CH626489A5 - - Google Patents

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Publication number
CH626489A5
CH626489A5 CH963678A CH963678A CH626489A5 CH 626489 A5 CH626489 A5 CH 626489A5 CH 963678 A CH963678 A CH 963678A CH 963678 A CH963678 A CH 963678A CH 626489 A5 CH626489 A5 CH 626489A5
Authority
CH
Switzerland
Prior art keywords
vacuum
airlock
bar
components
working chamber
Prior art date
Application number
CH963678A
Other languages
English (en)
French (fr)
Inventor
Dominique Peyraud
Martial Voumard
Original Assignee
Suisse Horlogerie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suisse Horlogerie filed Critical Suisse Horlogerie
Publication of CH626489A5 publication Critical patent/CH626489A5/fr

Links

Classifications

    • H10P72/0456—
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H10P72/3212—
    • H10P72/3314—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53096—Means to assemble or disassemble including means to provide a controlled environment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH963678A 1977-09-27 1978-09-14 CH626489A5 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/837,232 US4166563A (en) 1977-09-27 1977-09-27 Transfer machine for sealing electronic or like components under vacuum

Publications (1)

Publication Number Publication Date
CH626489A5 true CH626489A5 (en:Method) 1981-11-13

Family

ID=25273887

Family Applications (1)

Application Number Title Priority Date Filing Date
CH963678A CH626489A5 (en:Method) 1977-09-27 1978-09-14

Country Status (6)

Country Link
US (1) US4166563A (en:Method)
JP (1) JPS5463695A (en:Method)
CH (1) CH626489A5 (en:Method)
DE (1) DE2841767A1 (en:Method)
FR (1) FR2403866A1 (en:Method)
GB (1) GB2007778B (en:Method)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392435A (en) * 1979-08-03 1983-07-12 United Kingdom Atomic Energy Authority Transport apparatus
DE3119037A1 (de) * 1981-05-13 1982-12-02 Ganzhorn u. Stirn GmbH + Co, 7170 Schwäbisch Hall Verfahren und vorrichtung zum sterilisieren
JPS57206046A (en) * 1981-06-15 1982-12-17 Hitachi Ltd Wafer conveying device
NL8203318A (nl) * 1982-08-24 1984-03-16 Integrated Automation Inrichting voor processing van substraten.
US4799911A (en) * 1987-07-13 1989-01-24 Varo, Inc. Image intensifier tube with integral CCD digital readout
US4540326A (en) * 1982-09-17 1985-09-10 Nacom Industries, Inc. Semiconductor wafer transport system
JPS60187485A (ja) * 1984-03-06 1985-09-24 Raifu Technol Kenkyusho 接合装置
US4619573A (en) * 1984-03-09 1986-10-28 Tegal Corporation Article transport apparatus
US4576828A (en) * 1984-05-17 1986-03-18 Geotel, Inc. Method and apparatus for plasma spray coating
US4624617A (en) * 1984-10-09 1986-11-25 David Belna Linear induction semiconductor wafer transportation apparatus
DE3466135D1 (en) * 1984-10-16 1987-10-15 Ibm Vacuum transfer device
DE3601408C1 (de) * 1986-01-18 1987-03-12 Sartorius Gmbh Oberschalige Analysenwaage mit Waegekammerschleuse
HU207175B (en) * 1986-02-12 1993-03-01 Tungsram Reszvenytarsasag Device for manufacturing discharge tube of a sodium vapour discharge lamp
US5090609A (en) * 1989-04-28 1992-02-25 Hitachi, Ltd. Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
NL8901598A (nl) * 1989-06-23 1991-01-16 Soltec Bv Met een beschermgas werkende soldeermachine, voorzien van automatisch werkende sluisdeuren.
JPH04262865A (ja) * 1991-01-22 1992-09-18 Kenji Kondo はんだ付け装置
SE9200630L (sv) * 1992-03-02 1993-07-12 Quartz Proline Handelsbolag C Foerfarande och anlaeggning foer framstaellning av piezoelektriska resonatorer
WO1994000868A1 (en) 1992-06-26 1994-01-06 Materials Research Corporation Transport system for wafer processing line
US5433639A (en) * 1993-08-18 1995-07-18 Santa Barbara Research Center Processing of vacuum-sealed dewar assembly
DE4432730A1 (de) * 1994-09-14 1996-03-21 Emitec Emissionstechnologie Verfahren zur Herstellung einer metallischen Struktur
US5799860A (en) * 1995-08-07 1998-09-01 Applied Materials, Inc. Preparation and bonding of workpieces to form sputtering targets and other assemblies
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6213704B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6215897B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6298685B1 (en) 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
US20030183490A1 (en) * 2000-05-09 2003-10-02 Friedrich Eschenweck Longitudinal conveyor
US6935828B2 (en) * 2002-07-17 2005-08-30 Transfer Engineering And Manufacturing, Inc. Wafer load lock and magnetically coupled linear delivery system
US7306133B2 (en) * 2003-04-25 2007-12-11 St Assembly Test Services Ltd. System for fabricating an integrated circuit package on a printed circuit board
DE102019211212B4 (de) * 2019-07-29 2025-03-27 Rehm Thermal Systems Gmbh Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen
CN119382649B (zh) * 2024-10-10 2025-08-01 东晶电子金华有限公司 一种小型石英晶体谐振器封装方法及设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202406A (en) * 1960-07-27 1965-08-24 Clevite Corp Furnace apparatus and conveyor therefor
US3317106A (en) * 1963-08-19 1967-05-02 Dix Engineering Co Solder boat
US3717119A (en) * 1971-07-30 1973-02-20 Gen Motors Corp Vacuum processing machine for aluminizing headlamp reflectors
US3914836A (en) * 1974-06-21 1975-10-28 Us Army Method for processing quartz crystal resonators
US4030622A (en) * 1975-05-23 1977-06-21 Pass-Port Systems, Inc. Wafer transport system

Also Published As

Publication number Publication date
DE2841767A1 (de) 1979-04-26
JPS5463695A (en) 1979-05-22
JPS5724004B2 (en:Method) 1982-05-21
GB2007778A (en) 1979-05-23
GB2007778B (en) 1982-03-10
US4166563A (en) 1979-09-04
FR2403866B1 (en:Method) 1982-03-12
FR2403866A1 (fr) 1979-04-20

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