CH508278A - Integrierte Schaltung und Verfahren zu ihrer Herstellung - Google Patents

Integrierte Schaltung und Verfahren zu ihrer Herstellung

Info

Publication number
CH508278A
CH508278A CH1324069A CH1324069A CH508278A CH 508278 A CH508278 A CH 508278A CH 1324069 A CH1324069 A CH 1324069A CH 1324069 A CH1324069 A CH 1324069A CH 508278 A CH508278 A CH 508278A
Authority
CH
Switzerland
Prior art keywords
making
integrated circuit
integrated
circuit
Prior art date
Application number
CH1324069A
Other languages
English (en)
Inventor
Anthony Beale Julian Robert
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH508278A publication Critical patent/CH508278A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401—Combinations of FETs or IGBTs with BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
    • H10D84/858—Complementary IGFETs, e.g. CMOS comprising a P-type well but not an N-type well
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/031—Manufacture or treatment of isolation regions comprising PN junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/30—Isolation regions comprising PN junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H10W15/01—Manufacture or treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/098—Layer conversion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/151—Simultaneous diffusion
CH1324069A 1968-08-30 1969-09-01 Integrierte Schaltung und Verfahren zu ihrer Herstellung CH508278A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB41476/68A GB1280022A (en) 1968-08-30 1968-08-30 Improvements in and relating to semiconductor devices

Publications (1)

Publication Number Publication Date
CH508278A true CH508278A (de) 1971-05-31

Family

ID=10419864

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1324069A CH508278A (de) 1968-08-30 1969-09-01 Integrierte Schaltung und Verfahren zu ihrer Herstellung

Country Status (9)

Country Link
US (1) US3748545A (de)
BE (1) BE738309A (de)
CA (1) CA993119A (de)
CH (1) CH508278A (de)
DE (1) DE1944793C3 (de)
FR (1) FR2017125A1 (de)
GB (1) GB1280022A (de)
NL (1) NL6913300A (de)
SE (1) SE362540B (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885998A (en) * 1969-12-05 1975-05-27 Siemens Ag Method for the simultaneous formation of semiconductor components with individually tailored isolation regions
US4032372A (en) * 1971-04-28 1977-06-28 International Business Machines Corporation Epitaxial outdiffusion technique for integrated bipolar and field effect transistors
IT947674B (it) * 1971-04-28 1973-05-30 Ibm Tecnica di diffusione epitassiale per la fabbricazione di transisto ri bipolari e transistori fet
US3993512A (en) * 1971-11-22 1976-11-23 U.S. Philips Corporation Method of manufacturing an integrated circuit utilizing outdiffusion and multiple layer epitaxy
GB1361303A (en) * 1972-02-11 1974-07-24 Ferranti Ltd Manufacture of semiconductor devices
US3945032A (en) * 1972-05-30 1976-03-16 Ferranti Limited Semiconductor integrated circuit device having a conductive plane and a diffused network of conductive tracks
US3881179A (en) * 1972-08-23 1975-04-29 Motorola Inc Zener diode structure having three terminals
US3793088A (en) * 1972-11-15 1974-02-19 Bell Telephone Labor Inc Compatible pnp and npn devices in an integrated circuit
US3841918A (en) * 1972-12-01 1974-10-15 Bell Telephone Labor Inc Method of integrated circuit fabrication
US3992232A (en) * 1973-08-06 1976-11-16 Hitachi, Ltd. Method of manufacturing semiconductor device having oxide isolation structure and guard ring
US3920481A (en) * 1974-06-03 1975-11-18 Fairchild Camera Instr Co Process for fabricating insulated gate field effect transistor structure
JPS51135385A (en) * 1975-03-06 1976-11-24 Texas Instruments Inc Method of producing semiconductor device
US4028717A (en) * 1975-09-22 1977-06-07 Ibm Corporation Field effect transistor having improved threshold stability
US4203126A (en) * 1975-11-13 1980-05-13 Siliconix, Inc. CMOS structure and method utilizing retarded electric field for minimum latch-up
US4205330A (en) * 1977-04-01 1980-05-27 National Semiconductor Corporation Method of manufacturing a low voltage n-channel MOSFET device
US4168997A (en) * 1978-10-10 1979-09-25 National Semiconductor Corporation Method for making integrated circuit transistors with isolation and substrate connected collectors utilizing simultaneous outdiffusion to convert an epitaxial layer
JPS5574059U (de) * 1978-11-15 1980-05-21
JPS58225663A (ja) * 1982-06-23 1983-12-27 Toshiba Corp 半導体装置の製造方法
US5529939A (en) * 1986-09-26 1996-06-25 Analog Devices, Incorporated Method of making an integrated circuit with complementary isolated bipolar transistors
JP2575876B2 (ja) * 1989-05-17 1997-01-29 株式会社東芝 半導体装置
US5227654A (en) * 1989-05-17 1993-07-13 Kabushiki Kaisha Toshiba Semiconductor device with improved collector structure
JP3017809B2 (ja) * 1991-01-09 2000-03-13 株式会社東芝 アナログ・デジタル混載半導体集積回路装置
WO2022204913A1 (en) * 2021-03-30 2022-10-06 Innoscience (Suzhou) Technology Co., Ltd. Iii nitride semiconductor devices on patterned substrates
US12324179B2 (en) * 2021-12-16 2025-06-03 Wolfspeed, Inc. Group III-nitride high-electron mobility transistors with a buried metallic conductive material layer and process for making the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1050805A (de) * 1964-06-23 1900-01-01
US3386865A (en) * 1965-05-10 1968-06-04 Ibm Process of making planar semiconductor devices isolated by encapsulating oxide filled channels
US3404450A (en) * 1966-01-26 1968-10-08 Westinghouse Electric Corp Method of fabricating an integrated circuit structure including unipolar transistor and bipolar transistor portions
US3481801A (en) * 1966-10-10 1969-12-02 Frances Hugle Isolation technique for integrated circuits
US3474308A (en) * 1966-12-13 1969-10-21 Texas Instruments Inc Monolithic circuits having matched complementary transistors,sub-epitaxial and surface resistors,and n and p channel field effect transistors
US3447046A (en) * 1967-05-31 1969-05-27 Westinghouse Electric Corp Integrated complementary mos type transistor structure and method of making same

Also Published As

Publication number Publication date
CA993119A (en) 1976-07-13
US3748545A (en) 1973-07-24
DE1944793B2 (de) 1977-10-06
DE1944793C3 (de) 1979-06-07
BE738309A (de) 1970-03-02
FR2017125A1 (de) 1970-05-15
NL6913300A (de) 1970-03-03
SE362540B (de) 1973-12-10
DE1944793A1 (de) 1970-05-06
GB1280022A (en) 1972-07-05

Similar Documents

Publication Publication Date Title
CH508278A (de) Integrierte Schaltung und Verfahren zu ihrer Herstellung
CH505474A (de) Integrierte Schaltung und Verfahren zur Herstellung dieser Schaltung
CH528277A (de) Mehrschichtenski und Verfahren zu seiner Herstellung
CH481464A (de) Photoleitendes Element und Verfahren zu seiner Herstellung
AT326803B (de) Maschenware sowie verfahren zur herstellung derselben
AT294691B (de) Verpackung und Verfahren zur Herstellung derselben
CH534542A (de) Elektrode und Verfahren zu ihrer Herstellung
DE1961504B2 (de) Elektret und verfahren zu seiner herstellung
CH504100A (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
AT305019B (de) Polsterung und verfahren zu ihrer herstellung
CH538302A (de) Elektrode und Verfahren zu ihrer Herstellung
CH515426A (de) Schraube und Verfahren zur Herstellung derselben
CH499877A (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
CH522438A (de) Elektrode und Verfahren zu ihrer Herstellung
CH528819A (de) Halbleiterbauelement und Verfahren zu seiner Herstellung
DE1929296B2 (de) Elektromagnetischer wandler und verfahren zu seiner herstellung
AT316894B (de) Halbleitervorrichtung und Verfahren zur Herstellung derselben
CH474157A (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
CH477960A (de) Rotationsstanzform und Verfahren zu ihrer Herstellung
AT272171B (de) Explodierende Zündschnur und Verfahren zu ihrer Herstellung
CH506878A (de) Elektrochemischer Zeitschalter und Verfahren zu seiner Herstellung
CH555306A (de) Sprengstoff und verfahren zur herstellung desselben.
CH468637A (de) Elektrodenanordnung und Verfahren zu ihrer Herstellung
DE1811797B2 (de) Gekapselte spule und verfahren zu ihrer herstellung
AT247257B (de) Weblitze und Verfahren zu ihrer Herstellung

Legal Events

Date Code Title Description
PL Patent ceased