CA927010A - Lead frame for a semi-conductor device and method of making it - Google Patents

Lead frame for a semi-conductor device and method of making it

Info

Publication number
CA927010A
CA927010A CA106089A CA106089A CA927010A CA 927010 A CA927010 A CA 927010A CA 106089 A CA106089 A CA 106089A CA 106089 A CA106089 A CA 106089A CA 927010 A CA927010 A CA 927010A
Authority
CA
Canada
Prior art keywords
semi
making
lead frame
conductor device
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA106089A
Other languages
English (en)
Other versions
CA106089S (en
Inventor
V. Pauza William
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of CA927010A publication Critical patent/CA927010A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W70/461—
    • H10W40/778—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
CA106089A 1970-03-20 1971-02-23 Lead frame for a semi-conductor device and method of making it Expired CA927010A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2134870A 1970-03-20 1970-03-20
US2132870A 1970-03-20 1970-03-20

Publications (1)

Publication Number Publication Date
CA927010A true CA927010A (en) 1973-05-22

Family

ID=26694557

Family Applications (1)

Application Number Title Priority Date Filing Date
CA106089A Expired CA927010A (en) 1970-03-20 1971-02-23 Lead frame for a semi-conductor device and method of making it

Country Status (10)

Country Link
US (2) US3651448A (show.php)
AT (1) AT312732B (show.php)
BE (1) BE764427A (show.php)
CA (1) CA927010A (show.php)
DE (1) DE2111788A1 (show.php)
ES (1) ES198768Y (show.php)
FR (1) FR2083471B1 (show.php)
GB (1) GB1295594A (show.php)
NL (1) NL151841B (show.php)
SE (1) SE364426B (show.php)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3736367A (en) * 1971-04-09 1973-05-29 Amp Inc Lead frames and method of making same
US3735017A (en) * 1971-04-12 1973-05-22 Amp Inc Lead frames and method of making same
US3769695A (en) * 1971-07-06 1973-11-06 Harris Intertype Corp Static eliminator
US3768986A (en) * 1971-10-08 1973-10-30 Micro Science Ass Laminated lead frame and method of producing same
IT960675B (it) * 1972-06-03 1973-11-30 Ates Componenti Elettron Assemblaggio per produzione di circuiti integrati con conteni tore di resina
US3832480A (en) * 1972-07-07 1974-08-27 Gte Sylvania Inc Intermediate package and method for making
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
SE437900B (sv) * 1976-10-21 1985-03-18 Ates Componenti Elettron Halvledaranordning innefattande en vermeavledare eller kylkropp
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
US4458413A (en) * 1981-01-26 1984-07-10 Olin Corporation Process for forming multi-gauge strip
DE3231557A1 (de) * 1982-08-25 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement mit mindestens einer anschlussfahne
US4536825A (en) * 1984-03-29 1985-08-20 Unitrode Corporation Leadframe having severable fingers for aligning one or more electronic circuit device components
JPS62122136A (ja) * 1985-11-08 1987-06-03 Hitachi Ltd レジンモールド半導体の製造方法および装置
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
US6133634A (en) * 1998-08-05 2000-10-17 Fairchild Semiconductor Corporation High performance flip chip package
US6675755B2 (en) * 2000-04-06 2004-01-13 Visteon Global Technologies, Inc. Integrated powertrain control system for large engines
DE102006035876A1 (de) * 2006-08-01 2008-02-07 Infineon Technologies Ag Chip-Modul, Verfahren zur Herstellung eines Chip-Moduls und Mehrfachchip-Modul
US9031104B2 (en) 2011-05-10 2015-05-12 Obzerv Technologies Inc. Low inductance laser diode bar mount

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3234320A (en) * 1963-06-11 1966-02-08 United Carr Inc Integrated circuit package
DE1514822A1 (de) * 1964-08-14 1969-06-26 Telefunken Patent Verfahren zur Herstellung einer Halbleiteranordnung
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3423516A (en) * 1966-07-13 1969-01-21 Motorola Inc Plastic encapsulated semiconductor assemblies
US3484533A (en) * 1966-09-29 1969-12-16 Texas Instruments Inc Method for fabricating semiconductor package and resulting article of manufacture
US3524249A (en) * 1966-10-08 1970-08-18 Nippon Electric Co Method of manufacturing a semiconductor container
US3509430A (en) * 1968-01-31 1970-04-28 Micro Science Associates Mount for electronic component

Also Published As

Publication number Publication date
NL7103398A (show.php) 1971-09-22
GB1295594A (show.php) 1972-11-08
BE764427A (fr) 1971-09-17
DE2111788A1 (de) 1971-10-07
SE364426B (show.php) 1974-02-18
US3651448A (en) 1972-03-21
US3628483A (en) 1971-12-21
FR2083471A1 (show.php) 1971-12-17
ES198768Y (es) 1975-11-16
AT312732B (de) 1974-01-10
NL151841B (nl) 1976-12-15
ES198768U (es) 1975-07-01
FR2083471B1 (show.php) 1977-01-28

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