CN114728397A - 用于抛光试样的装置和方法 - Google Patents

用于抛光试样的装置和方法 Download PDF

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Publication number
CN114728397A
CN114728397A CN202080079861.7A CN202080079861A CN114728397A CN 114728397 A CN114728397 A CN 114728397A CN 202080079861 A CN202080079861 A CN 202080079861A CN 114728397 A CN114728397 A CN 114728397A
Authority
CN
China
Prior art keywords
polishing
polishing pad
physical quantity
measuring
suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080079861.7A
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English (en)
Chinese (zh)
Inventor
阿托·皮尔托拉
塔图·皮尔托拉
泰穆·锡莫拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Turku
Original Assignee
University of Turku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Turku filed Critical University of Turku
Publication of CN114728397A publication Critical patent/CN114728397A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN202080079861.7A 2019-11-18 2020-11-16 用于抛光试样的装置和方法 Pending CN114728397A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20195982 2019-11-18
FI20195982A FI20195982A1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a part
PCT/FI2020/050764 WO2021099681A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen

Publications (1)

Publication Number Publication Date
CN114728397A true CN114728397A (zh) 2022-07-08

Family

ID=73598895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080079861.7A Pending CN114728397A (zh) 2019-11-18 2020-11-16 用于抛光试样的装置和方法

Country Status (10)

Country Link
US (1) US20220395955A1 (ja)
EP (1) EP4061576A1 (ja)
JP (1) JP2023503280A (ja)
KR (1) KR20220134521A (ja)
CN (1) CN114728397A (ja)
AU (1) AU2020385654A1 (ja)
CA (1) CA3161142A1 (ja)
FI (1) FI20195982A1 (ja)
TW (1) TW202122213A (ja)
WO (1) WO2021099681A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023242481A1 (en) * 2022-06-15 2023-12-21 Turun Yliopisto Device and method for moistening a polishing pad

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1056162A (zh) * 1990-05-01 1991-11-13 美国电话电报公司 原位监测法和化学/机械平面化端点检测设备
US5643406A (en) * 1995-06-13 1997-07-01 Kabushiki Kaisha Toshiba Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
EP1080841A2 (en) * 1999-09-02 2001-03-07 Mitsubishi Materials Corporation Carrier head, polishing apparatus using the carrier head, and method for sensing polished surface state
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US20020013124A1 (en) * 2000-06-30 2002-01-31 Manabu Tsujimura Polishing apparatus
US20030143927A1 (en) * 2001-08-24 2003-07-31 Joslyn Michael J. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US20050136800A1 (en) * 2003-10-31 2005-06-23 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
US20060135040A1 (en) * 2003-01-27 2006-06-22 Volker Herold Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
JP2008290182A (ja) * 2007-05-24 2008-12-04 Nikon Corp 研磨装置
TW200916261A (en) * 2007-09-07 2009-04-16 Cabot Microelectronics Corp CMP sensor and control system
TW200941570A (en) * 2008-01-30 2009-10-01 Ebara Corp Polishing method and polishing apparatus
JP2010141155A (ja) * 2008-12-12 2010-06-24 Sony Corp ウェーハ研磨装置及びウェーハ研磨方法
US20120100779A1 (en) * 2010-10-21 2012-04-26 Applied Materials, Inc. Apparatus and method for compensation of variability in chemical mechanical polishing consumables
US20130122783A1 (en) * 2010-04-30 2013-05-16 Applied Materials, Inc Pad conditioning force modeling to achieve constant removal rate
US20190152020A1 (en) * 2017-11-20 2019-05-23 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US20190275632A1 (en) * 2018-03-07 2019-09-12 Applied Materials, Inc. Polishing fluid additive concentration measurement apparatus and methods related thereto

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200262024A1 (en) * 2019-02-20 2020-08-20 Shou-sung Chang Apparatus and Method for CMP Temperature Control

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1056162A (zh) * 1990-05-01 1991-11-13 美国电话电报公司 原位监测法和化学/机械平面化端点检测设备
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
US5643406A (en) * 1995-06-13 1997-07-01 Kabushiki Kaisha Toshiba Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
EP1080841A2 (en) * 1999-09-02 2001-03-07 Mitsubishi Materials Corporation Carrier head, polishing apparatus using the carrier head, and method for sensing polished surface state
US20020013124A1 (en) * 2000-06-30 2002-01-31 Manabu Tsujimura Polishing apparatus
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US20030143927A1 (en) * 2001-08-24 2003-07-31 Joslyn Michael J. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US20060135040A1 (en) * 2003-01-27 2006-06-22 Volker Herold Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates
US20050136800A1 (en) * 2003-10-31 2005-06-23 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
JP2008290182A (ja) * 2007-05-24 2008-12-04 Nikon Corp 研磨装置
TW200916261A (en) * 2007-09-07 2009-04-16 Cabot Microelectronics Corp CMP sensor and control system
TW200941570A (en) * 2008-01-30 2009-10-01 Ebara Corp Polishing method and polishing apparatus
JP2010141155A (ja) * 2008-12-12 2010-06-24 Sony Corp ウェーハ研磨装置及びウェーハ研磨方法
US20130122783A1 (en) * 2010-04-30 2013-05-16 Applied Materials, Inc Pad conditioning force modeling to achieve constant removal rate
US20120100779A1 (en) * 2010-10-21 2012-04-26 Applied Materials, Inc. Apparatus and method for compensation of variability in chemical mechanical polishing consumables
US20190152020A1 (en) * 2017-11-20 2019-05-23 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US20190275632A1 (en) * 2018-03-07 2019-09-12 Applied Materials, Inc. Polishing fluid additive concentration measurement apparatus and methods related thereto

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
P.SEVERS;R.DINSMORE;S.MEURER;朱丽娜;康嘉杰;: "聚合物抛光垫修整和抛光的研究", 中国表面工程, no. 03, 15 June 2008 (2008-06-15), pages 5 - 10 *
袁文强;魏昕;谢小柱;胡伟;: "CMP抛光界面温度的在线检测", 组合机床与自动化加工技术, no. 08, pages 46 - 49 *

Also Published As

Publication number Publication date
WO2021099681A1 (en) 2021-05-27
KR20220134521A (ko) 2022-10-05
CA3161142A1 (en) 2021-05-27
FI20195982A1 (en) 2021-05-19
JP2023503280A (ja) 2023-01-27
TW202122213A (zh) 2021-06-16
AU2020385654A1 (en) 2022-05-26
US20220395955A1 (en) 2022-12-15
EP4061576A1 (en) 2022-09-28

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