CH505463A - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
CH505463A
CH505463A CH1407869A CH1407869A CH505463A CH 505463 A CH505463 A CH 505463A CH 1407869 A CH1407869 A CH 1407869A CH 1407869 A CH1407869 A CH 1407869A CH 505463 A CH505463 A CH 505463A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH1407869A
Other languages
English (en)
Inventor
Schaerli Otto
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1407869A priority Critical patent/CH505463A/de
Priority to DE1951128A priority patent/DE1951128C3/de
Publication of CH505463A publication Critical patent/CH505463A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
CH1407869A 1969-09-18 1969-09-18 Halbleiteranordnung CH505463A (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH1407869A CH505463A (de) 1969-09-18 1969-09-18 Halbleiteranordnung
DE1951128A DE1951128C3 (de) 1969-09-18 1969-10-10 Halbleiteranordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1407869A CH505463A (de) 1969-09-18 1969-09-18 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
CH505463A true CH505463A (de) 1971-03-31

Family

ID=4397776

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1407869A CH505463A (de) 1969-09-18 1969-09-18 Halbleiteranordnung

Country Status (2)

Country Link
CH (1) CH505463A (de)
DE (1) DE1951128C3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017506819A (ja) * 2014-01-21 2017-03-09 アーベーベー・テクノロジー・アーゲー 電力半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2246423C3 (de) * 1972-09-21 1979-03-08 Siemens Ag, 1000 Berlin Und 8000 Muenchen Thyristor mit scheibenförmigem Gehäuse

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017506819A (ja) * 2014-01-21 2017-03-09 アーベーベー・テクノロジー・アーゲー 電力半導体装置

Also Published As

Publication number Publication date
DE1951128A1 (de) 1971-04-01
DE1951128C3 (de) 1978-04-06
DE1951128B2 (de) 1977-08-04

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Legal Events

Date Code Title Description
PL Patent ceased