CN100341120C - 等离子体处理装置以及等离子体处理方法 - Google Patents
等离子体处理装置以及等离子体处理方法 Download PDFInfo
- Publication number
- CN100341120C CN100341120C CNB031495362A CN03149536A CN100341120C CN 100341120 C CN100341120 C CN 100341120C CN B031495362 A CNB031495362 A CN B031495362A CN 03149536 A CN03149536 A CN 03149536A CN 100341120 C CN100341120 C CN 100341120C
- Authority
- CN
- China
- Prior art keywords
- substrate
- electrode
- processed substrate
- plasma
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002206823 | 2002-07-16 | ||
JP2002206823A JP3880896B2 (ja) | 2002-07-16 | 2002-07-16 | プラズマ処理装置およびプラズマ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1477682A CN1477682A (zh) | 2004-02-25 |
CN100341120C true CN100341120C (zh) | 2007-10-03 |
Family
ID=31884270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031495362A Expired - Lifetime CN100341120C (zh) | 2002-07-16 | 2003-07-15 | 等离子体处理装置以及等离子体处理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3880896B2 (ja) |
KR (1) | KR100996018B1 (ja) |
CN (1) | CN100341120C (ja) |
TW (1) | TWI276173B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060054514A (ko) * | 2004-11-16 | 2006-05-22 | 삼성전자주식회사 | 건식 식각 장치 |
JP4839294B2 (ja) * | 2007-10-04 | 2011-12-21 | 株式会社アルバック | 半導体ウエハ保持装置 |
CN102934218B (zh) * | 2010-06-08 | 2016-05-04 | 艾克塞利斯科技公司 | 高温下具有机械夹持能力的受热静电夹头 |
CN105206495B (zh) * | 2015-08-17 | 2018-08-07 | 深圳市华星光电技术有限公司 | 干式蚀刻装置及阵列基板干式蚀刻去除静电方法 |
CN106920730A (zh) * | 2015-12-28 | 2017-07-04 | 中微半导体设备(上海)有限公司 | 一种清洁刻蚀硅基片等离子体处理装置的方法 |
CN106935463B (zh) * | 2017-02-27 | 2018-09-14 | 成都京东方光电科技有限公司 | 用于干法刻蚀的承载装置及干法刻蚀设备 |
US20210005493A1 (en) | 2017-11-28 | 2021-01-07 | Tokyo Electron Limited | Processing apparatus |
JP7329997B2 (ja) * | 2019-07-09 | 2023-08-21 | 日本特殊陶業株式会社 | 静電チャック装置 |
KR20210109998A (ko) * | 2020-02-28 | 2021-09-07 | 캐논 톡키 가부시키가이샤 | 흡착장치, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법 |
KR102637744B1 (ko) * | 2021-09-30 | 2024-02-19 | 주식회사 나이스플라즈마 | 클램프 링이 구비된 클램프 척 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0845911A (ja) * | 1994-07-29 | 1996-02-16 | Nippon Steel Corp | プラズマ処理装置用電極 |
JPH11111830A (ja) * | 1997-10-07 | 1999-04-23 | Tokyo Electron Ltd | 静電吸着装置および静電吸着方法、ならびにそれを用いた処理装置および処理方法 |
JP2001148368A (ja) * | 1999-11-19 | 2001-05-29 | Matsushita Electric Ind Co Ltd | 高周波印加電極とこの電極を用いたプラズマプロセス装置 |
JP2001284328A (ja) * | 2000-03-31 | 2001-10-12 | Taiheiyo Cement Corp | セラミック部品 |
US6331754B1 (en) * | 1999-05-13 | 2001-12-18 | Tokyo Electron Limited | Inductively-coupled-plasma-processing apparatus |
US6387208B2 (en) * | 2000-07-07 | 2002-05-14 | Tokyo Electron Limited | Inductive coupling plasma processing apparatus |
-
2002
- 2002-07-16 JP JP2002206823A patent/JP3880896B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-14 TW TW092113111A patent/TWI276173B/zh not_active IP Right Cessation
- 2003-07-15 CN CNB031495362A patent/CN100341120C/zh not_active Expired - Lifetime
- 2003-07-15 KR KR1020030048143A patent/KR100996018B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0845911A (ja) * | 1994-07-29 | 1996-02-16 | Nippon Steel Corp | プラズマ処理装置用電極 |
JPH11111830A (ja) * | 1997-10-07 | 1999-04-23 | Tokyo Electron Ltd | 静電吸着装置および静電吸着方法、ならびにそれを用いた処理装置および処理方法 |
US6331754B1 (en) * | 1999-05-13 | 2001-12-18 | Tokyo Electron Limited | Inductively-coupled-plasma-processing apparatus |
JP2001148368A (ja) * | 1999-11-19 | 2001-05-29 | Matsushita Electric Ind Co Ltd | 高周波印加電極とこの電極を用いたプラズマプロセス装置 |
JP2001284328A (ja) * | 2000-03-31 | 2001-10-12 | Taiheiyo Cement Corp | セラミック部品 |
US6387208B2 (en) * | 2000-07-07 | 2002-05-14 | Tokyo Electron Limited | Inductive coupling plasma processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWI276173B (en) | 2007-03-11 |
JP2004055585A (ja) | 2004-02-19 |
TW200403749A (en) | 2004-03-01 |
KR20040010179A (ko) | 2004-01-31 |
CN1477682A (zh) | 2004-02-25 |
KR100996018B1 (ko) | 2010-11-22 |
JP3880896B2 (ja) | 2007-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20071003 |