CH484288A - Verfahren zum Herstellen von Metallstrukturen auf Halbleiteroberflächen - Google Patents

Verfahren zum Herstellen von Metallstrukturen auf Halbleiteroberflächen

Info

Publication number
CH484288A
CH484288A CH194567A CH194567A CH484288A CH 484288 A CH484288 A CH 484288A CH 194567 A CH194567 A CH 194567A CH 194567 A CH194567 A CH 194567A CH 484288 A CH484288 A CH 484288A
Authority
CH
Switzerland
Prior art keywords
production
metal structures
semiconductor surfaces
semiconductor
structures
Prior art date
Application number
CH194567A
Other languages
German (de)
English (en)
Inventor
Steppberger Alfred
Goetzeler Herbert Dr Dipl-Phys
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH484288A publication Critical patent/CH484288A/de

Links

Classifications

    • H10W20/069—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • H10W20/40—
    • H10W20/4407—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/043—Dual dielectric

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
CH194567A 1966-02-11 1967-02-09 Verfahren zum Herstellen von Metallstrukturen auf Halbleiteroberflächen CH484288A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0101956 1966-02-11

Publications (1)

Publication Number Publication Date
CH484288A true CH484288A (de) 1970-01-15

Family

ID=7524104

Family Applications (1)

Application Number Title Priority Date Filing Date
CH194567A CH484288A (de) 1966-02-11 1967-02-09 Verfahren zum Herstellen von Metallstrukturen auf Halbleiteroberflächen

Country Status (6)

Country Link
US (1) US3549437A (enExample)
CH (1) CH484288A (enExample)
FR (1) FR1511238A (enExample)
GB (1) GB1157475A (enExample)
NL (1) NL6617141A (enExample)
SE (1) SE333288B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL87258C (enExample) * 1969-01-15
JPS5910073B2 (ja) * 1972-10-27 1984-03-06 株式会社日立製作所 シリコン・ゲ−トｍｏｓ型半導体装置の製造方法
US4921158A (en) 1989-02-24 1990-05-01 General Instrument Corporation Brazing material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290753A (en) * 1963-08-19 1966-12-13 Bell Telephone Labor Inc Method of making semiconductor integrated circuit elements

Also Published As

Publication number Publication date
DE1521492A1 (de) 1969-08-21
NL6617141A (enExample) 1967-08-14
US3549437A (en) 1970-12-22
FR1511238A (fr) 1968-01-26
GB1157475A (en) 1969-07-09
DE1521492B2 (de) 1975-10-30
SE333288B (sv) 1971-03-08

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Legal Events

Date Code Title Description
PL Patent ceased