NL123901C - - Google Patents

Info

Publication number
NL123901C
NL123901C NL123901DA NL123901C NL 123901 C NL123901 C NL 123901C NL 123901D A NL123901D A NL 123901DA NL 123901 C NL123901 C NL 123901C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL123901C publication Critical patent/NL123901C/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49893—Peripheral joining of opposed mirror image parts to form a hollow body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL123901D 1960-04-29 NL123901C (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR825725A FR1269094A (fr) 1960-04-29 1960-04-29 Diode à semi-conducteur

Publications (1)

Publication Number Publication Date
NL123901C true NL123901C (fr)

Family

ID=8730346

Family Applications (2)

Application Number Title Priority Date Filing Date
NL123901D NL123901C (fr) 1960-04-29
NL264049D NL264049A (fr) 1960-04-29

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL264049D NL264049A (fr) 1960-04-29

Country Status (6)

Country Link
US (1) US3234437A (fr)
CH (1) CH392701A (fr)
DE (1) DE1194503B (fr)
FR (1) FR1269094A (fr)
GB (1) GB928436A (fr)
NL (2) NL264049A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484660A (en) * 1963-09-20 1969-12-16 Gen Electric Sealed electrical device
US3373335A (en) * 1964-12-22 1968-03-12 Electronic Devices Inc Stacked assembly of rectifier units incorporating shunt capacitors
US3413532A (en) * 1965-02-08 1968-11-26 Westinghouse Electric Corp Compression bonded semiconductor device
US3476986A (en) * 1966-09-17 1969-11-04 Nippon Electric Co Pressure contact semiconductor devices
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3735211A (en) * 1971-06-21 1973-05-22 Fairchild Camera Instr Co Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal
FR2182791B1 (fr) * 1972-05-03 1977-12-30 Siemens Ag
US4021839A (en) * 1975-10-16 1977-05-03 Rca Corporation Diode package
JP2841940B2 (ja) * 1990-12-19 1998-12-24 富士電機株式会社 半導体素子
WO2020081448A1 (fr) * 2018-10-15 2020-04-23 Semtech Corporation Boîtier de semi-conducteur pour fournir une isolation mécanique de diodes assemblées

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2423091A (en) * 1942-10-03 1947-07-01 Standard Telephones Cables Ltd Contact rectifier
US2738452A (en) * 1950-06-30 1956-03-13 Siemens Ag Dry multi-pellet rectifiers
NL94441C (fr) * 1951-09-15
FR1108663A (fr) * 1953-10-19 1956-01-16 Licentia Gmbh Système conducteur électrique asymétrique
GB815289A (en) * 1954-11-12 1959-06-24 British Thomson Houston Co Ltd Improvements in rectifiers utilising semi-conducting material
NL100659C (fr) * 1954-12-27
AT203550B (de) * 1957-03-01 1959-05-25 Western Electric Co Halbleitereinrichtung und Verfahren zu deren Herstellung
US3017550A (en) * 1959-08-07 1962-01-16 Motorola Inc Semiconductor device
US3023346A (en) * 1959-11-27 1962-02-27 Westinghouse Electric Corp Rectifier structure

Also Published As

Publication number Publication date
CH392701A (fr) 1965-05-31
US3234437A (en) 1966-02-08
NL264049A (fr)
GB928436A (en) 1963-06-12
DE1194503B (de) 1965-06-10
FR1269094A (fr) 1961-08-11

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