CN100343957C - 晶圆喷洗装置 - Google Patents
晶圆喷洗装置 Download PDFInfo
- Publication number
- CN100343957C CN100343957C CNB2003101228873A CN200310122887A CN100343957C CN 100343957 C CN100343957 C CN 100343957C CN B2003101228873 A CNB2003101228873 A CN B2003101228873A CN 200310122887 A CN200310122887 A CN 200310122887A CN 100343957 C CN100343957 C CN 100343957C
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- CN
- China
- Prior art keywords
- wafer
- shower nozzle
- hydro
- cleaning fluid
- jetter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101228873A CN100343957C (zh) | 2003-12-25 | 2003-12-25 | 晶圆喷洗装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101228873A CN100343957C (zh) | 2003-12-25 | 2003-12-25 | 晶圆喷洗装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1632924A CN1632924A (zh) | 2005-06-29 |
CN100343957C true CN100343957C (zh) | 2007-10-17 |
Family
ID=34844661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101228873A Expired - Fee Related CN100343957C (zh) | 2003-12-25 | 2003-12-25 | 晶圆喷洗装置 |
Country Status (1)
Country | Link |
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CN (1) | CN100343957C (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111826632A (zh) * | 2019-04-22 | 2020-10-27 | 上海新微技术研发中心有限公司 | 一种非晶硅薄膜的沉积方法及沉积设备 |
CN110508545A (zh) * | 2019-09-24 | 2019-11-29 | 武汉新芯集成电路制造有限公司 | 晶圆清洗装置及方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6021786A (en) * | 1996-03-30 | 2000-02-08 | Samsung Electronics Co., Ltd. | Wafer treatment method using hydrophilic making fluid supply |
WO2002049085A1 (en) * | 2000-12-15 | 2002-06-20 | K.C.Tech Co., Ltd. | Apparatus for cleaning the edges of wafers |
CN1391263A (zh) * | 2001-06-13 | 2003-01-15 | 日本电气株式会社 | 用于清洗晶片的清洗水和清洗晶片的方法 |
JP2003017453A (ja) * | 2001-04-27 | 2003-01-17 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
CN1399312A (zh) * | 2001-07-25 | 2003-02-26 | 旺宏电子股份有限公司 | 晶片清洗装置 |
US6615854B1 (en) * | 1999-05-19 | 2003-09-09 | Ebara Corporation | Wafer cleaning apparatus |
-
2003
- 2003-12-25 CN CNB2003101228873A patent/CN100343957C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6021786A (en) * | 1996-03-30 | 2000-02-08 | Samsung Electronics Co., Ltd. | Wafer treatment method using hydrophilic making fluid supply |
US6615854B1 (en) * | 1999-05-19 | 2003-09-09 | Ebara Corporation | Wafer cleaning apparatus |
WO2002049085A1 (en) * | 2000-12-15 | 2002-06-20 | K.C.Tech Co., Ltd. | Apparatus for cleaning the edges of wafers |
JP2003017453A (ja) * | 2001-04-27 | 2003-01-17 | Dainippon Screen Mfg Co Ltd | 基板処理方法および基板処理装置 |
CN1391263A (zh) * | 2001-06-13 | 2003-01-15 | 日本电气株式会社 | 用于清洗晶片的清洗水和清洗晶片的方法 |
CN1399312A (zh) * | 2001-07-25 | 2003-02-26 | 旺宏电子股份有限公司 | 晶片清洗装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1632924A (zh) | 2005-06-29 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111123 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111123 Address after: 201203 No. 18 Zhangjiang Road, Shanghai Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai Zhangjiang Road, Zhangjiang High Tech Park of Pudong New Area No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071017 Termination date: 20181225 |