CH392701A - Diode à semi-conducteur et son procédé de fabrication - Google Patents

Diode à semi-conducteur et son procédé de fabrication

Info

Publication number
CH392701A
CH392701A CH479161A CH479161A CH392701A CH 392701 A CH392701 A CH 392701A CH 479161 A CH479161 A CH 479161A CH 479161 A CH479161 A CH 479161A CH 392701 A CH392701 A CH 392701A
Authority
CH
Switzerland
Prior art keywords
manufacturing process
semiconductor diode
diode
semiconductor
manufacturing
Prior art date
Application number
CH479161A
Other languages
English (en)
Inventor
Dumas Guy
Original Assignee
Silec Liaisons Elec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silec Liaisons Elec filed Critical Silec Liaisons Elec
Publication of CH392701A publication Critical patent/CH392701A/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49893—Peripheral joining of opposed mirror image parts to form a hollow body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
CH479161A 1960-04-29 1961-04-24 Diode à semi-conducteur et son procédé de fabrication CH392701A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR825725A FR1269094A (fr) 1960-04-29 1960-04-29 Diode à semi-conducteur

Publications (1)

Publication Number Publication Date
CH392701A true CH392701A (fr) 1965-05-31

Family

ID=8730346

Family Applications (1)

Application Number Title Priority Date Filing Date
CH479161A CH392701A (fr) 1960-04-29 1961-04-24 Diode à semi-conducteur et son procédé de fabrication

Country Status (6)

Country Link
US (1) US3234437A (fr)
CH (1) CH392701A (fr)
DE (1) DE1194503B (fr)
FR (1) FR1269094A (fr)
GB (1) GB928436A (fr)
NL (2) NL123901C (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484660A (en) * 1963-09-20 1969-12-16 Gen Electric Sealed electrical device
US3373335A (en) * 1964-12-22 1968-03-12 Electronic Devices Inc Stacked assembly of rectifier units incorporating shunt capacitors
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3735211A (en) * 1971-06-21 1973-05-22 Fairchild Camera Instr Co Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal
FR2182791B1 (fr) * 1972-05-03 1977-12-30 Siemens Ag
US4021839A (en) * 1975-10-16 1977-05-03 Rca Corporation Diode package
JP2841940B2 (ja) * 1990-12-19 1998-12-24 富士電機株式会社 半導体素子
WO2020081448A1 (fr) * 2018-10-15 2020-04-23 Semtech Corporation Boîtier de semi-conducteur pour fournir une isolation mécanique de diodes assemblées

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2423091A (en) * 1942-10-03 1947-07-01 Standard Telephones Cables Ltd Contact rectifier
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
NL94441C (fr) * 1951-09-15
FR1108663A (fr) * 1953-10-19 1956-01-16 Licentia Gmbh Système conducteur électrique asymétrique
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material
NL203133A (fr) * 1954-12-27
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
US3017550A (en) * 1959-08-07 1962-01-16 Motorola Inc Semiconductor device
US3023346A (en) * 1959-11-27 1962-02-27 Westinghouse Electric Corp Rectifier structure

Also Published As

Publication number Publication date
GB928436A (en) 1963-06-12
NL264049A (fr)
DE1194503B (de) 1965-06-10
FR1269094A (fr) 1961-08-11
US3234437A (en) 1966-02-08
NL123901C (fr)

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