AU2003221362A1 - Plasma processing method, seasoning end detection method, and plasma processing device - Google Patents

Plasma processing method, seasoning end detection method, and plasma processing device

Info

Publication number
AU2003221362A1
AU2003221362A1 AU2003221362A AU2003221362A AU2003221362A1 AU 2003221362 A1 AU2003221362 A1 AU 2003221362A1 AU 2003221362 A AU2003221362 A AU 2003221362A AU 2003221362 A AU2003221362 A AU 2003221362A AU 2003221362 A1 AU2003221362 A1 AU 2003221362A1
Authority
AU
Australia
Prior art keywords
plasma processing
end detection
processing device
detection method
seasoning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003221362A
Other languages
English (en)
Inventor
Satoshi Harada
Hin Oh
Naoki Takayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003221362A1 publication Critical patent/AU2003221362A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2003221362A 2002-03-12 2003-03-12 Plasma processing method, seasoning end detection method, and plasma processing device Abandoned AU2003221362A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-66369 2002-03-12
JP2002066369A JP4173311B2 (ja) 2002-03-12 2002-03-12 シーズニング終了検知方法及びプラズマ処理方法並びにプラズマ処理装置
PCT/JP2003/002932 WO2003077303A1 (fr) 2002-03-12 2003-03-12 Procede de traitement par plasma, methode de detection de fin de stabilisation et dispositif de traitement par plasma

Publications (1)

Publication Number Publication Date
AU2003221362A1 true AU2003221362A1 (en) 2003-09-22

Family

ID=27800250

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003221362A Abandoned AU2003221362A1 (en) 2002-03-12 2003-03-12 Plasma processing method, seasoning end detection method, and plasma processing device

Country Status (5)

Country Link
JP (1) JP4173311B2 (enExample)
CN (1) CN100355040C (enExample)
AU (1) AU2003221362A1 (enExample)
TW (1) TW200421411A (enExample)
WO (1) WO2003077303A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7313451B2 (en) 2002-03-12 2007-12-25 Tokyo Electron Limited Plasma processing method, detecting method of completion of seasoning, plasma processing apparatus and storage medium
KR100557673B1 (ko) * 2003-12-22 2006-03-06 어댑티브프라즈마테크놀로지 주식회사 플라즈마 장비를 시즌닝하는 방법
US7393459B2 (en) * 2004-08-06 2008-07-01 Applied Materials, Inc. Method for automatic determination of substrates states in plasma processing chambers
JP4640828B2 (ja) * 2006-03-17 2011-03-02 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN102315112B (zh) * 2011-09-28 2016-03-09 上海华虹宏力半导体制造有限公司 堆栈金属栅极的刻蚀方法
US10896833B2 (en) * 2018-05-09 2021-01-19 Applied Materials, Inc. Methods and apparatus for detecting an endpoint of a seasoning process
US12032355B2 (en) * 2022-03-31 2024-07-09 Tokyo Electron Limited Virtual metrology model based seasoning optimization

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131599A (ja) * 1997-07-08 1999-02-02 Sumitomo Metal Ind Ltd プラズマ処理装置における予熱方法及びプラズマ処理装置
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
JP4570736B2 (ja) * 2000-07-04 2010-10-27 東京エレクトロン株式会社 運転状態の監視方法

Also Published As

Publication number Publication date
TWI297904B (enExample) 2008-06-11
CN1643664A (zh) 2005-07-20
WO2003077303A1 (fr) 2003-09-18
JP4173311B2 (ja) 2008-10-29
TW200421411A (en) 2004-10-16
CN100355040C (zh) 2007-12-12
JP2003264179A (ja) 2003-09-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase