CL2021002648A1 - Copper electrodeposition device - Google Patents

Copper electrodeposition device

Info

Publication number
CL2021002648A1
CL2021002648A1 CL2021002648A CL2021002648A CL2021002648A1 CL 2021002648 A1 CL2021002648 A1 CL 2021002648A1 CL 2021002648 A CL2021002648 A CL 2021002648A CL 2021002648 A CL2021002648 A CL 2021002648A CL 2021002648 A1 CL2021002648 A1 CL 2021002648A1
Authority
CL
Chile
Prior art keywords
electrodeposition device
copper electrodeposition
plates
main beams
anode
Prior art date
Application number
CL2021002648A
Other languages
Spanish (es)
Inventor
Xiaodan Wang
Chong Li
Xiaofeng Xu
Chuangu Wu
Original Assignee
China Enfi Eng Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201910284535.9A external-priority patent/CN109930172A/en
Priority claimed from CN201920483635.XU external-priority patent/CN209941108U/en
Application filed by China Enfi Eng Corp filed Critical China Enfi Eng Corp
Publication of CL2021002648A1 publication Critical patent/CL2021002648A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • C25C1/12Electrolytic production, recovery or refining of metals by electrolysis of solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25CPROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C7/00Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
    • C25C7/02Electrodes; Connections thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Dispositivo de electrodeposición de cobre que comprende primera y segunda vigas principales, primera y segunda placas conductoras, una pluralidad de placas anódicas y catódicas conectadas a las primera y segunda vigas principales, y una pluralidad de bastidores respectivamente ubicados entre placas anódicas y catódicas adyacentes. El dispositivo de electrodeposición tiene un pequeño espaciado de electrodos y un alto grado de paralelismo entre placas anódicas y catódicas.Copper electrodeposition device comprising first and second main beams, first and second conductive plates, a plurality of anode and cathode plates connected to the first and second main beams, and a plurality of racks respectively located between adjacent anode and cathode plates. The electrodeposition device has a small electrode spacing and a high degree of parallelism between anodic and cathodic plates.

CL2021002648A 2019-04-10 2021-10-08 Copper electrodeposition device CL2021002648A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910284535.9A CN109930172A (en) 2019-04-10 2019-04-10 Copper electrodeposition equipment
CN201920483635.XU CN209941108U (en) 2019-04-10 2019-04-10 Copper electrodeposition apparatus

Publications (1)

Publication Number Publication Date
CL2021002648A1 true CL2021002648A1 (en) 2022-07-01

Family

ID=72750945

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2021002648A CL2021002648A1 (en) 2019-04-10 2021-10-08 Copper electrodeposition device

Country Status (2)

Country Link
CL (1) CL2021002648A1 (en)
WO (1) WO2020207480A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1039545C (en) * 1993-05-31 1998-08-19 华东理工大学 Frame type fixed bed electrode electrolyzer and its industrial application
CN201785506U (en) * 2010-07-08 2011-04-06 江苏凯力克钴业股份有限公司 Electrodeposition tank
CN201826026U (en) * 2010-10-26 2011-05-11 张坚 Closed type winning cell
CN102453929A (en) * 2010-10-26 2012-05-16 张坚 Closed-type electro-winning cell
CN102251263A (en) * 2011-07-08 2011-11-23 浙江盈联科技有限公司 Novel energy-saving metal electrodeposition device
CN107916438B (en) * 2017-11-30 2019-08-06 郴州市金贵银业股份有限公司 A kind of electrolytic cell positioning busbar
CN108220999B (en) * 2018-01-22 2019-11-12 中南大学 A kind of device recycling cadmium containing the method for recycling cadmium in cadmium fumes and from cadmium-ammonia solution from metallurgy
CN109930172A (en) * 2019-04-10 2019-06-25 中国恩菲工程技术有限公司 Copper electrodeposition equipment

Also Published As

Publication number Publication date
WO2020207480A1 (en) 2020-10-15

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