CH468080A - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
CH468080A
CH468080A CH381568A CH381568A CH468080A CH 468080 A CH468080 A CH 468080A CH 381568 A CH381568 A CH 381568A CH 381568 A CH381568 A CH 381568A CH 468080 A CH468080 A CH 468080A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
CH381568A
Other languages
German (de)
English (en)
Inventor
Blake John
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH468080A publication Critical patent/CH468080A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/761—PN junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D88/00—Three-dimensional [3D] integrated devices
    • H10D88/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
CH381568A 1967-04-07 1968-03-13 Halbleitervorrichtung CH468080A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB05974/67A GB1162565A (en) 1967-04-07 1967-04-07 Improvements in and relating to Semiconductor Structures

Publications (1)

Publication Number Publication Date
CH468080A true CH468080A (de) 1969-01-31

Family

ID=10068943

Family Applications (1)

Application Number Title Priority Date Filing Date
CH381568A CH468080A (de) 1967-04-07 1968-03-13 Halbleitervorrichtung

Country Status (7)

Country Link
BE (1) BE713333A (cs)
CH (1) CH468080A (cs)
DE (1) DE1764106A1 (cs)
FR (1) FR1559209A (cs)
GB (1) GB1162565A (cs)
NL (1) NL6804786A (cs)
SE (1) SE331720B (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993016491A1 (en) * 1992-02-13 1993-08-19 Kopin Corporation High density electronic circuit modules
US6521940B1 (en) 1990-12-31 2003-02-18 Kopin Corporation High density electronic circuit modules
US6627953B1 (en) 1990-12-31 2003-09-30 Kopin Corporation High density electronic circuit modules

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2658304C2 (de) * 1975-12-24 1984-12-20 Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa Halbleitervorrichtung
US4028149A (en) * 1976-06-30 1977-06-07 Ibm Corporation Process for forming monocrystalline silicon carbide on silicon substrates
GB1548520A (en) 1976-08-27 1979-07-18 Tokyo Shibaura Electric Co Method of manufacturing a semiconductor device
US4161743A (en) * 1977-03-28 1979-07-17 Tokyo Shibaura Electric Co., Ltd. Semiconductor device with silicon carbide-glass-silicon carbide passivating overcoat

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5376561A (en) * 1990-12-31 1994-12-27 Kopin Corporation High density electronic circuit modules
US5702963A (en) * 1990-12-31 1997-12-30 Kopin Corporation Method of forming high density electronic circuit modules
US6521940B1 (en) 1990-12-31 2003-02-18 Kopin Corporation High density electronic circuit modules
US6627953B1 (en) 1990-12-31 2003-09-30 Kopin Corporation High density electronic circuit modules
WO1993016491A1 (en) * 1992-02-13 1993-08-19 Kopin Corporation High density electronic circuit modules

Also Published As

Publication number Publication date
BE713333A (cs) 1968-08-16
GB1162565A (en) 1969-08-27
DE1764106A1 (de) 1971-05-06
SE331720B (cs) 1971-01-11
FR1559209A (cs) 1969-03-07
NL6804786A (cs) 1968-10-08

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