CH592365A5 - - Google Patents
Info
- Publication number
- CH592365A5 CH592365A5 CH1675175A CH1675175A CH592365A5 CH 592365 A5 CH592365 A5 CH 592365A5 CH 1675175 A CH1675175 A CH 1675175A CH 1675175 A CH1675175 A CH 1675175A CH 592365 A5 CH592365 A5 CH 592365A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H10W72/075—
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07532—
-
- H10W72/07533—
-
- H10W72/50—
-
- H10W72/5522—
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- H10W72/5524—
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1675175A CH592365A5 (cg-RX-API-DMAC10.html) | 1975-12-23 | 1975-12-23 | |
| DE19762654471 DE2654471A1 (de) | 1975-12-23 | 1976-12-01 | Kontaktierkopf fuer die herstellung einer drahtverbindung an einem mikroschaltkreis |
| US05/750,896 US4069961A (en) | 1975-12-23 | 1976-12-15 | Contacting head for forming a wire connection on an integrated circuit |
| FR7638742A FR2336814A1 (fr) | 1975-12-23 | 1976-12-22 | Tete de formation de contacts dans un microcircuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH1675175A CH592365A5 (cg-RX-API-DMAC10.html) | 1975-12-23 | 1975-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH592365A5 true CH592365A5 (cg-RX-API-DMAC10.html) | 1977-10-31 |
Family
ID=4419901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1675175A CH592365A5 (cg-RX-API-DMAC10.html) | 1975-12-23 | 1975-12-23 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4069961A (cg-RX-API-DMAC10.html) |
| CH (1) | CH592365A5 (cg-RX-API-DMAC10.html) |
| DE (1) | DE2654471A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2336814A1 (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3805584A1 (de) * | 1988-02-23 | 1989-08-31 | Dynapert Delvotec Gmbh | Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes |
| US4928871A (en) * | 1988-02-23 | 1990-05-29 | Emhart Deutschland Gmbh | Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head |
| CN112917062A (zh) * | 2021-03-11 | 2021-06-08 | 河南省锅炉压力容器安全检测研究院 | 一种密封面堆焊送丝装置 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3023772A1 (de) * | 1979-06-29 | 1981-01-15 | Texas Instruments Inc | Vorrichtung zum andruecken eines werkzeugs gegen eine arbeitsflaeche |
| CH636291A5 (fr) * | 1980-07-15 | 1983-05-31 | Charmilles Sa Ateliers | Procede et dispositif pour introduire le bout d'une electrode-fil dans l'orifice de depart d'une piece a decouper par etincelage erosif. |
| US4475681A (en) * | 1982-05-24 | 1984-10-09 | The Micromanipulator Co., Inc. | Bonder apparatus |
| JPS5950536A (ja) * | 1982-09-16 | 1984-03-23 | Toshiba Corp | ワイヤボンデイング装置 |
| DE3672530D1 (de) * | 1985-05-31 | 1990-08-16 | Dynapert Delvotec Sa | Verbindungskopf. |
| US4645118A (en) * | 1985-08-29 | 1987-02-24 | Biggs Kenneth L | Method and means for threading wire bonding machines |
| US4747814A (en) * | 1986-07-23 | 1988-05-31 | American Filtrona Corporation | Fiber separator |
| US5977618A (en) | 1992-07-24 | 1999-11-02 | Tessera, Inc. | Semiconductor connection components and methods with releasable lead support |
| US6054756A (en) * | 1992-07-24 | 2000-04-25 | Tessera, Inc. | Connection components with frangible leads and bus |
| JP3151219B2 (ja) | 1992-07-24 | 2001-04-03 | テツセラ，インコーポレイテッド | 取り外し自在のリード支持体を備えた半導体接続構成体およびその製造方法 |
| US5390844A (en) * | 1993-07-23 | 1995-02-21 | Tessera, Inc. | Semiconductor inner lead bonding tool |
| JP3075100B2 (ja) * | 1994-10-06 | 2000-08-07 | 松下電器産業株式会社 | ワイヤボンディング装置およびワイヤボンディング方法 |
| US20020151111A1 (en) * | 1995-05-08 | 2002-10-17 | Tessera, Inc. | P-connection components with frangible leads and bus |
| JPH0945721A (ja) * | 1995-08-03 | 1997-02-14 | Kaijo Corp | ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置 |
| KR100407055B1 (ko) | 1995-09-18 | 2004-03-31 | 테세라, 인코포레이티드 | 유전체층을갖는마이크로전자리드구조 |
| US5868301A (en) * | 1996-04-10 | 1999-02-09 | Tessera, Inc. | Semiconductor inner lead bonding tool |
| JPH10163246A (ja) * | 1996-11-29 | 1998-06-19 | Shinkawa Ltd | ワイヤボンディング装置 |
| US5937276A (en) | 1996-12-13 | 1999-08-10 | Tessera, Inc. | Bonding lead structure with enhanced encapsulation |
| CN101522356B (zh) * | 2006-11-09 | 2012-01-04 | 库利克和索夫工业公司 | 适于向焊线施加可变张力的焊线机送线系统及其操作方法 |
| US7954689B2 (en) * | 2007-05-04 | 2011-06-07 | Asm Technology Singapore Pte Ltd | Vacuum wire tensioner for wire bonder |
| CN101862897B (zh) * | 2010-02-11 | 2013-07-03 | 深圳市贵鸿达电子有限公司 | 一种功率器件的铜线键合方法 |
| TWI566875B (zh) * | 2014-02-24 | 2017-01-21 | 新川股份有限公司 | 線張力器 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL142018B (nl) * | 1964-11-26 | 1974-04-16 | Philips Nv | Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze. |
| US3319859A (en) * | 1965-03-04 | 1967-05-16 | Basic Products Corp | Capillary wire feed device |
| US3342396A (en) * | 1965-03-08 | 1967-09-19 | Basic Products Corp | Air spindle for bonding machines |
| US3776447A (en) * | 1969-06-30 | 1973-12-04 | Texas Instruments Inc | Automatic semiconductor bonding machine |
| US3643321A (en) * | 1970-06-17 | 1972-02-22 | Kulicke & Soffa Ind Inc | Method and apparatus for tailless wire bonding |
| US3672556A (en) * | 1970-07-13 | 1972-06-27 | John C Diepeveen | Wire clamp |
| US3727822A (en) * | 1970-10-05 | 1973-04-17 | Gen Electric | Electromagnetic force system for integrated circuit fabrication |
| JPS5310425B2 (cg-RX-API-DMAC10.html) * | 1974-09-13 | 1978-04-13 |
-
1975
- 1975-12-23 CH CH1675175A patent/CH592365A5/xx not_active IP Right Cessation
-
1976
- 1976-12-01 DE DE19762654471 patent/DE2654471A1/de not_active Withdrawn
- 1976-12-15 US US05/750,896 patent/US4069961A/en not_active Expired - Lifetime
- 1976-12-22 FR FR7638742A patent/FR2336814A1/fr active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3805584A1 (de) * | 1988-02-23 | 1989-08-31 | Dynapert Delvotec Gmbh | Vorrichtung und verfahren zur gesteuerten zufuehrung eines bonddrahtes zum "wedge" oder zur kapillare eines bondkopfes |
| US4928871A (en) * | 1988-02-23 | 1990-05-29 | Emhart Deutschland Gmbh | Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head |
| CN112917062A (zh) * | 2021-03-11 | 2021-06-08 | 河南省锅炉压力容器安全检测研究院 | 一种密封面堆焊送丝装置 |
| CN112917062B (zh) * | 2021-03-11 | 2022-08-02 | 河南省锅炉压力容器安全检测研究院 | 一种密封面堆焊送丝装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2654471A1 (de) | 1977-07-07 |
| US4069961A (en) | 1978-01-24 |
| FR2336814A1 (fr) | 1977-07-22 |
| FR2336814B1 (cg-RX-API-DMAC10.html) | 1982-11-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |