CN100339513C - 区熔硅单晶炉电气控制系统 - Google Patents
区熔硅单晶炉电气控制系统 Download PDFInfo
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- CN100339513C CN100339513C CNB2006100134779A CN200610013477A CN100339513C CN 100339513 C CN100339513 C CN 100339513C CN B2006100134779 A CNB2006100134779 A CN B2006100134779A CN 200610013477 A CN200610013477 A CN 200610013477A CN 100339513 C CN100339513 C CN 100339513C
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- 239000013078 crystal Substances 0.000 title claims abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 23
- 229910052710 silicon Inorganic materials 0.000 title claims description 23
- 239000010703 silicon Substances 0.000 title claims description 23
- 239000007789 gas Substances 0.000 claims abstract description 84
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 46
- 230000033001 locomotion Effects 0.000 claims abstract description 39
- 229910052786 argon Inorganic materials 0.000 claims abstract description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims abstract description 7
- 230000008859 change Effects 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000008901 benefit Effects 0.000 abstract description 3
- 229910001873 dinitrogen Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
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CNB2006100134779A CN100339513C (zh) | 2006-04-19 | 2006-04-19 | 区熔硅单晶炉电气控制系统 |
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CNB2006100134779A CN100339513C (zh) | 2006-04-19 | 2006-04-19 | 区熔硅单晶炉电气控制系统 |
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CN1865532A CN1865532A (zh) | 2006-11-22 |
CN100339513C true CN100339513C (zh) | 2007-09-26 |
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CNB2006100134779A Active CN100339513C (zh) | 2006-04-19 | 2006-04-19 | 区熔硅单晶炉电气控制系统 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101728232B (zh) * | 2008-10-22 | 2012-07-04 | 北京中科信电子装备有限公司 | 从硬件上防止工艺气体混合的控制方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102321913B (zh) * | 2011-10-11 | 2014-03-05 | 天津市环欧半导体材料技术有限公司 | 一种拉制8英寸区熔硅单晶热系统及工艺 |
CN102445919A (zh) * | 2011-12-20 | 2012-05-09 | 北京京仪世纪电子股份有限公司 | 一种砷化镓单晶炉电气控制系统 |
CN102605424A (zh) * | 2012-03-06 | 2012-07-25 | 浙江宏业新能源有限公司 | 多晶硅铸锭炉控制系统及控制方法 |
CN102912443B (zh) * | 2012-10-17 | 2016-02-17 | 北京七星华创电子股份有限公司 | 碳化硅晶体生长炉控制系统 |
CN103076766B (zh) * | 2013-01-30 | 2018-07-06 | 佛山市定中机械有限公司 | 一种基于数字运动控制器的印罐机数控系统 |
CN107815729A (zh) * | 2016-09-12 | 2018-03-20 | 上海新昇半导体科技有限公司 | 一种单晶炉 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126509A (en) * | 1975-11-14 | 1978-11-21 | Siemens Aktiengesellschaft | Process for producing phosophorous-doped silicon monocrystals having a select peripheral dopant concentration along a radial cross-section of such monocrystal |
CN1095505C (zh) * | 2000-03-30 | 2002-12-04 | 天津市环欧半导体材料技术有限公司 | 生产硅单晶的直拉区熔法 |
CN1455029A (zh) * | 2003-04-03 | 2003-11-12 | 天津市环欧半导体材料技术有限公司 | 气相预掺杂和中子辐照掺杂组合的区熔硅单晶的生产方法 |
CN1455028A (zh) * | 2002-12-30 | 2003-11-12 | 天津市环欧半导体材料技术有限公司 | 气相掺杂区熔硅单晶的生产方法 |
CN1724723A (zh) * | 2005-06-15 | 2006-01-25 | 天津市环欧半导体材料技术有限公司 | 大直径区熔硅单晶制备方法 |
CN2858676Y (zh) * | 2006-04-30 | 2007-01-17 | 天津市环欧半导体材料技术有限公司 | 区熔硅单晶炉电气控制装置 |
-
2006
- 2006-04-19 CN CNB2006100134779A patent/CN100339513C/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4126509A (en) * | 1975-11-14 | 1978-11-21 | Siemens Aktiengesellschaft | Process for producing phosophorous-doped silicon monocrystals having a select peripheral dopant concentration along a radial cross-section of such monocrystal |
CN1095505C (zh) * | 2000-03-30 | 2002-12-04 | 天津市环欧半导体材料技术有限公司 | 生产硅单晶的直拉区熔法 |
CN1455028A (zh) * | 2002-12-30 | 2003-11-12 | 天津市环欧半导体材料技术有限公司 | 气相掺杂区熔硅单晶的生产方法 |
CN1455029A (zh) * | 2003-04-03 | 2003-11-12 | 天津市环欧半导体材料技术有限公司 | 气相预掺杂和中子辐照掺杂组合的区熔硅单晶的生产方法 |
CN1724723A (zh) * | 2005-06-15 | 2006-01-25 | 天津市环欧半导体材料技术有限公司 | 大直径区熔硅单晶制备方法 |
CN2858676Y (zh) * | 2006-04-30 | 2007-01-17 | 天津市环欧半导体材料技术有限公司 | 区熔硅单晶炉电气控制装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101728232B (zh) * | 2008-10-22 | 2012-07-04 | 北京中科信电子装备有限公司 | 从硬件上防止工艺气体混合的控制方法 |
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CN1865532A (zh) | 2006-11-22 |
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Effective date of registration: 20181102 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 300384 Tianjin Huayuan Industrial Park (outside the ring) 12 East Hai Tai Road Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20191220 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring) Haitai Road No. 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |