CH447779A - Procédé de soudure d'une pièce de tungstène contenant de l'or ou de l'argent sur au moins une autre pièce et application de ce procédé - Google Patents
Procédé de soudure d'une pièce de tungstène contenant de l'or ou de l'argent sur au moins une autre pièce et application de ce procédéInfo
- Publication number
- CH447779A CH447779A CH1466566A CH1466566A CH447779A CH 447779 A CH447779 A CH 447779A CH 1466566 A CH1466566 A CH 1466566A CH 1466566 A CH1466566 A CH 1466566A CH 447779 A CH447779 A CH 447779A
- Authority
- CH
- Switzerland
- Prior art keywords
- silver
- tungsten
- piece
- gold
- metal
- Prior art date
Links
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 20
- 238000000034 method Methods 0.000 title claims description 20
- 229910052737 gold Inorganic materials 0.000 title claims description 19
- 239000010931 gold Substances 0.000 title claims description 19
- 229910052721 tungsten Inorganic materials 0.000 title claims description 19
- 239000010937 tungsten Substances 0.000 title claims description 19
- 229910052709 silver Inorganic materials 0.000 title claims description 18
- 239000004332 silver Substances 0.000 title claims description 18
- 238000003466 welding Methods 0.000 title claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004320 controlled atmosphere Methods 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- WVBBLATZSOLERT-UHFFFAOYSA-N gold tungsten Chemical compound [W].[Au] WVBBLATZSOLERT-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- UYKQQBUWKSHMIM-UHFFFAOYSA-N silver tungsten Chemical compound [Ag][W][W] UYKQQBUWKSHMIM-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- GALOTNBSUVEISR-UHFFFAOYSA-N molybdenum;silicon Chemical compound [Mo]#[Si] GALOTNBSUVEISR-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR36131A FR1473897A (fr) | 1965-10-25 | 1965-10-25 | Procédé de soudure d'une pièce en tungstène contenant de l'or ou de l'argent surau moins une autre pièce en métal ou en matériau semi conducteur |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH447779A true CH447779A (fr) | 1967-11-30 |
Family
ID=8591152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1466566A CH447779A (fr) | 1965-10-25 | 1966-10-10 | Procédé de soudure d'une pièce de tungstène contenant de l'or ou de l'argent sur au moins une autre pièce et application de ce procédé |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE688442A (enrdf_load_stackoverflow) |
| CH (1) | CH447779A (enrdf_load_stackoverflow) |
| FR (1) | FR1473897A (enrdf_load_stackoverflow) |
| LU (1) | LU52217A1 (enrdf_load_stackoverflow) |
| NL (1) | NL6614988A (enrdf_load_stackoverflow) |
-
1965
- 1965-10-25 FR FR36131A patent/FR1473897A/fr not_active Expired
-
1966
- 1966-10-10 CH CH1466566A patent/CH447779A/fr unknown
- 1966-10-18 BE BE688442D patent/BE688442A/xx unknown
- 1966-10-21 NL NL6614988A patent/NL6614988A/xx unknown
- 1966-10-21 LU LU52217D patent/LU52217A1/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR1473897A (fr) | 1967-03-24 |
| NL6614988A (enrdf_load_stackoverflow) | 1967-04-26 |
| LU52217A1 (enrdf_load_stackoverflow) | 1968-05-08 |
| BE688442A (enrdf_load_stackoverflow) | 1967-04-18 |
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