CN100352035C - 用于高纵横比半导体器件的掺硼氮化钛层 - Google Patents

用于高纵横比半导体器件的掺硼氮化钛层 Download PDF

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Publication number
CN100352035C
CN100352035C CNB028152131A CN02815213A CN100352035C CN 100352035 C CN100352035 C CN 100352035C CN B028152131 A CNB028152131 A CN B028152131A CN 02815213 A CN02815213 A CN 02815213A CN 100352035 C CN100352035 C CN 100352035C
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CN
China
Prior art keywords
contact
conductive contact
channel
layer
titanium
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Expired - Lifetime
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CNB028152131A
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English (en)
Chinese (zh)
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CN1539164A (zh
Inventor
阿马尔·德拉
苏伊特·沙兰
保尔·卡斯特罗维洛
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Micron Technology Inc
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Micron Technology Inc
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Publication of CN1539164A publication Critical patent/CN1539164A/zh
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Publication of CN100352035C publication Critical patent/CN100352035C/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Semiconductor Memories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CNB028152131A 2001-07-31 2002-07-30 用于高纵横比半导体器件的掺硼氮化钛层 Expired - Lifetime CN100352035C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/918,919 US6696368B2 (en) 2001-07-31 2001-07-31 Titanium boronitride layer for high aspect ratio semiconductor devices
US09/918,919 2001-07-31

Publications (2)

Publication Number Publication Date
CN1539164A CN1539164A (zh) 2004-10-20
CN100352035C true CN100352035C (zh) 2007-11-28

Family

ID=25441171

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028152131A Expired - Lifetime CN100352035C (zh) 2001-07-31 2002-07-30 用于高纵横比半导体器件的掺硼氮化钛层

Country Status (7)

Country Link
US (2) US6696368B2 (enExample)
EP (1) EP1412976B1 (enExample)
JP (1) JP4168397B2 (enExample)
KR (1) KR100715389B1 (enExample)
CN (1) CN100352035C (enExample)
AT (1) ATE532212T1 (enExample)
WO (1) WO2003012860A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030036242A1 (en) * 2001-08-16 2003-02-20 Haining Yang Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions
US6746952B2 (en) * 2001-08-29 2004-06-08 Micron Technology, Inc. Diffusion barrier layer for semiconductor wafer fabrication
US7067416B2 (en) * 2001-08-29 2006-06-27 Micron Technology, Inc. Method of forming a conductive contact
US7164165B2 (en) * 2002-05-16 2007-01-16 Micron Technology, Inc. MIS capacitor
US7150789B2 (en) * 2002-07-29 2006-12-19 Micron Technology, Inc. Atomic layer deposition methods
US6753271B2 (en) 2002-08-15 2004-06-22 Micron Technology, Inc. Atomic layer deposition methods
US6890596B2 (en) * 2002-08-15 2005-05-10 Micron Technology, Inc. Deposition methods
US6673701B1 (en) * 2002-08-27 2004-01-06 Micron Technology, Inc. Atomic layer deposition methods
KR100487563B1 (ko) * 2003-04-30 2005-05-03 삼성전자주식회사 반도체 소자 및 그 형성 방법
US7233073B2 (en) * 2003-07-31 2007-06-19 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same
US7358172B2 (en) * 2006-02-21 2008-04-15 International Business Machines Corporation Poly filled substrate contact on SOI structure
CN103022163A (zh) * 2011-09-22 2013-04-03 比亚迪股份有限公司 一种晶硅太阳能电池及其制备方法
EP3032575B1 (en) * 2014-12-08 2020-10-21 IMEC vzw Method for forming an electrical contact.
US10854505B2 (en) 2016-03-24 2020-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Removing polymer through treatment
US10361213B2 (en) * 2016-06-28 2019-07-23 Sandisk Technologies Llc Three dimensional memory device containing multilayer wordline barrier films and method of making thereof
US10355139B2 (en) 2016-06-28 2019-07-16 Sandisk Technologies Llc Three-dimensional memory device with amorphous barrier layer and method of making thereof
US20180331118A1 (en) * 2017-05-12 2018-11-15 Sandisk Technologies Llc Multi-layer barrier for cmos under array type memory device and method of making thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267220A (ja) * 1992-03-19 1993-10-15 Sony Corp 半導体装置の密着層及びメタルプラグ形成方法
US5976976A (en) * 1997-08-21 1999-11-02 Micron Technology, Inc. Method of forming titanium silicide and titanium by chemical vapor deposition
US20010002071A1 (en) * 1999-08-24 2001-05-31 Agarwal Vishnu K. Boron incorporated diffusion barrier material

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747116A (en) 1994-11-08 1998-05-05 Micron Technology, Inc. Method of forming an electrical contact to a silicon substrate
US5946594A (en) 1996-01-02 1999-08-31 Micron Technology, Inc. Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
FR2744461B1 (fr) * 1996-02-01 1998-05-22 Tecmachine Nitrure de titane dope par du bore, revetement de substrat a base de ce nouveau compose, possedant une durete elevee et permettant une tres bonne resistance a l'usure, et pieces comportant un tel revetement
US5908947A (en) 1996-02-09 1999-06-01 Micron Technology, Inc. Difunctional amino precursors for the deposition of films comprising metals
US5990021A (en) 1997-12-19 1999-11-23 Micron Technology, Inc. Integrated circuit having self-aligned CVD-tungsten/titanium contact plugs strapped with metal interconnect and method of manufacture
US5700716A (en) 1996-02-23 1997-12-23 Micron Technology, Inc. Method for forming low contact resistance contacts, vias, and plugs with diffusion barriers
JPH09306870A (ja) 1996-05-15 1997-11-28 Nec Corp バリア膜の形成方法
US5977636A (en) 1997-01-17 1999-11-02 Micron Technology, Inc. Method of forming an electrically conductive contact plug, method of forming a reactive or diffusion barrier layer over a substrate, integrated circuitry, and method of forming a layer of titanium boride
US5856237A (en) * 1997-10-20 1999-01-05 Industrial Technology Research Institute Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer
US6037252A (en) 1997-11-05 2000-03-14 Tokyo Electron Limited Method of titanium nitride contact plug formation
US6156638A (en) 1998-04-10 2000-12-05 Micron Technology, Inc. Integrated circuitry and method of restricting diffusion from one material to another
KR100331261B1 (ko) * 1998-12-30 2002-08-22 주식회사 하이닉스반도체 반도체장치의 제조 방법
US6086442A (en) 1999-03-01 2000-07-11 Micron Technology, Inc. Method of forming field emission devices
US6329670B1 (en) * 1999-04-06 2001-12-11 Micron Technology, Inc. Conductive material for integrated circuit fabrication
US6200649B1 (en) * 1999-07-21 2001-03-13 Southwest Research Institute Method of making titanium boronitride coatings using ion beam assisted deposition
DE10019164A1 (de) 2000-04-12 2001-10-18 Mannesmann Ag SIM-Lock auf bestimmte IMSI-Bereiche einer SIM-Karte für Prepaid- und Postpaid-Karten
US7067416B2 (en) * 2001-08-29 2006-06-27 Micron Technology, Inc. Method of forming a conductive contact
US6746952B2 (en) * 2001-08-29 2004-06-08 Micron Technology, Inc. Diffusion barrier layer for semiconductor wafer fabrication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267220A (ja) * 1992-03-19 1993-10-15 Sony Corp 半導体装置の密着層及びメタルプラグ形成方法
US5976976A (en) * 1997-08-21 1999-11-02 Micron Technology, Inc. Method of forming titanium silicide and titanium by chemical vapor deposition
US20010002071A1 (en) * 1999-08-24 2001-05-31 Agarwal Vishnu K. Boron incorporated diffusion barrier material

Also Published As

Publication number Publication date
EP1412976B1 (en) 2011-11-02
KR20040019102A (ko) 2004-03-04
US20030025206A1 (en) 2003-02-06
CN1539164A (zh) 2004-10-20
JP2005527098A (ja) 2005-09-08
US6822299B2 (en) 2004-11-23
WO2003012860A3 (en) 2003-11-27
WO2003012860A2 (en) 2003-02-13
ATE532212T1 (de) 2011-11-15
US20030075802A1 (en) 2003-04-24
KR100715389B1 (ko) 2007-05-08
EP1412976A2 (en) 2004-04-28
US6696368B2 (en) 2004-02-24
JP4168397B2 (ja) 2008-10-22

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Granted publication date: 20071128