CA3161142A1 - Device and method for polishing a specimen - Google Patents
Device and method for polishing a specimenInfo
- Publication number
- CA3161142A1 CA3161142A1 CA3161142A CA3161142A CA3161142A1 CA 3161142 A1 CA3161142 A1 CA 3161142A1 CA 3161142 A CA3161142 A CA 3161142A CA 3161142 A CA3161142 A CA 3161142A CA 3161142 A1 CA3161142 A1 CA 3161142A1
- Authority
- CA
- Canada
- Prior art keywords
- polishing
- polishing pad
- physical quantity
- measuring
- suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 367
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000725 suspension Substances 0.000 claims abstract description 64
- 239000007921 spray Substances 0.000 claims description 35
- 238000003825 pressing Methods 0.000 claims description 9
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000000704 physical effect Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 9
- 230000006870 function Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000007517 polishing process Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 229920005597 polymer membrane Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052729 chemical element Inorganic materials 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000136 polysorbate Polymers 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 240000004759 Inga spectabilis Species 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20195982 | 2019-11-18 | ||
| FI20195982A FI130973B1 (en) | 2019-11-18 | 2019-11-18 | Apparatus and method for polishing a piece |
| PCT/FI2020/050764 WO2021099681A1 (en) | 2019-11-18 | 2020-11-16 | Device and method for polishing a specimen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA3161142A1 true CA3161142A1 (en) | 2021-05-27 |
Family
ID=73598895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3161142A Pending CA3161142A1 (en) | 2019-11-18 | 2020-11-16 | Device and method for polishing a specimen |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20220395955A1 (ja) |
| EP (1) | EP4061576A1 (ja) |
| JP (1) | JP2023503280A (ja) |
| KR (1) | KR20220134521A (ja) |
| CN (1) | CN114728397A (ja) |
| AU (1) | AU2020385654A1 (ja) |
| CA (1) | CA3161142A1 (ja) |
| FI (1) | FI130973B1 (ja) |
| TW (1) | TW202122213A (ja) |
| WO (1) | WO2021099681A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023242481A1 (en) * | 2022-06-15 | 2023-12-21 | Turun Yliopisto | Device and method for moistening a polishing pad |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
| US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| JP3311203B2 (ja) * | 1995-06-13 | 2002-08-05 | 株式会社東芝 | 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法 |
| US6007405A (en) * | 1998-07-17 | 1999-12-28 | Promos Technologies, Inc. | Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping |
| KR20010030213A (ko) * | 1999-09-02 | 2001-04-16 | 아끼모토 유미 | 연마 헤드, 이것을 이용한 연마 장치, 및 연마 상태 검출방법 |
| US6626736B2 (en) * | 2000-06-30 | 2003-09-30 | Ebara Corporation | Polishing apparatus |
| US6623329B1 (en) * | 2000-08-31 | 2003-09-23 | Micron Technology, Inc. | Method and apparatus for supporting a microelectronic substrate relative to a planarization pad |
| US6257953B1 (en) * | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
| US6722943B2 (en) * | 2001-08-24 | 2004-04-20 | Micron Technology, Inc. | Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces |
| DE10303407A1 (de) * | 2003-01-27 | 2004-08-19 | Friedrich-Schiller-Universität Jena | Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten |
| WO2005043132A1 (en) * | 2003-10-31 | 2005-05-12 | Applied Materials, Inc. | Polishing endpoint detection system and method using friction sensor |
| US8169329B2 (en) * | 2007-03-19 | 2012-05-01 | Arthur Koblasz | Fluid detecting mattress cover and monitoring system |
| JP2008290182A (ja) * | 2007-05-24 | 2008-12-04 | Nikon Corp | 研磨装置 |
| TW200916261A (en) * | 2007-09-07 | 2009-04-16 | Cabot Microelectronics Corp | CMP sensor and control system |
| JP5248127B2 (ja) * | 2008-01-30 | 2013-07-31 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
| JP2010141155A (ja) * | 2008-12-12 | 2010-06-24 | Sony Corp | ウェーハ研磨装置及びウェーハ研磨方法 |
| WO2011139501A2 (en) * | 2010-04-30 | 2011-11-10 | Applied Materials, Inc. | Pad conditioning sweep torque modeling to achieve constant removal rate |
| US8758085B2 (en) * | 2010-10-21 | 2014-06-24 | Applied Materials, Inc. | Method for compensation of variability in chemical mechanical polishing consumables |
| CA2882329A1 (en) * | 2012-05-30 | 2013-12-05 | Medisens Wireless, Inc. | System and method for fluid sensing |
| US9863902B2 (en) * | 2014-03-07 | 2018-01-09 | Stmicroelectronics Asia Pacific Pte Ltd. | Microelectronic fluid detector |
| US11103970B2 (en) * | 2017-08-15 | 2021-08-31 | Taiwan Semiconductor Manufacturing Co, , Ltd. | Chemical-mechanical planarization system |
| US10857651B2 (en) * | 2017-11-20 | 2020-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus of chemical mechanical polishing and operating method thereof |
| KR102643278B1 (ko) * | 2018-03-07 | 2024-03-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 연마 유체 첨가제 농도 측정 장치 및 그에 관련된 방법들 |
| TWI838459B (zh) * | 2019-02-20 | 2024-04-11 | 美商應用材料股份有限公司 | 化學機械拋光裝置及化學機械拋光方法 |
| TWI754915B (zh) * | 2019-04-18 | 2022-02-11 | 美商應用材料股份有限公司 | 用於溫度控制的化學機械拋光溫度掃描設備 |
-
2019
- 2019-11-18 FI FI20195982A patent/FI130973B1/en active
-
2020
- 2020-11-16 US US17/776,794 patent/US20220395955A1/en active Pending
- 2020-11-16 CA CA3161142A patent/CA3161142A1/en active Pending
- 2020-11-16 AU AU2020385654A patent/AU2020385654A1/en active Pending
- 2020-11-16 CN CN202080079861.7A patent/CN114728397A/zh active Pending
- 2020-11-16 WO PCT/FI2020/050764 patent/WO2021099681A1/en unknown
- 2020-11-16 KR KR1020227020723A patent/KR20220134521A/ko active Search and Examination
- 2020-11-16 EP EP20815891.5A patent/EP4061576A1/en active Pending
- 2020-11-16 JP JP2022529095A patent/JP2023503280A/ja active Pending
- 2020-11-18 TW TW109140205A patent/TW202122213A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN114728397A (zh) | 2022-07-08 |
| FI20195982A1 (en) | 2021-05-19 |
| EP4061576A1 (en) | 2022-09-28 |
| FI130973B1 (en) | 2024-06-25 |
| US20220395955A1 (en) | 2022-12-15 |
| JP2023503280A (ja) | 2023-01-27 |
| AU2020385654A1 (en) | 2022-05-26 |
| KR20220134521A (ko) | 2022-10-05 |
| WO2021099681A1 (en) | 2021-05-27 |
| TW202122213A (zh) | 2021-06-16 |
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