CH474850A - Halbleiterbauelement mit Kunststoffmantel - Google Patents

Halbleiterbauelement mit Kunststoffmantel

Info

Publication number
CH474850A
CH474850A CH1733768A CH1733768A CH474850A CH 474850 A CH474850 A CH 474850A CH 1733768 A CH1733768 A CH 1733768A CH 1733768 A CH1733768 A CH 1733768A CH 474850 A CH474850 A CH 474850A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
plastic jacket
jacket
plastic
semiconductor
Prior art date
Application number
CH1733768A
Other languages
English (en)
Inventor
E Zido Joseph
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH474850A publication Critical patent/CH474850A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
CH1733768A 1967-11-22 1968-11-21 Halbleiterbauelement mit Kunststoffmantel CH474850A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68513367A 1967-11-22 1967-11-22

Publications (1)

Publication Number Publication Date
CH474850A true CH474850A (de) 1969-06-30

Family

ID=24750903

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1733768A CH474850A (de) 1967-11-22 1968-11-21 Halbleiterbauelement mit Kunststoffmantel

Country Status (6)

Country Link
US (1) US3475662A (de)
CH (1) CH474850A (de)
DE (1) DE1810448A1 (de)
FR (1) FR1592763A (de)
GB (1) GB1173737A (de)
IE (1) IE32478B1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1789005A1 (de) * 1968-09-20 1972-01-20 Siemens Ag Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen
US3708722A (en) * 1970-12-18 1973-01-02 Erie Technological Prod Inc Semiconductor device with soldered terminals and plastic housing and method of making the same
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
US4196444A (en) * 1976-12-03 1980-04-01 Texas Instruments Deutschland Gmbh Encapsulated power semiconductor device with single piece heat sink mounting plate
US4161746A (en) * 1978-03-28 1979-07-17 Westinghouse Electric Corp. Glass sealed diode
US4168960A (en) * 1978-04-18 1979-09-25 Westinghouse Electric Corp. Method of making a glass encapsulated diode
DE3127457C2 (de) * 1981-07-11 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul
US4538168A (en) * 1981-09-30 1985-08-27 Unitrode Corporation High power semiconductor package
US4568795A (en) * 1983-08-19 1986-02-04 Alden Research Foundation Insulation filled carrier of conductive components
US5278446A (en) * 1992-07-06 1994-01-11 Motorola, Inc. Reduced stress plastic package
DE4341269A1 (de) * 1993-12-03 1995-06-22 Bosch Gmbh Robert Gleichrichterdiode
WO2002017391A2 (en) * 2000-08-18 2002-02-28 Koninklijke Philips Electronics N.V. Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method
FR2813441B1 (fr) * 2000-08-31 2005-01-14 Valeo Equip Electr Moteur Diode de puissance destinee a equiper le pont redresseur d'une machine electrique tournante tel qu'un alternateur pour vehicule automobile
DE10219762A1 (de) * 2002-05-02 2003-11-13 Vacuumschmelze Gmbh & Co Kg Vergussgehäuse für elektrische und elektronische Bauelemente, Vorrichtung daraus und Verfahren zum Herstellen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB926423A (en) * 1960-03-17 1963-05-15 Standard Telephones Cables Ltd Improvements in or relating to semiconductor rectifiers
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices

Also Published As

Publication number Publication date
DE1810448A1 (de) 1969-10-23
US3475662A (en) 1969-10-28
FR1592763A (de) 1970-05-19
GB1173737A (en) 1969-12-10
IE32478B1 (en) 1973-08-22
IE32478L (en) 1969-05-22

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Legal Events

Date Code Title Description
PL Patent ceased