CH566643A5 - - Google Patents

Info

Publication number
CH566643A5
CH566643A5 CH1450973A CH1450973A CH566643A5 CH 566643 A5 CH566643 A5 CH 566643A5 CH 1450973 A CH1450973 A CH 1450973A CH 1450973 A CH1450973 A CH 1450973A CH 566643 A5 CH566643 A5 CH 566643A5
Authority
CH
Switzerland
Application number
CH1450973A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1450973A priority Critical patent/CH566643A5/xx
Priority to DE19737339254U priority patent/DE7339254U/de
Priority to DE2354854A priority patent/DE2354854C2/de
Priority to JP11544074A priority patent/JPS5611225B2/ja
Priority to GB4368574A priority patent/GB1460645A/en
Priority to US05/514,251 priority patent/US3953941A/en
Publication of CH566643A5 publication Critical patent/CH566643A5/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
    • B24C1/083—Deburring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Pressure Sensors (AREA)
CH1450973A 1973-10-11 1973-10-11 CH566643A5 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1450973A CH566643A5 (de) 1973-10-11 1973-10-11
DE19737339254U DE7339254U (de) 1973-10-11 1973-11-02 Vorrichtung zur hohlkehlenfoermigen anschraegung der mantelflaeche eines halbleiterkoerpers
DE2354854A DE2354854C2 (de) 1973-10-11 1973-11-02 Verfahren und Vorrichtung zur Herstellung eines scheibenförmigen Halbleiterkörpers
JP11544074A JPS5611225B2 (de) 1973-10-11 1974-10-07
GB4368574A GB1460645A (en) 1973-10-11 1974-10-09 Method and apparatus for producing a semiconductor component
US05/514,251 US3953941A (en) 1973-10-11 1974-10-11 Method and apparatus for making a groove in a semi-conductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1450973A CH566643A5 (de) 1973-10-11 1973-10-11

Publications (1)

Publication Number Publication Date
CH566643A5 true CH566643A5 (de) 1975-09-15

Family

ID=4401415

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1450973A CH566643A5 (de) 1973-10-11 1973-10-11

Country Status (5)

Country Link
US (1) US3953941A (de)
JP (1) JPS5611225B2 (de)
CH (1) CH566643A5 (de)
DE (2) DE7339254U (de)
GB (1) GB1460645A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4031667A (en) * 1976-03-29 1977-06-28 Macronetics, Inc. Apparatus for contouring edge of semiconductor wafers
DE2656070C2 (de) * 1976-12-10 1983-12-08 Kraftwerk Union AG, 4330 Mülheim Vorrichtung zum Einarbeiten von Ringnuten um eine mit Dehnungsmeßstreifen versehene Meßstelle
US4247579A (en) * 1979-11-30 1981-01-27 General Electric Company Method for metallizing a semiconductor element
DE3124947C2 (de) * 1981-06-25 1985-12-05 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und Vorrichtung zum Herstellen einer Hohlkehle in der Mantelfläche des Aktivteils eines Leistungshalbleiterbauelements
JPS61108170A (ja) * 1984-10-31 1986-05-26 ゼネラル・エレクトリツク・カンパニイ 電力半導体装置に２重正ベベル溝を形成する方法
DE3769909D1 (de) * 1986-10-22 1991-06-13 Bbc Brown Boveri & Cie Verfahren zum anbringen einer umlaufenden hohlkehle am rand einer halbleiterscheibe eines leistungshalbleiter-bauelements.
US5010694A (en) * 1989-08-01 1991-04-30 Advanced Technology Systems, Inc. Fluid cutting machine
JPH04277625A (ja) * 1991-03-05 1992-10-02 Murata Mfg Co Ltd チップ型電子部品の加工方法
GB2264659B (en) * 1992-02-29 1995-05-24 Rolls Royce Plc Abrasive fluid jet machining
US5704824A (en) * 1993-10-12 1998-01-06 Hashish; Mohamad Method and apparatus for abrasive water jet millins
FR2789224B1 (fr) * 1999-01-28 2003-10-03 St Microelectronics Sa Dressage de bord d'une plaquette semiconductrice
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
JP5793014B2 (ja) * 2011-07-21 2015-10-14 株式会社不二製作所 硬質脆性材料基板の側部研磨方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886026A (en) * 1957-08-20 1959-05-12 Texas Instruments Inc Method of and apparatus for cutting a semiconductor crystal
BE628619A (de) * 1962-02-20
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
GB1057214A (en) * 1965-05-11 1967-02-01 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3589081A (en) * 1967-08-21 1971-06-29 Pennwalt Corp Abrading method
GB1226880A (de) * 1968-03-21 1971-03-31
CH504783A (de) * 1969-06-20 1971-03-15 Siemens Ag Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens
SE358838B (de) * 1971-12-01 1973-08-13 Ingenjoers Fa Hebe Ab

Also Published As

Publication number Publication date
GB1460645A (en) 1977-01-06
DE7339254U (de) 1976-01-08
JPS5067592A (de) 1975-06-06
US3953941A (en) 1976-05-04
DE2354854A1 (de) 1975-04-30
JPS5611225B2 (de) 1981-03-12
DE2354854C2 (de) 1985-10-24

Similar Documents

Publication Publication Date Title
AR201758A1 (de)
AU476761B2 (de)
AU465372B2 (de)
AR201235Q (de)
AR201231Q (de)
AU474593B2 (de)
AU474511B2 (de)
AU474838B2 (de)
AU471343B2 (de)
AU465453B2 (de)
AU465434B2 (de)
AU450229B2 (de)
AU476714B2 (de)
AR201229Q (de)
AU466283B2 (de)
AU476696B2 (de)
AU472848B2 (de)
AR199451A1 (de)
AU477823B2 (de)
AR200885A1 (de)
AR197627A1 (de)
AR210729A1 (de)
AR200256A1 (de)
AR195311A1 (de)
AU461342B2 (de)

Legal Events

Date Code Title Description
PL Patent ceased