CH458874A - Bain pour le dépôt non électrolytique de cuivre - Google Patents

Bain pour le dépôt non électrolytique de cuivre

Info

Publication number
CH458874A
CH458874A CH1612366A CH1612366A CH458874A CH 458874 A CH458874 A CH 458874A CH 1612366 A CH1612366 A CH 1612366A CH 1612366 A CH1612366 A CH 1612366A CH 458874 A CH458874 A CH 458874A
Authority
CH
Switzerland
Prior art keywords
bath
copper
electrolytic deposition
electrolytic
deposition
Prior art date
Application number
CH1612366A
Other languages
English (en)
French (fr)
Inventor
Borys Dutkewych Oleh
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Publication of CH458874A publication Critical patent/CH458874A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CH1612366A 1965-11-09 1966-11-09 Bain pour le dépôt non électrolytique de cuivre CH458874A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US507049A US3383224A (en) 1965-11-09 1965-11-09 Electroless copper deposition

Publications (1)

Publication Number Publication Date
CH458874A true CH458874A (fr) 1968-06-30

Family

ID=24017059

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1612366A CH458874A (fr) 1965-11-09 1966-11-09 Bain pour le dépôt non électrolytique de cuivre

Country Status (7)

Country Link
US (1) US3383224A (cs)
BE (1) BE689534A (cs)
CH (1) CH458874A (cs)
DE (1) DE1521512B1 (cs)
FR (1) FR1498966A (cs)
GB (1) GB1097848A (cs)
NL (1) NL148947B (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
CA1184359A (en) * 1981-10-23 1985-03-26 Donald A. Arcilesi Metallic impurity control for electroless copper plating
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
GB2154250B (en) * 1984-02-17 1987-06-03 Omi Int Corp Complexing agent for electroless copper plating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2329512A (en) * 1941-04-11 1943-09-14 Jr Reese F Clifford Drinking glass holder
DE731102C (de) * 1941-12-13 1943-02-03 Dr Herbert Brintzinger Verfahren zur Erzeugung metallischer UEberzuege
DE1135261B (de) * 1953-08-27 1962-08-23 Gen Am Transport Verfahren zur chemischen Vernickelung eines Gegenstandes mit katalytischer Oberflaeche
DE1154991B (de) * 1961-01-26 1963-09-26 Riedel & Co Stammloesung fuer die Herstellung und Regenerierung eines waessrigen Bades zur stromlsen Vernickelung

Also Published As

Publication number Publication date
DE1521512B1 (de) 1970-06-04
GB1097848A (en) 1968-01-03
NL148947B (nl) 1976-03-15
US3383224A (en) 1968-05-14
BE689534A (cs) 1967-05-09
NL6615822A (cs) 1967-05-10
FR1498966A (fr) 1967-10-20

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