CH540989A - Verfahren zum Niederschlagen eines dichten, haftenden Mangandioxyd-Films auf eine Unterlage - Google Patents
Verfahren zum Niederschlagen eines dichten, haftenden Mangandioxyd-Films auf eine UnterlageInfo
- Publication number
- CH540989A CH540989A CH1229669A CH1229669A CH540989A CH 540989 A CH540989 A CH 540989A CH 1229669 A CH1229669 A CH 1229669A CH 1229669 A CH1229669 A CH 1229669A CH 540989 A CH540989 A CH 540989A
- Authority
- CH
- Switzerland
- Prior art keywords
- manganese dioxide
- solution
- reducing agent
- added
- permanganate
- Prior art date
Links
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 title claims description 216
- 238000000034 method Methods 0.000 title claims description 34
- 239000000853 adhesive Substances 0.000 title claims description 12
- 230000001070 adhesive effect Effects 0.000 title claims description 12
- 238000000151 deposition Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 title description 27
- 239000000243 solution Substances 0.000 claims description 100
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 58
- 239000003638 chemical reducing agent Substances 0.000 claims description 50
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 31
- 229910017604 nitric acid Inorganic materials 0.000 claims description 29
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 16
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 14
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 14
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 claims description 11
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 11
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 7
- 235000019253 formic acid Nutrition 0.000 claims description 7
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 6
- 235000006408 oxalic acid Nutrition 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 235000019256 formaldehyde Nutrition 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 claims 3
- 239000010408 film Substances 0.000 description 51
- 238000001556 precipitation Methods 0.000 description 20
- 239000003990 capacitor Substances 0.000 description 17
- 239000012286 potassium permanganate Substances 0.000 description 14
- 239000002253 acid Substances 0.000 description 12
- 239000002244 precipitate Substances 0.000 description 12
- 230000001464 adherent effect Effects 0.000 description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 10
- 229910052715 tantalum Inorganic materials 0.000 description 9
- 239000010409 thin film Substances 0.000 description 9
- 230000002378 acidificating effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000012429 reaction media Substances 0.000 description 7
- 239000011572 manganese Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 4
- 229910002651 NO3 Inorganic materials 0.000 description 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000035876 healing Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 150000003109 potassium Chemical class 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0036—Formation of the solid electrolyte layer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G45/00—Compounds of manganese
- C01G45/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
- C01P2004/82—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
- C01P2004/84—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases one phase coated with the other
- C01P2004/86—Thin layer coatings, i.e. the coating thickness being less than 0.1 time the particle radius
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Surface Treatment Of Glass (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75247868A | 1968-08-14 | 1968-08-14 | |
US82600769A | 1969-05-19 | 1969-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH540989A true CH540989A (de) | 1973-08-31 |
Family
ID=27115598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1229669A CH540989A (de) | 1968-08-14 | 1969-08-13 | Verfahren zum Niederschlagen eines dichten, haftenden Mangandioxyd-Films auf eine Unterlage |
Country Status (9)
Country | Link |
---|---|
BE (1) | BE737423A (es) |
CA (1) | CA925756A (es) |
CH (1) | CH540989A (es) |
DE (1) | DE1940562B2 (es) |
ES (1) | ES371071A1 (es) |
FR (1) | FR2015671A1 (es) |
GB (1) | GB1282106A (es) |
NL (1) | NL146468B (es) |
SE (1) | SE360962B (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3630006C1 (en) * | 1986-09-03 | 1988-01-14 | Roederstein Kondensatoren | Method of fabricating tantalum electrolytic capacitors |
CN115418637A (zh) * | 2022-08-22 | 2022-12-02 | 河南师范大学 | 一种在镍钛合金表面制备二氧化锰涂层的方法 |
-
1969
- 1969-08-06 SE SE1098869A patent/SE360962B/xx unknown
- 1969-08-08 DE DE19691940562 patent/DE1940562B2/de not_active Withdrawn
- 1969-08-11 CA CA059189A patent/CA925756A/en not_active Expired
- 1969-08-13 ES ES371071A patent/ES371071A1/es not_active Expired
- 1969-08-13 BE BE737423D patent/BE737423A/xx unknown
- 1969-08-13 CH CH1229669A patent/CH540989A/de not_active IP Right Cessation
- 1969-08-14 GB GB4075169A patent/GB1282106A/en not_active Expired
- 1969-08-14 FR FR6928079A patent/FR2015671A1/fr not_active Withdrawn
- 1969-08-14 NL NL6912384A patent/NL146468B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
CA925756A (en) | 1973-05-08 |
NL6912384A (es) | 1970-02-17 |
BE737423A (es) | 1970-01-16 |
DE1940562A1 (de) | 1970-02-26 |
ES371071A1 (es) | 1971-10-16 |
GB1282106A (en) | 1972-07-19 |
DE1940562B2 (de) | 1972-04-06 |
FR2015671A1 (es) | 1970-04-30 |
NL146468B (nl) | 1975-07-15 |
SE360962B (es) | 1973-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0000702B1 (de) | Verfahren zur Herstellung einer fliessbeständigen Resistmaske aus strahlungsempfindlichem Resistmaterial | |
DE2610470C3 (de) | Verfahren zur stromlosen Abscheidung von Kupferschichten | |
CH639294A5 (de) | Verfahren zur herstellung einer durchsichtigen, leitenden schicht auf einem substrat. | |
DE2021264A1 (de) | Verfahren fuer die Herstellung von diskreten RC-Anordnungen | |
DE2545046A1 (de) | Eloxierverfahren | |
DE2052424B2 (de) | Verfahren zum Herstellen elektrischer Leitungsverbindungen | |
DE2826630A1 (de) | Verfahren zur verbesserung der korrosionseigenschaften von mit chrom plattierten gegenstaenden aus aluminium und aluminiumlegierungen | |
DE69329249T2 (de) | Phosphatisierungsverfahren, insbesondere für die herstellung von leiterplatten und verwendung organischer rückstände | |
DE69217183T2 (de) | Verfahren zur Verlängerung der Benutzbarkeit eines Metallisierungsbades nach der Austauschmethode | |
DE2635245C2 (de) | Verfahren zur Herstellung elektrisch leitender Indiumoxidmuster auf einem isolierenden Träger und ihre Verwendung | |
DE2239425C3 (de) | Verfahren zur elektrolytischen Behandlung von Nioboberflächen für Wechselstromanwendungen | |
DE60015710T2 (de) | Lösung zur Herstellung einer aus Nickel bestehenden Metall-Dünnschicht und Verfahren zur Herstellung | |
DE1589079A1 (de) | Herstellungsverfahren fuer Duennfilmkondensatoren | |
DE2624068C2 (de) | Verfahren zur Herstellung eines Feststoffelektrolytkondensators | |
DE1589784B2 (de) | Verfahren zur Herstellung von AIuminium-Elektrolytkondensatoren | |
DE2315372A1 (de) | Verfahren zur herstellung von bauteilen mit wolframschichten | |
CH540989A (de) | Verfahren zum Niederschlagen eines dichten, haftenden Mangandioxyd-Films auf eine Unterlage | |
DE1771575A1 (de) | Verfahren zum Herstellen eines Titandioxidfilms | |
DE2239145A1 (de) | Verfahren zur behandlung von halbleitermaterialien aus iii-v-verbindungen | |
DE1614245A1 (de) | Verfahren zur Herstellung von Elektrolytkondensatoren | |
DE1940562C (de) | Verfahren zum Niederschlagen eines dichten, haftenden Mangandioxid-Films auf einer Unterlage | |
DE2410880A1 (de) | Verfahren zum herstellen eines maskierenden musters aus photolack | |
US3585072A (en) | Deposition of a layer of manganese dioxide from a permanganate solution by chemical reduction of the permanganate | |
DE2036101A1 (de) | Verfahren zum Niederschlagen einer haltenden Bieiaioxidschicht auf eine "Unterla ge | |
DE2243682C2 (de) | Verfahren zur Herstellung eines leitenden Elektrodenmusters |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |