AU2003221362A1 - Plasma processing method, seasoning end detection method, and plasma processing device - Google Patents
Plasma processing method, seasoning end detection method, and plasma processing deviceInfo
- Publication number
- AU2003221362A1 AU2003221362A1 AU2003221362A AU2003221362A AU2003221362A1 AU 2003221362 A1 AU2003221362 A1 AU 2003221362A1 AU 2003221362 A AU2003221362 A AU 2003221362A AU 2003221362 A AU2003221362 A AU 2003221362A AU 2003221362 A1 AU2003221362 A1 AU 2003221362A1
- Authority
- AU
- Australia
- Prior art keywords
- plasma processing
- end detection
- processing device
- detection method
- seasoning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002066369A JP4173311B2 (en) | 2002-03-12 | 2002-03-12 | Seasoning completion detection method, plasma processing method, and plasma processing apparatus |
JP2002-66369 | 2002-03-12 | ||
PCT/JP2003/002932 WO2003077303A1 (en) | 2002-03-12 | 2003-03-12 | Plasma processing method, seasoning end detection method, and plasma processing device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003221362A1 true AU2003221362A1 (en) | 2003-09-22 |
Family
ID=27800250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003221362A Abandoned AU2003221362A1 (en) | 2002-03-12 | 2003-03-12 | Plasma processing method, seasoning end detection method, and plasma processing device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4173311B2 (en) |
CN (1) | CN100355040C (en) |
AU (1) | AU2003221362A1 (en) |
TW (1) | TW200421411A (en) |
WO (1) | WO2003077303A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7313451B2 (en) | 2002-03-12 | 2007-12-25 | Tokyo Electron Limited | Plasma processing method, detecting method of completion of seasoning, plasma processing apparatus and storage medium |
KR100557673B1 (en) * | 2003-12-22 | 2006-03-06 | 어댑티브프라즈마테크놀로지 주식회사 | Method for seasoning plasma equipment |
US7393459B2 (en) * | 2004-08-06 | 2008-07-01 | Applied Materials, Inc. | Method for automatic determination of substrates states in plasma processing chambers |
JP4640828B2 (en) * | 2006-03-17 | 2011-03-02 | 東京エレクトロン株式会社 | Plasma processing method and plasma processing apparatus |
CN102315112B (en) * | 2011-09-28 | 2016-03-09 | 上海华虹宏力半导体制造有限公司 | The lithographic method of stacked metal gate |
US10896833B2 (en) * | 2018-05-09 | 2021-01-19 | Applied Materials, Inc. | Methods and apparatus for detecting an endpoint of a seasoning process |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1131599A (en) * | 1997-07-08 | 1999-02-02 | Sumitomo Metal Ind Ltd | Preheating method for plasma-processing device, and plasma-processing device |
US6368975B1 (en) * | 1999-07-07 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for monitoring a process by employing principal component analysis |
JP4570736B2 (en) * | 2000-07-04 | 2010-10-27 | 東京エレクトロン株式会社 | How to monitor operating conditions |
-
2002
- 2002-03-12 JP JP2002066369A patent/JP4173311B2/en not_active Expired - Fee Related
-
2003
- 2003-03-12 CN CNB038058618A patent/CN100355040C/en not_active Expired - Fee Related
- 2003-03-12 AU AU2003221362A patent/AU2003221362A1/en not_active Abandoned
- 2003-03-12 WO PCT/JP2003/002932 patent/WO2003077303A1/en active Application Filing
- 2003-03-12 TW TW92105530A patent/TW200421411A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1643664A (en) | 2005-07-20 |
WO2003077303A1 (en) | 2003-09-18 |
JP4173311B2 (en) | 2008-10-29 |
CN100355040C (en) | 2007-12-12 |
TWI297904B (en) | 2008-06-11 |
JP2003264179A (en) | 2003-09-19 |
TW200421411A (en) | 2004-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |