CA2994559C - Enhanced liquid detection mechanisms for circuit cards - Google Patents
Enhanced liquid detection mechanisms for circuit cards Download PDFInfo
- Publication number
- CA2994559C CA2994559C CA2994559A CA2994559A CA2994559C CA 2994559 C CA2994559 C CA 2994559C CA 2994559 A CA2994559 A CA 2994559A CA 2994559 A CA2994559 A CA 2994559A CA 2994559 C CA2994559 C CA 2994559C
- Authority
- CA
- Canada
- Prior art keywords
- circuit card
- channel
- artwork
- detection
- detection artwork
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal fluid pressure, liquid level or liquid displacement, e.g. Buchholz relays
- H02H5/083—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal fluid pressure, liquid level or liquid displacement, e.g. Buchholz relays responsive to the entry or leakage of a liquid into an electrical appliance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M3/00—Investigating fluid-tightness of structures
- G01M3/02—Investigating fluid-tightness of structures by using fluid or vacuum
- G01M3/04—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point
- G01M3/16—Investigating fluid-tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/048—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance for determining moisture content of the material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Immunology (AREA)
- Electrochemistry (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Fluid Mechanics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Structure Of Printed Boards (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
- Examining Or Testing Airtightness (AREA)
- Storage Device Security (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562219561P | 2015-09-16 | 2015-09-16 | |
| US62/219,561 | 2015-09-16 | ||
| PCT/US2016/052307 WO2017049203A1 (en) | 2015-09-16 | 2016-09-16 | Enhanced liquid detection mechanisms for circuit cards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2994559A1 CA2994559A1 (en) | 2017-03-23 |
| CA2994559C true CA2994559C (en) | 2018-10-23 |
Family
ID=58239058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2994559A Active CA2994559C (en) | 2015-09-16 | 2016-09-16 | Enhanced liquid detection mechanisms for circuit cards |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10090669B2 (https=) |
| EP (1) | EP3350559B1 (https=) |
| JP (1) | JP6416437B2 (https=) |
| BR (1) | BR112018005093B8 (https=) |
| CA (1) | CA2994559C (https=) |
| WO (1) | WO2017049203A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016069018A1 (en) * | 2014-10-31 | 2016-05-06 | Hewlett Packard Enterprise Development Lp | Server device with capacitive circuit |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4297686A (en) | 1979-10-01 | 1981-10-27 | Tom M Dale | Water detection device |
| JPH10242902A (ja) * | 1997-02-27 | 1998-09-11 | Sanyo Electric Co Ltd | 屋外設置用筐体及び移動体通信用屋外基地局 |
| JPH11135955A (ja) * | 1997-10-28 | 1999-05-21 | Kyocera Corp | 筺体の浸水検知構造 |
| JP3678897B2 (ja) * | 1998-01-07 | 2005-08-03 | 株式会社オートネットワーク技術研究所 | 水濡れ検知機能を備えた電子制御ユニットおよび水濡れ検知センサ |
| JP3793359B2 (ja) * | 1998-11-30 | 2006-07-05 | 株式会社オートネットワーク技術研究所 | 水濡れセンサ及び水濡れセンサを備えた電子制御回路基板 |
| US6175310B1 (en) * | 1999-05-10 | 2001-01-16 | Richard J. Gott | Leak detection tape |
| JP2001356690A (ja) * | 2000-06-12 | 2001-12-26 | Sony Corp | 水濡れ判定ラベル及び電子機器 |
| US7217354B2 (en) * | 2003-08-29 | 2007-05-15 | Ut-Battelle, Llc | Method and apparatus for detection of chemical vapors |
| US7582537B2 (en) * | 2004-12-15 | 2009-09-01 | Lg Electronics Inc. | Zener diode and methods for fabricating and packaging same |
| JP2006208219A (ja) * | 2005-01-28 | 2006-08-10 | Victor Co Of Japan Ltd | 水滴浸入検出装置 |
| JP2008107985A (ja) * | 2006-10-24 | 2008-05-08 | Toshiba Corp | 電子機器および電気機器の制御方法 |
| US8482305B2 (en) * | 2010-08-11 | 2013-07-09 | Apple Inc. | Mechanisms for detecting exposure to water in an electronic device |
| FR2985153B1 (fr) * | 2011-12-23 | 2017-07-28 | Cie Ind Et Financiere D'ingenierie Ingenico | Dispositif de protection d'un circuit imprime electronique. |
| US9146207B2 (en) * | 2012-01-10 | 2015-09-29 | Hzo, Inc. | Methods, apparatuses and systems for sensing exposure of electronic devices to moisture |
| JP5693515B2 (ja) * | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | 内部耐水性被覆を備える電子デバイス |
| US10126263B2 (en) * | 2012-10-16 | 2018-11-13 | Koninklijke Philips N.V. | Wide dynamic range fluid sensor based on nanowire platform |
| EP2755023B1 (en) * | 2013-01-11 | 2017-06-21 | MEAS France | Capacitive sensor integrated onto semiconductor circuit |
| TW201437636A (zh) * | 2013-03-22 | 2014-10-01 | Ichia Tech Inc | 生物液體的測試片製作方法及其結構 |
-
2016
- 2016-09-16 BR BR112018005093A patent/BR112018005093B8/pt active IP Right Grant
- 2016-09-16 WO PCT/US2016/052307 patent/WO2017049203A1/en not_active Ceased
- 2016-09-16 EP EP16847476.5A patent/EP3350559B1/en active Active
- 2016-09-16 CA CA2994559A patent/CA2994559C/en active Active
- 2016-09-16 US US15/268,395 patent/US10090669B2/en active Active
- 2016-09-16 JP JP2018507607A patent/JP6416437B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017049203A1 (en) | 2017-03-23 |
| JP2018526637A (ja) | 2018-09-13 |
| EP3350559A4 (en) | 2019-07-03 |
| BR112018005093B1 (pt) | 2022-10-04 |
| BR112018005093A2 (https=) | 2018-10-02 |
| JP6416437B2 (ja) | 2018-10-31 |
| US10090669B2 (en) | 2018-10-02 |
| EP3350559A1 (en) | 2018-07-25 |
| CA2994559A1 (en) | 2017-03-23 |
| EP3350559B1 (en) | 2021-01-06 |
| US20170077694A1 (en) | 2017-03-16 |
| BR112018005093B8 (pt) | 2023-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20180206 |
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| MPN | Maintenance fee for patent paid |
Free format text: FEE DESCRIPTION TEXT: MF (PATENT, 9TH ANNIV.) - STANDARD Year of fee payment: 9 |
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| U00 | Fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U00-U101 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE REQUEST RECEIVED Effective date: 20250904 |
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| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-U102 (AS PROVIDED BY THE NATIONAL OFFICE); EVENT TEXT: MAINTENANCE FEE PAYMENT PAID IN FULL Effective date: 20250904 |