CH353085A - Halbleitervorrichtung - Google Patents
HalbleitervorrichtungInfo
- Publication number
- CH353085A CH353085A CH353085DA CH353085A CH 353085 A CH353085 A CH 353085A CH 353085D A CH353085D A CH 353085DA CH 353085 A CH353085 A CH 353085A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Ink Jet (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL209354 | 1956-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH353085A true CH353085A (de) | 1961-03-31 |
Family
ID=19750776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH353085D CH353085A (de) | 1956-07-27 | 1957-07-25 | Halbleitervorrichtung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US2922935A (enEXAMPLES) |
| BE (1) | BE559579A (enEXAMPLES) |
| CH (1) | CH353085A (enEXAMPLES) |
| DE (1) | DE1776920U (enEXAMPLES) |
| FR (1) | FR1180097A (enEXAMPLES) |
| NL (2) | NL106417C (enEXAMPLES) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3018539A (en) * | 1956-11-06 | 1962-01-30 | Motorola Inc | Diffused base transistor and method of making same |
| US3058041A (en) * | 1958-09-12 | 1962-10-09 | Raytheon Co | Electrical cooling devices |
| US3018424A (en) * | 1959-05-28 | 1962-01-23 | Westinghouse Electric Corp | Rectifier apparatus |
| US3117179A (en) * | 1959-07-24 | 1964-01-07 | Clevite Corp | Transistor capsule and header therefor |
| US3020454A (en) * | 1959-11-09 | 1962-02-06 | Solid State Products Inc | Sealing of electrical semiconductor devices |
| US3024519A (en) * | 1960-07-19 | 1962-03-13 | Bendix Corp | Cold weld semiconductor housing |
| US3261904A (en) * | 1963-09-16 | 1966-07-19 | United Aircraft Corp | Transistor mounting and heat transfer apparatus with adjustable pressure detachable mounting means |
| US4143395A (en) * | 1976-10-15 | 1979-03-06 | Tokyo Shibaura Electric Co., Ltd. | Stud-type semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2820929A (en) * | 1958-01-21 | Transistor holders | ||
| US2609426A (en) * | 1948-11-01 | 1952-09-02 | Hartford Nat Bank & Trust Co | Electrolytic condenser |
| US2790940A (en) * | 1955-04-22 | 1957-04-30 | Bell Telephone Labor Inc | Silicon rectifier and method of manufacture |
-
0
- BE BE559579D patent/BE559579A/xx unknown
- NL NL209354D patent/NL209354A/xx unknown
- NL NL106417D patent/NL106417C/xx active
-
1957
- 1957-05-06 US US657147A patent/US2922935A/en not_active Expired - Lifetime
- 1957-07-23 DE DEN7771U patent/DE1776920U/de not_active Expired
- 1957-07-25 FR FR1180097D patent/FR1180097A/fr not_active Expired
- 1957-07-25 CH CH353085D patent/CH353085A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1776920U (de) | 1958-11-06 |
| NL106417C (enEXAMPLES) | |
| US2922935A (en) | 1960-01-26 |
| FR1180097A (fr) | 1959-06-01 |
| NL209354A (enEXAMPLES) | |
| BE559579A (enEXAMPLES) |
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