CH464643A - Stabilisiertes Bad zur chemischen Verkupferung - Google Patents
Stabilisiertes Bad zur chemischen VerkupferungInfo
- Publication number
- CH464643A CH464643A CH189366A CH189366A CH464643A CH 464643 A CH464643 A CH 464643A CH 189366 A CH189366 A CH 189366A CH 189366 A CH189366 A CH 189366A CH 464643 A CH464643 A CH 464643A
- Authority
- CH
- Switzerland
- Prior art keywords
- copper plating
- chemical copper
- stabilized
- stabilized bath
- bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DESCH36568A DE1266099B (de) | 1965-02-20 | 1965-02-20 | Bad fuer die reduktive Kupferabscheidung |
Publications (1)
Publication Number | Publication Date |
---|---|
CH464643A true CH464643A (de) | 1968-10-31 |
Family
ID=7433913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH189366A CH464643A (de) | 1965-02-20 | 1966-02-10 | Stabilisiertes Bad zur chemischen Verkupferung |
Country Status (6)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110983309A (zh) * | 2019-12-26 | 2020-04-10 | 广东东硕科技有限公司 | 2-硫代海因类化合物或其盐的应用 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649350A (en) * | 1970-06-29 | 1972-03-14 | Gen Electric | Electroless copper plating |
US3793038A (en) * | 1973-01-02 | 1974-02-19 | Crown City Plating Co | Process for electroless plating |
NL164906C (nl) * | 1975-08-19 | 1981-02-16 | Philips Nv | Werkwijze voor de bereiding van een waterig alkalische verkoperbad. |
DE2635457C2 (de) * | 1976-08-04 | 1985-06-05 | Schering AG, 1000 Berlin und 4709 Bergkamen | Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen |
US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
NL8702219A (nl) * | 1987-09-16 | 1989-04-17 | Philips Nv | Werkwijze voor het lokaal aanbrengen van metaal op een oppervlak van een substraat. |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2609339A (en) * | 1948-11-02 | 1952-09-02 | United Chromium Inc | Bright copper plating from cyanide baths |
DE1243493B (de) * | 1961-02-04 | 1967-06-29 | Bayer Ag | Waessriges Bad zur chemischen Abscheidung von borhaltigen Metallueberzuegen |
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
-
1965
- 1965-02-20 DE DESCH36568A patent/DE1266099B/de active Pending
- 1965-12-22 US US515753A patent/US3454416A/en not_active Expired - Lifetime
-
1966
- 1966-02-10 CH CH189366A patent/CH464643A/de unknown
- 1966-02-15 GB GB6561/66A patent/GB1128306A/en not_active Expired
- 1966-02-18 BE BE676720D patent/BE676720A/xx unknown
- 1966-02-18 NL NL666602102A patent/NL149857B/xx not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110983309A (zh) * | 2019-12-26 | 2020-04-10 | 广东东硕科技有限公司 | 2-硫代海因类化合物或其盐的应用 |
CN110983309B (zh) * | 2019-12-26 | 2023-01-03 | 广东东硕科技有限公司 | 2-硫代海因类化合物或其盐的应用 |
Also Published As
Publication number | Publication date |
---|---|
GB1128306A (en) | 1968-09-25 |
DE1266099B (de) | 1968-04-11 |
BE676720A (US07714131-20100511-C00038.png) | 1966-08-18 |
NL6602102A (US07714131-20100511-C00038.png) | 1966-08-22 |
US3454416A (en) | 1969-07-08 |
NL149857B (nl) | 1976-06-15 |
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