HK29080A - Plating apparatus - Google Patents

Plating apparatus


Publication number
HK29080A HK29080A HK29080A HK29080A HK 29080 A HK29080 A HK 29080A HK 29080 A HK29080 A HK 29080A HK 29080 A HK29080 A HK 29080A HK 29080 A HK29080 A HK 29080A
Hong Kong
Prior art keywords
Prior art date
Application number
Original Assignee
Galentan Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL7107171A priority Critical patent/NL150860B/en
Priority to NL7109404A priority patent/NL170027C/en
Application filed by Galentan Ag filed Critical Galentan Ag
Publication of HK29080A publication Critical patent/HK29080A/en



    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0671Selective plating
HK29080A 1971-05-25 1980-05-29 Plating apparatus HK29080A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL7107171A NL150860B (en) 1971-05-25 1971-05-25 In order to provide a fixed shaft rotatable electrolyte distribution device, as well as metal sheet from a metal layer in a spot pattern, made using this apparatus.
NL7109404A NL170027C (en) 1971-05-25 1971-07-07 Improvement of an electrolyte distributor dividable by a fixed axle.

Publications (1)

Publication Number Publication Date
HK29080A true HK29080A (en) 1980-06-06



Family Applications (2)

Application Number Title Priority Date Filing Date
HK29080A HK29080A (en) 1971-05-25 1980-05-29 Plating apparatus
HK29180A HK29180A (en) 1971-05-25 1980-05-29 Plating apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK29180A HK29180A (en) 1971-05-25 1980-05-29 Plating apparatus

Country Status (9)

Country Link
US (1) US3819502A (en)
BE (1) BE783967A (en)
CH (1) CH576007A5 (en)
DE (2) DE2265041B2 (en)
FR (1) FR2139037B1 (en)
GB (1) GB1396343A (en)
HK (2) HK29080A (en)
IT (1) IT955826B (en)
NL (1) NL170027C (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2324834C2 (en) * 1973-05-17 1978-09-07 Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim
CH594067A5 (en) * 1973-10-04 1977-12-30 Galentan Ag
NL7401595A (en) * 1974-01-21 1975-07-23 Galentan Ag Device for the continuous application of stripe, ribbon or spot coatings.
JPS5438979B2 (en) * 1974-07-31 1979-11-24
US3962063A (en) * 1974-12-18 1976-06-08 Advanced Materials Systems, Inc. Selective plating apparatus
US3974056A (en) * 1975-05-23 1976-08-10 Ann Arbor Circuits, Inc. Electroplating selected portions of a strip
JPS5548116B2 (en) * 1975-05-23 1980-12-04
JPS51159731U (en) * 1975-06-14 1976-12-18
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4036725A (en) * 1975-11-21 1977-07-19 National Semiconductor Corporation Wheel selective jet plating system
DE2612730C2 (en) * 1976-03-25 1983-05-26 Electroplating Engineers Of Japan, Ltd., Tokyo, Jp
NL8101106A (en) * 1981-03-07 1982-10-01 Galentan Ag Device for galvanic application of stain coatings.
NL8101105A (en) * 1981-03-07 1982-10-01 Galentan Ag Method for applying loop-shaped covers, whether not completely closed.
US4431500A (en) * 1981-12-15 1984-02-14 Vanguard Research Associates, Inc. Selective electroplating apparatus
US4579831A (en) * 1983-03-29 1986-04-01 Chevron Research Company Method of zeolitic catalyst manufacture
DE3343978C2 (en) * 1983-12-06 1987-12-17 Hoesch Ag, 4600 Dortmund, De
US4473445A (en) * 1983-12-22 1984-09-25 Amp Incorporated Selectively plating interior surfaces of loose piece electrical terminals
DE3708779C2 (en) * 1986-11-22 1989-03-16 Schempp & Decker Maschinenbau Gmbh, 1000 Berlin, De
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
EP0319997B1 (en) * 1987-12-10 1995-10-04 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
US5104510A (en) * 1990-02-16 1992-04-14 Texas Instruments Incorporated Plating system
US5069762A (en) * 1991-01-18 1991-12-03 Usx Corporation Appartaus for improved current transfer in radial cell electroplating
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
NL9300174A (en) * 1993-01-28 1994-08-16 Meco Equip Eng Method and apparatus for electrolytically applying metal coatings to apertured metal or metallized products locally.
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
DE10065643C2 (en) * 2000-12-29 2003-03-20 Egon Huebel Device and method for the electrochemical treatment of strip-like and plate-like material
US6969672B1 (en) * 2001-07-19 2005-11-29 Advanced Micro Devices, Inc. Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation
FR2828890B1 (en) * 2001-08-24 2004-02-13 Itt Mfg Enterprises Inc Device for continuous deposition by electrodeposition and electrical or electronic components made of band comprising an electrodeposition plating layer
US6991717B2 (en) * 2002-04-05 2006-01-31 3M Innovative Properties Company Web processing method and apparatus
FI115775B (en) * 2003-12-12 2005-07-15 Outokumpu Oy Process for making thin foils on a carrier tape
FI115776B (en) * 2003-12-12 2005-07-15 Outokumpu Oy Method for producing flat wires on a carrier band and a line made by process
ES2354045T3 (en) 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedures with sound improved.
US8551301B2 (en) * 2008-10-08 2013-10-08 Tyco Electronics Corporation Electroplating system with electroplating wheel
CN102586830B (en) * 2011-01-10 2015-12-09 深圳市奥美特科技有限公司 Wire surface gold-plated or plating palladium Apparatus and method for
CN103924276B (en) * 2014-04-29 2014-12-17 深圳市崇辉表面技术开发有限公司 Electroplating system and electroplating method for surface-mounted light emitting diode support
CN106702445B (en) * 2016-12-01 2018-12-21 深圳市奥美特科技有限公司 Select electroplating device and its selection electroplating mold

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2591042A (en) * 1947-01-08 1952-04-01 Conmar Prod Corp Apparatus for electrolytic treatment of spaced metallic elements
NL272336A (en) * 1960-12-08
GB1098182A (en) * 1963-12-27 1968-01-10 Ibm Electrolyte or electroless plating process
US3483098A (en) * 1966-02-11 1969-12-09 United States Steel Corp Method and apparatus for electroplating a metallic strip
US3468785A (en) * 1966-06-21 1969-09-23 Photocircuits Corp Apparatus for electroplating selected areas
US3537971A (en) * 1967-08-07 1970-11-03 Rca Corp Apparatus for electroplating a ribbon
US3539490A (en) * 1967-11-28 1970-11-10 Sylvania Electric Prod Plating of stripes on longitudinal electrically conductive material

Also Published As

Publication number Publication date
FR2139037B1 (en) 1977-08-26
BE783967A (en) 1972-11-27
CH576007A5 (en) 1976-05-31
US3819502A (en) 1974-06-25
DE2225391B2 (en) 1976-04-22
IT955826B (en) 1973-09-29
BE783967A2 (en)
DE2225391A1 (en) 1972-12-07
HK29180A (en) 1980-06-06
NL170027B (en) 1982-04-16
GB1396343A (en) 1975-06-04
NL170027C (en) 1982-09-16
NL7109404A (en) 1973-01-09
DE2265041B2 (en) 1977-04-21
DE2265041A1 (en) 1975-12-18
FR2139037A1 (en) 1973-01-05

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