FI130973B1 - Apparatus and method for polishing a piece - Google Patents

Apparatus and method for polishing a piece Download PDF

Info

Publication number
FI130973B1
FI130973B1 FI20195982A FI20195982A FI130973B1 FI 130973 B1 FI130973 B1 FI 130973B1 FI 20195982 A FI20195982 A FI 20195982A FI 20195982 A FI20195982 A FI 20195982A FI 130973 B1 FI130973 B1 FI 130973B1
Authority
FI
Finland
Prior art keywords
polishing
polishing pad
pad
measuring
suspension
Prior art date
Application number
FI20195982A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20195982A1 (en
Inventor
Arto Peltola
Tatu Peltola
Teemu Simola
Original Assignee
Turun Yliopisto
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FI20195982A priority Critical patent/FI130973B1/en
Application filed by Turun Yliopisto filed Critical Turun Yliopisto
Priority to CA3161142A priority patent/CA3161142A1/en
Priority to US17/776,794 priority patent/US20220395955A1/en
Priority to PCT/FI2020/050764 priority patent/WO2021099681A1/en
Priority to EP20815891.5A priority patent/EP4061576A1/en
Priority to KR1020227020723A priority patent/KR20220134521A/ko
Priority to JP2022529095A priority patent/JP2023503280A/ja
Priority to CN202080079861.7A priority patent/CN114728397B/zh
Priority to AU2020385654A priority patent/AU2020385654A1/en
Priority to TW109140205A priority patent/TW202122213A/zh
Publication of FI20195982A1 publication Critical patent/FI20195982A1/en
Application granted granted Critical
Publication of FI130973B1 publication Critical patent/FI130973B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FI20195982A 2019-11-18 2019-11-18 Apparatus and method for polishing a piece FI130973B1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20195982A FI130973B1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a piece
US17/776,794 US20220395955A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
PCT/FI2020/050764 WO2021099681A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
EP20815891.5A EP4061576A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
CA3161142A CA3161142A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
KR1020227020723A KR20220134521A (ko) 2019-11-18 2020-11-16 시편을 연마하기 위한 장치 및 방법
JP2022529095A JP2023503280A (ja) 2019-11-18 2020-11-16 試料を研磨する装置及び方法
CN202080079861.7A CN114728397B (zh) 2019-11-18 2020-11-16 用于抛光试样的装置和方法
AU2020385654A AU2020385654A1 (en) 2019-11-18 2020-11-16 Device and method for polishing a specimen
TW109140205A TW202122213A (zh) 2019-11-18 2020-11-18 用於拋光樣品的裝置及方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20195982A FI130973B1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a piece

Publications (2)

Publication Number Publication Date
FI20195982A1 FI20195982A1 (en) 2021-05-19
FI130973B1 true FI130973B1 (en) 2024-06-25

Family

ID=73598895

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20195982A FI130973B1 (en) 2019-11-18 2019-11-18 Apparatus and method for polishing a piece

Country Status (10)

Country Link
US (1) US20220395955A1 (ja)
EP (1) EP4061576A1 (ja)
JP (1) JP2023503280A (ja)
KR (1) KR20220134521A (ja)
CN (1) CN114728397B (ja)
AU (1) AU2020385654A1 (ja)
CA (1) CA3161142A1 (ja)
FI (1) FI130973B1 (ja)
TW (1) TW202122213A (ja)
WO (1) WO2021099681A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023242481A1 (en) * 2022-06-15 2023-12-21 Turun Yliopisto Device and method for moistening a polishing pad

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
US6007405A (en) * 1998-07-17 1999-12-28 Promos Technologies, Inc. Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping
EP1080841A3 (en) * 1999-09-02 2001-07-11 Mitsubishi Materials Corporation Carrier head, polishing apparatus using the carrier head, and method for sensing polished surface state
US6626736B2 (en) * 2000-06-30 2003-09-30 Ebara Corporation Polishing apparatus
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
DE10303407A1 (de) * 2003-01-27 2004-08-19 Friedrich-Schiller-Universität Jena Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten
KR101152747B1 (ko) * 2003-10-31 2012-06-18 어플라이드 머티어리얼스, 인코포레이티드 마찰 센서를 이용한 폴리싱 종료점 탐지 시스템 및 방법
WO2008115987A2 (en) * 2007-03-19 2008-09-25 Gt Angel, Llc Fluid-detecting mattress cover and monitoring system
JP2008290182A (ja) * 2007-05-24 2008-12-04 Nikon Corp 研磨装置
TW200916261A (en) * 2007-09-07 2009-04-16 Cabot Microelectronics Corp CMP sensor and control system
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
JP2010141155A (ja) * 2008-12-12 2010-06-24 Sony Corp ウェーハ研磨装置及びウェーハ研磨方法
JP2013526057A (ja) * 2010-04-30 2013-06-20 アプライド マテリアルズ インコーポレイテッド 一定除去速度を達成するためのパッド調整掃引トルクモデリング
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
EP2867659A4 (en) * 2012-05-30 2016-03-16 Medisens Wireless Inc SYSTEM AND METHOD FOR FLUID DETECTION
US9863902B2 (en) * 2014-03-07 2018-01-09 Stmicroelectronics Asia Pacific Pte Ltd. Microelectronic fluid detector
US11103970B2 (en) * 2017-08-15 2021-08-31 Taiwan Semiconductor Manufacturing Co, , Ltd. Chemical-mechanical planarization system
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
KR102643278B1 (ko) * 2018-03-07 2024-03-07 어플라이드 머티어리얼스, 인코포레이티드 연마 유체 첨가제 농도 측정 장치 및 그에 관련된 방법들
TWI838459B (zh) * 2019-02-20 2024-04-11 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TWI754915B (zh) * 2019-04-18 2022-02-11 美商應用材料股份有限公司 用於溫度控制的化學機械拋光溫度掃描設備

Also Published As

Publication number Publication date
FI20195982A1 (en) 2021-05-19
AU2020385654A1 (en) 2022-05-26
TW202122213A (zh) 2021-06-16
EP4061576A1 (en) 2022-09-28
JP2023503280A (ja) 2023-01-27
CN114728397B (zh) 2024-08-13
CN114728397A (zh) 2022-07-08
KR20220134521A (ko) 2022-10-05
US20220395955A1 (en) 2022-12-15
CA3161142A1 (en) 2021-05-27
WO2021099681A1 (en) 2021-05-27

Similar Documents

Publication Publication Date Title
FI130973B1 (en) Apparatus and method for polishing a piece
US6412330B1 (en) Abrasion tester
US20220390403A1 (en) Moisture sensor, polishing device and method for measuring the moisture in a polishing pad
US6476921B1 (en) In-situ method and apparatus for end point detection in chemical mechanical polishing
US4305278A (en) Abrasion testing
US20160121452A1 (en) Polishing apparatus and polishing method
US20230278164A1 (en) Polishing system with capacitive shear sensor
US20150283669A1 (en) Polishing apparatus
CN107000158A (zh) 用于化学机械抛光工具的部件
KR20160052221A (ko) 화학 기계적 연마 장치 및 이를 이용한 웨이퍼 연마층 두께 측정 방법
US4433571A (en) Non-contacting gage tip pad
KR20170022583A (ko) 화학 기계적 연마 장치
US6102776A (en) Apparatus and method for controlling polishing of integrated circuit substrates
TW202402462A (zh) 用於潤濕拋光墊的裝置和方法
US6932674B2 (en) Method of determining the endpoint of a planarization process
TWI856937B (zh) 化學機械拋光系統、拋光墊、監測基板的摩擦係數的方法及製造拋光墊的方法
Benisch et al. Impact analysis of temperature and humidity effects on polishing
WO2000031511A1 (en) Abrasion tester
KR102313560B1 (ko) 화학 기계적 연마 장치
CN117484379A (zh) 研磨装置
JPH0349859A (ja) 研削加工速度の検出方法およびテープ研削加工方法および磁気ディスクの製造方法ならびに製造装置
TW202430319A (zh) 化學機械拋光系統、拋光墊、監測基板的摩擦係數的方法及製造拋光墊的方法
CN118119480A (zh) 用于化学机械平坦化cmp工艺的原位监控的方法和装置
Coppeta et al. Using friction measurements to characterize chemical mechanical polishing lubrication regime
KR20190119527A (ko) 척 테이블 및 연삭 장치