CH524690A - Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédé - Google Patents
Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédéInfo
- Publication number
- CH524690A CH524690A CH372571A CH372571A CH524690A CH 524690 A CH524690 A CH 524690A CH 372571 A CH372571 A CH 372571A CH 372571 A CH372571 A CH 372571A CH 524690 A CH524690 A CH 524690A
- Authority
- CH
- Switzerland
- Prior art keywords
- oxides
- metals
- deposition
- application
- metal support
- Prior art date
Links
- 239000002184 metal Substances 0.000 title 2
- 229910052751 metal Inorganic materials 0.000 title 2
- 238000000034 method Methods 0.000 title 2
- 238000000151 deposition Methods 0.000 title 1
- 230000008021 deposition Effects 0.000 title 1
- 150000002739 metals Chemical class 0.000 title 1
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/44—Energy spectrometers, e.g. alpha-, beta-spectrometers
- H01J49/46—Static spectrometers
- H01J49/48—Static spectrometers using electrostatic analysers, e.g. cylindrical sector, Wien filter
- H01J49/488—Static spectrometers using electrostatic analysers, e.g. cylindrical sector, Wien filter with retarding grids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/075—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound
- C25B11/081—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of a single catalytic element or catalytic compound the element being a noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Inert Electrodes (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7014327A FR2088659A5 (enrdf_load_stackoverflow) | 1970-04-21 | 1970-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH524690A true CH524690A (fr) | 1972-06-30 |
Family
ID=9054289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH372571A CH524690A (fr) | 1970-04-21 | 1971-03-15 | Nouveau procédé de dépôt par pulvérisation cathodique, de métaux ou oxydes sur un support métallique et application dudit procédé |
Country Status (17)
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2320565A1 (fr) * | 1973-04-12 | 1977-03-04 | Radiotechnique Compelec | Plaque a transparence selective et son procede de fabrication |
AU507748B2 (en) * | 1976-06-10 | 1980-02-28 | University Of Sydney, The | Reactive sputtering |
DE2630883C2 (de) * | 1976-07-09 | 1985-02-07 | Basf Ag, 6700 Ludwigshafen | Verwendung einer nach dem Plasma- oder Flammspritzverfahren auf einem metallischen Träger aufgebrachten porösen anorganische Oxide enthaltenden Schicht als Diaphragma in einer Elektrolysezelle |
AU5889880A (en) * | 1979-07-02 | 1981-01-15 | Olin Corporation | Manufacture of low overvoltage electrodes by cathodic sputtering |
US4400255A (en) * | 1981-06-29 | 1983-08-23 | General Motors Corporation | Control of electron bombardment of the exhaust oxygen sensor during electrode sputtering |
US4420385A (en) * | 1983-04-15 | 1983-12-13 | Gryphon Products | Apparatus and process for sputter deposition of reacted thin films |
US5391275A (en) * | 1990-03-02 | 1995-02-21 | Applied Materials, Inc. | Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
EP0446657B1 (en) * | 1990-03-02 | 1995-07-26 | Applied Materials, Inc. | Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
US5202008A (en) * | 1990-03-02 | 1993-04-13 | Applied Materials, Inc. | Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
US5429843A (en) * | 1991-11-21 | 1995-07-04 | Nisshin Steel Co., Ltd. | Vapor deposition for formation of plating layer |
EP0593372B1 (en) * | 1992-10-14 | 2001-09-19 | Daiki Engineering Co., Ltd. | Highly durable electrodes for eletrolysis and a method for preparation thereof |
CA2154428C (fr) * | 1995-07-21 | 2005-03-22 | Robert Schulz | Alliages a base de ti, ru, fe et o et usage de ceux-ci pour la fabrication de cathodes pour la synthese electrochimique du chlorate de sodium |
FR2861219B1 (fr) * | 2003-10-15 | 2006-04-07 | Commissariat Energie Atomique | Pile a combustible alcaline comportant une anode comprenant de l'aluminium et du zinc et procede de fabrication de l'anode |
US20050205415A1 (en) * | 2004-03-19 | 2005-09-22 | Belousov Igor V | Multi-component deposition |
ITMI20091621A1 (it) | 2009-09-23 | 2011-03-24 | Industrie De Nora Spa | Elettrodo per processi elettrolitici con struttura cristallina controllata |
JP4734664B1 (ja) * | 2010-09-17 | 2011-07-27 | 田中貴金属工業株式会社 | 電解用電極、オゾン電解生成用陽極、過硫酸電解生成用陽極及びクロム電解酸化用陽極 |
RU2562462C1 (ru) * | 2014-05-30 | 2015-09-10 | Общество с ограниченной ответственностью "Эй Ти Энерджи", ООО "Эй Ти Энерджи" | Способ изготовления катализатора на основе платины и катализатор на основе платины |
WO2015183128A1 (ru) * | 2014-05-30 | 2015-12-03 | Общество С Ограниченной Ответственностью "Эй Ти Энерджи" | Способ изготовления катализатора на основе платины и катализатор на основе платины |
-
1970
- 1970-04-21 FR FR7014327A patent/FR2088659A5/fr not_active Expired
-
1971
- 1971-03-15 CH CH372571A patent/CH524690A/fr not_active IP Right Cessation
- 1971-03-16 SE SE03345/71A patent/SE366345B/xx unknown
- 1971-04-05 US US00131497A patent/US3773639A/en not_active Expired - Lifetime
- 1971-04-06 RO RO66501D patent/RO61059A/ro unknown
- 1971-04-16 NL NL7105157A patent/NL7105157A/xx unknown
- 1971-04-19 CA CA110757A patent/CA933881A/en not_active Expired
- 1971-04-19 ES ES390345A patent/ES390345A1/es not_active Expired
- 1971-04-19 JP JP2520271A patent/JPS5324914B1/ja active Pending
- 1971-04-19 PL PL1971147635A patent/PL83268B1/pl unknown
- 1971-04-19 GB GB2665571*A patent/GB1307956A/en not_active Expired
- 1971-04-20 IL IL36656A patent/IL36656A/xx unknown
- 1971-04-20 BE BE766023A patent/BE766023A/xx unknown
- 1971-04-20 LU LU63024D patent/LU63024A1/xx unknown
- 1971-04-20 DE DE19712119066 patent/DE2119066A1/de active Pending
- 1971-04-21 AT AT342371A patent/AT304990B/de not_active IP Right Cessation
- 1971-04-22 BR BR2391/71A patent/BR7102391D0/pt unknown
Also Published As
Publication number | Publication date |
---|---|
BR7102391D0 (pt) | 1973-05-03 |
ES390345A1 (es) | 1973-06-01 |
CA933881A (en) | 1973-09-18 |
SE366345B (enrdf_load_stackoverflow) | 1974-04-22 |
RO61059A (enrdf_load_stackoverflow) | 1976-10-15 |
DE2119066A1 (de) | 1971-11-04 |
JPS5324914B1 (enrdf_load_stackoverflow) | 1978-07-24 |
NL7105157A (enrdf_load_stackoverflow) | 1971-10-25 |
PL83268B1 (enrdf_load_stackoverflow) | 1975-12-31 |
FR2088659A5 (enrdf_load_stackoverflow) | 1972-01-07 |
IL36656A0 (en) | 1971-06-23 |
IL36656A (en) | 1974-01-14 |
US3773639A (en) | 1973-11-20 |
AT304990B (de) | 1973-02-12 |
LU63024A1 (enrdf_load_stackoverflow) | 1972-12-11 |
GB1307956A (en) | 1973-02-21 |
BE766023A (fr) | 1971-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |