CH440460A - Elektrisches Bauelement, mit einer Isolierstoffhülle und Verfahren zur Herstellung eines solchen Bauelementes - Google Patents

Elektrisches Bauelement, mit einer Isolierstoffhülle und Verfahren zur Herstellung eines solchen Bauelementes

Info

Publication number
CH440460A
CH440460A CH1435065A CH1435065A CH440460A CH 440460 A CH440460 A CH 440460A CH 1435065 A CH1435065 A CH 1435065A CH 1435065 A CH1435065 A CH 1435065A CH 440460 A CH440460 A CH 440460A
Authority
CH
Switzerland
Prior art keywords
component
producing
insulating sheath
electrical component
electrical
Prior art date
Application number
CH1435065A
Other languages
English (en)
Inventor
Fritz-Werner Dipl Ch Beyerlein
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH440460A publication Critical patent/CH440460A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH1435065A 1964-10-19 1965-10-18 Elektrisches Bauelement, mit einer Isolierstoffhülle und Verfahren zur Herstellung eines solchen Bauelementes CH440460A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0093786 1964-10-19

Publications (1)

Publication Number Publication Date
CH440460A true CH440460A (de) 1967-07-31

Family

ID=7518264

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1435065A CH440460A (de) 1964-10-19 1965-10-18 Elektrisches Bauelement, mit einer Isolierstoffhülle und Verfahren zur Herstellung eines solchen Bauelementes

Country Status (7)

Country Link
US (1) US3390226A (de)
CH (1) CH440460A (de)
DE (1) DE1439460A1 (de)
FR (1) FR1450268A (de)
GB (1) GB1119764A (de)
NL (1) NL6511539A (de)
SE (1) SE311045B (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2750357A1 (de) * 1976-11-09 1978-05-11 Minnesota Mining & Mfg Material zur herstellung von schutzumhuellungen fuer elektronische bauteile
DE3613060A1 (de) * 1986-04-18 1987-10-22 Herberts Gmbh Ueberzugsmittel mit hoher elektrischer leitfaehigkeit und dessen verwendung zur herstellung von ueberzuegen
DE10141889A1 (de) * 2001-08-28 2003-04-17 Bosch Gmbh Robert Vorrichtung

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614587B2 (de) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
IE33405B1 (en) * 1968-12-09 1974-06-12 Gen Electric Semiconductor wafers sub-dividable into pellets and methods of fabricating same
DE2348687B1 (de) * 1973-09-27 1974-10-31 Siemens Ag Steckbares Gehaeuse
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages
US4051444A (en) * 1975-01-16 1977-09-27 Sybron Corporation Amplifier structure for low-level voltage measurements
NL7511173A (nl) * 1975-09-23 1977-03-25 Philips Nv Zelfregelend verwarmingselement.
NL7701813A (nl) * 1977-02-21 1978-08-23 Philips Nv Verwarmingselement met een ptc-weerstands- lichaam.
US4326238A (en) * 1977-12-28 1982-04-20 Fujitsu Limited Electronic circuit packages
DE3104270A1 (de) * 1981-02-07 1982-09-02 Vacuumschmelze Gmbh, 6450 Hanau Funkentstoeranordnung und verfahren zur herstellung
US4451727A (en) * 1981-11-30 1984-05-29 Rca Corporation Heating fixture
JPS58209147A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 樹脂封止型半導体装置
US4750031A (en) * 1982-06-25 1988-06-07 The United States Of America As Represented By The United States National Aeronautics And Space Administration Hermetically sealable package for hybrid solid-state electronic devices and the like
GB2168855B (en) * 1984-12-20 1987-11-25 Stanley Electric Co Ltd Encapsulated electronic circuit
DE3527208A1 (de) * 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
US4953002A (en) * 1988-03-31 1990-08-28 Honeywell Inc. Semiconductor device housing with magnetic field protection
US5998867A (en) * 1996-02-23 1999-12-07 Honeywell Inc. Radiation enhanced chip encapsulant
US8022511B2 (en) 2008-02-05 2011-09-20 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8350367B2 (en) * 2008-02-05 2013-01-08 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US7989928B2 (en) * 2008-02-05 2011-08-02 Advanced Semiconductor Engineering Inc. Semiconductor device packages with electromagnetic interference shielding
US8212339B2 (en) * 2008-02-05 2012-07-03 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8410584B2 (en) * 2008-08-08 2013-04-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US20100110656A1 (en) * 2008-10-31 2010-05-06 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8110902B2 (en) * 2009-02-19 2012-02-07 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8212340B2 (en) * 2009-07-13 2012-07-03 Advanced Semiconductor Engineering, Inc. Chip package and manufacturing method thereof
US8378466B2 (en) 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
US8368185B2 (en) * 2009-11-19 2013-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8030750B2 (en) * 2009-11-19 2011-10-04 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with electromagnetic interference shielding
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 Advanced Semiconductor Eng 半導體封裝件及其製造方法
TWI540698B (zh) 2010-08-02 2016-07-01 日月光半導體製造股份有限公司 半導體封裝件與其製造方法
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof
US8704341B2 (en) 2012-05-15 2014-04-22 Advanced Semiconductor Engineering, Inc. Semiconductor packages with thermal dissipation structures and EMI shielding
US8653634B2 (en) 2012-06-11 2014-02-18 Advanced Semiconductor Engineering, Inc. EMI-shielded semiconductor devices and methods of making
DE102014217260A1 (de) * 2014-08-29 2016-03-17 Robert Bosch Gmbh Halbleiterbauelement und Verfahren zum Herstellen von Halbleiterbauelementen

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2307027A (en) * 1940-05-10 1943-01-05 Davie Shielded radio tube
US2450310A (en) * 1944-07-20 1948-09-28 Telegraph Condenser Co Ltd Tubular container for electrical condensers or other apparatus
US2829320A (en) * 1955-01-12 1958-04-01 Bell Telephone Labor Inc Encapsulation for electrical components and method of manufacture
NL244922A (de) * 1958-11-03

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2750357A1 (de) * 1976-11-09 1978-05-11 Minnesota Mining & Mfg Material zur herstellung von schutzumhuellungen fuer elektronische bauteile
DE3613060A1 (de) * 1986-04-18 1987-10-22 Herberts Gmbh Ueberzugsmittel mit hoher elektrischer leitfaehigkeit und dessen verwendung zur herstellung von ueberzuegen
DE10141889A1 (de) * 2001-08-28 2003-04-17 Bosch Gmbh Robert Vorrichtung

Also Published As

Publication number Publication date
SE311045B (de) 1969-05-27
DE1439460A1 (de) 1968-12-12
US3390226A (en) 1968-06-25
NL6511539A (de) 1966-04-20
FR1450268A (fr) 1966-05-06
GB1119764A (en) 1968-07-10

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