CH444967A - Condensateur électrique - Google Patents
Condensateur électriqueInfo
- Publication number
- CH444967A CH444967A CH725766A CH725766A CH444967A CH 444967 A CH444967 A CH 444967A CH 725766 A CH725766 A CH 725766A CH 725766 A CH725766 A CH 725766A CH 444967 A CH444967 A CH 444967A
- Authority
- CH
- Switzerland
- Prior art keywords
- sep
- buffer layer
- capacitor
- sub
- glaze
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims description 38
- 239000000463 material Substances 0.000 claims description 27
- 230000002787 reinforcement Effects 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000002425 crystallisation Methods 0.000 claims description 6
- 230000008025 crystallization Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000012811 non-conductive material Substances 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 59
- 239000000203 mixture Substances 0.000 description 7
- 241000779819 Syncarpia glomulifera Species 0.000 description 6
- 239000000470 constituent Substances 0.000 description 6
- 229940036248 turpentine Drugs 0.000 description 6
- 238000002156 mixing Methods 0.000 description 5
- 239000001739 pinus spp. Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 244000178870 Lavandula angustifolia Species 0.000 description 2
- 235000010663 Lavandula angustifolia Nutrition 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000001102 lavandula vera Substances 0.000 description 2
- 235000018219 lavender Nutrition 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- UDHXJZHVNHGCEC-UHFFFAOYSA-N Chlorophacinone Chemical compound C1=CC(Cl)=CC=C1C(C=1C=CC=CC=1)C(=O)C1C(=O)C2=CC=CC=C2C1=O UDHXJZHVNHGCEC-UHFFFAOYSA-N 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000171 lavandula angustifolia l. flower oil Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
- H01G4/105—Glass dielectric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US45661665A | 1965-05-18 | 1965-05-18 | |
| US456615A US3267342A (en) | 1965-05-18 | 1965-05-18 | Electrical capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH444967A true CH444967A (fr) | 1967-10-15 |
Family
ID=27038310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH725766A CH444967A (fr) | 1965-05-18 | 1966-05-18 | Condensateur électrique |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH444967A (pm) |
| DE (1) | DE1539772A1 (pm) |
| NL (1) | NL6606843A (pm) |
| SE (1) | SE305903B (pm) |
-
1966
- 1966-05-12 DE DE19661539772 patent/DE1539772A1/de active Pending
- 1966-05-18 NL NL6606843A patent/NL6606843A/xx unknown
- 1966-05-18 CH CH725766A patent/CH444967A/fr unknown
- 1966-05-18 SE SE693166A patent/SE305903B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6606843A (pm) | 1966-11-21 |
| SE305903B (pm) | 1968-11-11 |
| DE1539772A1 (de) | 1970-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101626840B1 (ko) | 유기 ｅｌ 봉착용 무연 유리재와 이것을 사용한 유기 ｅｌ 디스플레이 | |
| TWI391361B (zh) | 低軟化點之玻璃組成物，使用彼之黏合材料及電子零件 | |
| JP3699652B2 (ja) | プラチナ温度センサおよびその製造方法 | |
| US4554573A (en) | Glass-sealed ceramic package type semiconductor device | |
| JP5076166B2 (ja) | 圧電デバイス及びその封止方法 | |
| EP1911104A1 (de) | Verfahren zur herstellung von halbleiterbauelementen und dünnfilm-halbleiterbauelement | |
| EP1459601B1 (en) | Low firing temperature thick film dielectric layer for electroluminescent display | |
| FR2782077A1 (fr) | Procede de reduction de collage a chaud dans des processus de moulage, et dispositif pour la mise en oeuvre de ce procede | |
| WO2013015402A1 (ja) | 半導体装置の製造方法及び半導体装置 | |
| DE19545422C2 (de) | Verfahren zum anodischen Bonden von Siliziumkomponenten mit Glaskomponenten | |
| DE102010024520B4 (de) | Verfahren zur Erhöhung der thermo-mechanischen Beständigkeit eines Metall-Keramik-Substrats | |
| FR2564455A1 (fr) | Melange de depart pour une composition isolante, encre serigraphiable comportant un tel melange et utilisation de cette encre pour la realisation de microcircuits hybrides sur substrat colamine | |
| FR2496385A1 (pm) | ||
| JPS6120132B2 (pm) | ||
| US5066620A (en) | Conductive paste compositions and ceramic substrates | |
| CH444967A (fr) | Condensateur électrique | |
| FR2570223A1 (fr) | Dispositif piezoelectrique et procede de realisation d'un tel dispositif | |
| JPH0340939B2 (pm) | ||
| US5397830A (en) | Dielectric materials | |
| EP0170012B1 (de) | Metall-Keramik-Verbundelement und Verfahren zu dessen Herstellung | |
| WO2017016461A1 (zh) | 封装材料、有机发光二极管器件及其封装方法 | |
| US4985376A (en) | Conductive paste compositions and ceramic substrates | |
| JPH04253323A (ja) | 半導体装置の製造方法 | |
| RU2454841C2 (ru) | Схемная подложка | |
| JP2002145676A (ja) | 陽極接合方法 |