CH576007A5 - - Google Patents

Info

Publication number
CH576007A5
CH576007A5 CH770572A CH770572A CH576007A5 CH 576007 A5 CH576007 A5 CH 576007A5 CH 770572 A CH770572 A CH 770572A CH 770572 A CH770572 A CH 770572A CH 576007 A5 CH576007 A5 CH 576007A5
Authority
CH
Switzerland
Application number
CH770572A
Original Assignee
Galentan Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL7107171A external-priority patent/NL150860B/xx
Application filed by Galentan Ag filed Critical Galentan Ag
Publication of CH576007A5 publication Critical patent/CH576007A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
CH770572A 1971-05-25 1972-05-25 CH576007A5 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL7107171A NL150860B (nl) 1971-05-25 1971-05-25 Om een vaste as draaibare elektrolytverdeelinrichting, alsmede metalen band voorzien van een metaallaag in een vlekpatroon, vervaardigd onder gebruikmaking van deze inrichting.
NLAANVRAGE7109404,A NL170027C (nl) 1971-05-25 1971-07-07 Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.

Publications (1)

Publication Number Publication Date
CH576007A5 true CH576007A5 (enrdf_load_stackoverflow) 1976-05-31

Family

ID=26644660

Family Applications (1)

Application Number Title Priority Date Filing Date
CH770572A CH576007A5 (enrdf_load_stackoverflow) 1971-05-25 1972-05-25

Country Status (8)

Country Link
US (1) US3819502A (enrdf_load_stackoverflow)
BE (1) BE783967A (enrdf_load_stackoverflow)
CH (1) CH576007A5 (enrdf_load_stackoverflow)
FR (1) FR2139037B1 (enrdf_load_stackoverflow)
GB (1) GB1396343A (enrdf_load_stackoverflow)
HK (2) HK29180A (enrdf_load_stackoverflow)
IT (1) IT955826B (enrdf_load_stackoverflow)
NL (1) NL170027C (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708779A1 (de) * 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2324834C2 (de) * 1973-05-17 1978-09-07 Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren
CH594067A5 (enrdf_load_stackoverflow) * 1973-10-04 1977-12-30 Galentan Ag
NL7401595A (nl) * 1974-01-21 1975-07-23 Galentan Ag Inrichting voor het kontinu aanbrengen van strook-, lint- of vlekvormige bedekkingen.
JPS5116236A (en) * 1974-07-31 1976-02-09 Daiichi Denshi Kogyo Denkaishorihoho narabini sochi
US3962063A (en) * 1974-12-18 1976-06-08 Advanced Materials Systems, Inc. Selective plating apparatus
US3974056A (en) * 1975-05-23 1976-08-10 Ann Arbor Circuits, Inc. Electroplating selected portions of a strip
JPS51159731U (enrdf_load_stackoverflow) * 1975-06-14 1976-12-18
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4036725A (en) * 1975-11-21 1977-07-19 National Semiconductor Corporation Wheel selective jet plating system
NL8101105A (nl) * 1981-03-07 1982-10-01 Galentan Ag Werkwijze voor het aanbrengen van al dan niet geheel gesloten lusvormige bedekkingen.
NL8101106A (nl) * 1981-03-07 1982-10-01 Galentan Ag Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen.
US4431500A (en) * 1981-12-15 1984-02-14 Vanguard Research Associates, Inc. Selective electroplating apparatus
US4579831A (en) * 1983-03-29 1986-04-01 Chevron Research Company Method of zeolitic catalyst manufacture
US4473445A (en) * 1983-12-22 1984-09-25 Amp Incorporated Selectively plating interior surfaces of loose piece electrical terminals
EP0319997B1 (en) * 1987-12-10 1995-10-04 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US5104510A (en) * 1990-02-16 1992-04-14 Texas Instruments Incorporated Plating system
US5069762A (en) * 1991-01-18 1991-12-03 Usx Corporation Appartaus for improved current transfer in radial cell electroplating
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
NL9300174A (nl) * 1993-01-28 1994-08-16 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
US6969672B1 (en) * 2001-07-19 2005-11-29 Advanced Micro Devices, Inc. Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation
FR2828890B1 (fr) * 2001-08-24 2004-02-13 Itt Mfg Enterprises Inc Dispositif de depot en continu par electrodeposition et composants electriques ou electroniques fabriques en bande comportant une couche de placage par electrodeposition
US6991717B2 (en) * 2002-04-05 2006-01-31 3M Innovative Properties Company Web processing method and apparatus
FI115775B (fi) * 2003-12-12 2005-07-15 Outokumpu Oy Menetelmä ohuiden kalvojen valmistamiseksi kantajanauhalle
FI115776B (fi) * 2003-12-12 2005-07-15 Outokumpu Oy Menetelmä ohuiden johtimien valmistamiseksi kantajanauhalle ja menetelmällä valmistettu johdin
EP1696052B1 (en) 2005-02-28 2010-10-06 Rohm and Haas Electronic Materials, L.L.C. Improved fluxing methods
US8551301B2 (en) * 2008-10-08 2013-10-08 Tyco Electronics Corporation Electroplating system with electroplating wheel
RU2402644C1 (ru) * 2009-06-16 2010-10-27 Открытое акционерное общество "Государственный научно-исследовательский и проектный институт редкометаллической промышленности ОАО "Гиредмет" Устройство для локального нанесения металлических покрытий электролитическим методом
RU2412285C1 (ru) * 2009-06-16 2011-02-20 Открытое акционерное общество "Государственный научно-исследовательский и проектный институт редкометаллической промышленности" (ОАО "ГИРЕДМЕТ") Способ локального нанесения металлических покрытий на образцы термоэлектрических материалов электролитическим методом
CN102586830B (zh) * 2011-01-10 2015-12-09 深圳市奥美特科技有限公司 金属丝表面镀金或镀钯的设备及方法
CN103924276B (zh) * 2014-04-29 2014-12-17 深圳市崇辉表面技术开发有限公司 表面贴装型发光二极管支架的电镀系统及电镀方法
CN106702445B (zh) * 2016-12-01 2018-12-21 深圳市奥美特科技有限公司 选择电镀设备及其选择电镀模具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2591042A (en) * 1947-01-08 1952-04-01 Conmar Prod Corp Apparatus for electrolytic treatment of spaced metallic elements
NL272336A (enrdf_load_stackoverflow) * 1960-12-08
GB1098182A (en) * 1963-12-27 1968-01-10 Ibm Electrolyte or electroless plating process
US3483098A (en) * 1966-02-11 1969-12-09 United States Steel Corp Method and apparatus for electroplating a metallic strip
US3468785A (en) * 1966-06-21 1969-09-23 Photocircuits Corp Apparatus for electroplating selected areas
US3537971A (en) * 1967-08-07 1970-11-03 Rca Corp Apparatus for electroplating a ribbon
US3539490A (en) * 1967-11-28 1970-11-10 Sylvania Electric Prod Plating of stripes on longitudinal electrically conductive material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708779A1 (de) * 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes

Also Published As

Publication number Publication date
HK29080A (en) 1980-06-06
BE783967A (nl) 1972-11-27
NL170027B (nl) 1982-04-16
NL7109404A (enrdf_load_stackoverflow) 1973-01-09
DE2225391B2 (de) 1976-04-22
US3819502A (en) 1974-06-25
GB1396343A (en) 1975-06-04
DE2265041B2 (de) 1977-04-21
FR2139037A1 (enrdf_load_stackoverflow) 1973-01-05
DE2265041A1 (de) 1975-12-18
DE2225391A1 (de) 1972-12-07
HK29180A (en) 1980-06-06
NL170027C (nl) 1982-09-16
IT955826B (it) 1973-09-29
FR2139037B1 (enrdf_load_stackoverflow) 1977-08-26

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Legal Events

Date Code Title Description
PUE Assignment

Owner name: MECO EQUIPMENT ENGINEERS B.V.

PL Patent ceased
PL Patent ceased