-11-14 | 比亚迪股份有限公司 | Device for positioning PCB |
| CN102254852A (en) * | 2011-08-23 | 2011-11-23 | 南通富士通微电子股份有限公司 | Thimble cap of die bonder |
| CN103331243A (en) * | 2013-05-28 | 2013-10-02 | 上海宏力半导体制造有限公司 | Heat treatment chamber of coating equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093575A (en) * | 2017-05-08 | 2017-08-25 | 大连佳峰自动化股份有限公司 | Thimble system |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Applicant before: Fujitsu Microelectronics Co., Ltd., Nantong |
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| COR | Change of bibliographic data | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160302 |