CH678471A5 - - Google Patents

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Publication number
CH678471A5
CH678471A5 CH411988A CH411988A CH678471A5 CH 678471 A5 CH678471 A5 CH 678471A5 CH 411988 A CH411988 A CH 411988A CH 411988 A CH411988 A CH 411988A CH 678471 A5 CH678471 A5 CH 678471A5
Authority
CH
Switzerland
Prior art keywords
piezoelectric oscillator
pressure
filler metal
base
sealed
Prior art date
Application number
CH411988A
Other languages
English (en)
French (fr)
Inventor
Tatsuo Ikeda
Hiroyuki Ogiso
Kazushige Ichinose
Original Assignee
Matsushima Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2864087U external-priority patent/JPS63136422U/ja
Priority claimed from JP62224425A external-priority patent/JPH07105689B2/ja
Priority claimed from JP29356087A external-priority patent/JPH01135212A/ja
Priority claimed from JP29356287A external-priority patent/JPH01135214A/ja
Application filed by Matsushima Kogyo Kk filed Critical Matsushima Kogyo Kk
Publication of CH678471A5 publication Critical patent/CH678471A5/fr

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49596—Oscillators in combination with lead-frames
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CH411988A 1987-02-27 1988-02-19 CH678471A5 (US07922777-20110412-C00004.png)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2864087U JPS63136422U (US07922777-20110412-C00004.png) 1987-02-27 1987-02-27
JP62224425A JPH07105689B2 (ja) 1987-09-08 1987-09-08 圧電振動子
JP29356087A JPH01135212A (ja) 1987-11-20 1987-11-20 圧電振動子
JP29356287A JPH01135214A (ja) 1987-11-20 1987-11-20 圧電発振器

Publications (1)

Publication Number Publication Date
CH678471A5 true CH678471A5 (US07922777-20110412-C00004.png) 1991-09-13

Family

ID=27458921

Family Applications (1)

Application Number Title Priority Date Filing Date
CH411988A CH678471A5 (US07922777-20110412-C00004.png) 1987-02-27 1988-02-19

Country Status (2)

Country Link
CH (1) CH678471A5 (US07922777-20110412-C00004.png)
WO (1) WO1988006818A1 (US07922777-20110412-C00004.png)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265316A (en) * 1987-02-27 1993-11-30 Seiko Epson Corporation Method of manufacturing a pressure seal type piezoelectric oscillator
US5325574A (en) * 1987-02-27 1994-07-05 Seiko Epson Corporation Method of forming a quartz oscillator temperature sensor
US5392006A (en) * 1987-02-27 1995-02-21 Seiko Epson Corporation Pressure seal type piezoelectric resonator
US5592130A (en) * 1987-02-27 1997-01-07 Seiko Epson Corporation Piezoelectric oscillator including a piezoelectric resonator with outer lead
US5607236A (en) * 1987-02-27 1997-03-04 Seiko Epson Corporation Quartz oscillator temperature sensor
EP0778666A1 (fr) * 1995-12-28 1997-06-11 Eta SA Fabriques d'Ebauches Résonateur piézoélectrique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575376A (ja) * 1991-09-13 1993-03-26 Murata Mfg Co Ltd 圧電音叉型共振子

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435870U (US07922777-20110412-C00004.png) * 1977-08-15 1979-03-08
JPS5443490A (en) * 1977-09-12 1979-04-06 Seiko Epson Corp Support method for piezoelectric oscillator
JPS6324657Y2 (US07922777-20110412-C00004.png) * 1980-04-22 1988-07-06
JPS57112119A (en) * 1980-12-29 1982-07-13 Seiko Epson Corp Method for holding quartz oscillator
JPS58168317A (ja) * 1982-03-29 1983-10-04 Nec Home Electronics Ltd 圧入型キヤツプおよびその製造方法
JPS5936410A (ja) * 1982-08-24 1984-02-28 Matsushima Kogyo Co Ltd 圧電振動子

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5265316A (en) * 1987-02-27 1993-11-30 Seiko Epson Corporation Method of manufacturing a pressure seal type piezoelectric oscillator
US5325574A (en) * 1987-02-27 1994-07-05 Seiko Epson Corporation Method of forming a quartz oscillator temperature sensor
US5392006A (en) * 1987-02-27 1995-02-21 Seiko Epson Corporation Pressure seal type piezoelectric resonator
US5504460A (en) * 1987-02-27 1996-04-02 Seiko Epson Corporation Pressure seal type piezoelectric resonator
US5541557A (en) * 1987-02-27 1996-07-30 Seiko Epson Corporation Resin mold type piezoelectric resonator and resin mold type piezoelectric oscillator
US5592130A (en) * 1987-02-27 1997-01-07 Seiko Epson Corporation Piezoelectric oscillator including a piezoelectric resonator with outer lead
US5607236A (en) * 1987-02-27 1997-03-04 Seiko Epson Corporation Quartz oscillator temperature sensor
EP0778666A1 (fr) * 1995-12-28 1997-06-11 Eta SA Fabriques d'Ebauches Résonateur piézoélectrique
FR2743225A1 (fr) * 1995-12-28 1997-07-04 Ebauchesfabrik Eta Ag Resonateur piezoelectrique

Also Published As

Publication number Publication date
WO1988006818A1 (en) 1988-09-07

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Legal Events

Date Code Title Description
PL Patent ceased