CN100355040C - 等离子体处理方法和老化结束检测方法以及等离子体处理装置 - Google Patents

等离子体处理方法和老化结束检测方法以及等离子体处理装置 Download PDF

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Publication number
CN100355040C
CN100355040C CNB038058618A CN03805861A CN100355040C CN 100355040 C CN100355040 C CN 100355040C CN B038058618 A CNB038058618 A CN B038058618A CN 03805861 A CN03805861 A CN 03805861A CN 100355040 C CN100355040 C CN 100355040C
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China
Prior art keywords
aging
measurement data
processing container
plasma processing
test
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Expired - Fee Related
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CNB038058618A
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English (en)
Chinese (zh)
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CN1643664A (zh
Inventor
高山直树
王斌
原田智
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNB038058618A 2002-03-12 2003-03-12 等离子体处理方法和老化结束检测方法以及等离子体处理装置 Expired - Fee Related CN100355040C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002066369A JP4173311B2 (ja) 2002-03-12 2002-03-12 シーズニング終了検知方法及びプラズマ処理方法並びにプラズマ処理装置
JP66369/2002 2002-03-12

Publications (2)

Publication Number Publication Date
CN1643664A CN1643664A (zh) 2005-07-20
CN100355040C true CN100355040C (zh) 2007-12-12

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CNB038058618A Expired - Fee Related CN100355040C (zh) 2002-03-12 2003-03-12 等离子体处理方法和老化结束检测方法以及等离子体处理装置

Country Status (5)

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JP (1) JP4173311B2 (enExample)
CN (1) CN100355040C (enExample)
AU (1) AU2003221362A1 (enExample)
TW (1) TW200421411A (enExample)
WO (1) WO2003077303A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230315047A1 (en) * 2022-03-31 2023-10-05 Tokyo Electron Limited Virtual metrology model based seasoning optimization

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7313451B2 (en) 2002-03-12 2007-12-25 Tokyo Electron Limited Plasma processing method, detecting method of completion of seasoning, plasma processing apparatus and storage medium
KR100557673B1 (ko) * 2003-12-22 2006-03-06 어댑티브프라즈마테크놀로지 주식회사 플라즈마 장비를 시즌닝하는 방법
US7393459B2 (en) * 2004-08-06 2008-07-01 Applied Materials, Inc. Method for automatic determination of substrates states in plasma processing chambers
JP4640828B2 (ja) * 2006-03-17 2011-03-02 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN102315112B (zh) * 2011-09-28 2016-03-09 上海华虹宏力半导体制造有限公司 堆栈金属栅极的刻蚀方法
US10896833B2 (en) * 2018-05-09 2021-01-19 Applied Materials, Inc. Methods and apparatus for detecting an endpoint of a seasoning process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131599A (ja) * 1997-07-08 1999-02-02 Sumitomo Metal Ind Ltd プラズマ処理装置における予熱方法及びプラズマ処理装置
EP1089146A2 (en) * 1999-07-07 2001-04-04 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
JP2002025981A (ja) * 2000-07-04 2002-01-25 Tokyo Electron Ltd 運転状態の監視方法及び処理装置の評価方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131599A (ja) * 1997-07-08 1999-02-02 Sumitomo Metal Ind Ltd プラズマ処理装置における予熱方法及びプラズマ処理装置
EP1089146A2 (en) * 1999-07-07 2001-04-04 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
JP2002025981A (ja) * 2000-07-04 2002-01-25 Tokyo Electron Ltd 運転状態の監視方法及び処理装置の評価方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230315047A1 (en) * 2022-03-31 2023-10-05 Tokyo Electron Limited Virtual metrology model based seasoning optimization
US12032355B2 (en) * 2022-03-31 2024-07-09 Tokyo Electron Limited Virtual metrology model based seasoning optimization

Also Published As

Publication number Publication date
TWI297904B (enExample) 2008-06-11
JP4173311B2 (ja) 2008-10-29
CN1643664A (zh) 2005-07-20
JP2003264179A (ja) 2003-09-19
TW200421411A (en) 2004-10-16
WO2003077303A1 (fr) 2003-09-18
AU2003221362A1 (en) 2003-09-22

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Granted publication date: 20071212

Termination date: 20180312