CA2958956C - Silver nanoparticle ink - Google Patents

Silver nanoparticle ink Download PDF

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Publication number
CA2958956C
CA2958956C CA2958956A CA2958956A CA2958956C CA 2958956 C CA2958956 C CA 2958956C CA 2958956 A CA2958956 A CA 2958956A CA 2958956 A CA2958956 A CA 2958956A CA 2958956 C CA2958956 C CA 2958956C
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CA
Canada
Prior art keywords
ink composition
hydrocarbon solvent
metal
percent
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2958956A
Other languages
English (en)
French (fr)
Other versions
CA2958956A1 (en
Inventor
Pedram Salami
Ping Liu
C. Geoffrey Allen
Naveen Chopra
Kurt I. Halfyard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of CA2958956A1 publication Critical patent/CA2958956A1/en
Application granted granted Critical
Publication of CA2958956C publication Critical patent/CA2958956C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0218Composite particles, i.e. first metal coated with second metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
CA2958956A 2016-03-04 2017-02-21 Silver nanoparticle ink Active CA2958956C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/061,618 US10563079B2 (en) 2016-03-04 2016-03-04 Silver nanoparticle ink
US15/061618 2016-03-04

Publications (2)

Publication Number Publication Date
CA2958956A1 CA2958956A1 (en) 2017-09-04
CA2958956C true CA2958956C (en) 2019-04-30

Family

ID=59650862

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2958956A Active CA2958956C (en) 2016-03-04 2017-02-21 Silver nanoparticle ink

Country Status (4)

Country Link
US (1) US10563079B2 (https=)
JP (1) JP6704364B2 (https=)
CA (1) CA2958956C (https=)
DE (1) DE102017203069B4 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10214655B2 (en) * 2016-04-13 2019-02-26 Xerox Corporation Metal nanoparticle ink dispersion
WO2018004092A1 (ko) * 2016-06-29 2018-01-04 한양대학교에리카산학협력단 나노 구조체 네트워크 및 그 제조 방법
US10633550B2 (en) 2017-08-31 2020-04-28 Xerox Corporation Molecular organic reactive inks for conductive silver printing
US10800938B2 (en) 2017-09-16 2020-10-13 Xerox Corporation Molecular organic reactive inks for conductive metal printing using photoinitiators
FR3072037B1 (fr) * 2017-10-05 2019-11-08 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede ameliore d'impression d'un substrat par jet d'aerosol, et systeme d'impression pour la mise en œuvre du procede
US10814659B2 (en) 2018-06-28 2020-10-27 Xerox Corporation Methods for printing conductive objects
US10752797B2 (en) 2018-07-24 2020-08-25 Xerox Corporation Conductive ink compositions and methods for preparation of stabilized metal-containing nanoparticles
US10821658B2 (en) * 2018-07-24 2020-11-03 Xerox Corporation Conductive three-dimensional articles
US20200031040A1 (en) 2018-07-24 2020-01-30 Xerox Corporation Printing process and system
US10982107B2 (en) 2018-07-24 2021-04-20 Xerox Corporation Metal nanoparticle ink composition
TW202122506A (zh) * 2019-11-30 2021-06-16 日商日鐵化學材料股份有限公司 鎳奈米粒子組成物及積層體的製造方法
WO2021229435A1 (en) * 2020-05-12 2021-11-18 Xtpl S.A. Metallic nanoparticle composition and method of dispensing metallic nanoparticle composition
CN114822992B (zh) * 2022-06-27 2022-09-13 江西理工大学南昌校区 一种电子线路用气溶胶喷涂工艺导电银浆的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996028140A1 (en) * 1995-03-14 1996-09-19 The Procter & Gamble Company Dispersed amorphous silica as oil in water stabilizer for skin cleansing liquid composition
US7270694B2 (en) 2004-10-05 2007-09-18 Xerox Corporation Stabilized silver nanoparticles and their use
DE102009007800A1 (de) 2009-02-06 2010-08-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aerosol-Drucker, dessen Verwendung und Verfahren zur Herstellung von Linienunterbrechungen bei kontinuierlichen Aerosol-Druckverfahren
US20110048171A1 (en) 2009-08-28 2011-03-03 Xerox Corporation Continuous Reaction Process For Preparing Metallic Nanoparticles
US20110059233A1 (en) 2009-09-04 2011-03-10 Xerox Corporation Method For Preparing Stabilized Metal Nanoparticles
JP5903887B2 (ja) * 2009-09-16 2016-04-13 日立化成株式会社 印刷法用インクの製造方法
US8765025B2 (en) 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
WO2012078820A2 (en) * 2010-12-07 2012-06-14 Sun Chemical Corporation Aerosol jet printable metal conductive inks, glass coated metal conductive inks and uv-curable dielectric inks and methods of preparing and printing the same
US20130029034A1 (en) 2011-07-28 2013-01-31 Xerox Corporation Process for producing silver nanoparticles
JP5982156B2 (ja) * 2012-04-05 2016-08-31 株式会社アルバック 金属微粒子分散液
TWI591134B (zh) * 2012-08-02 2017-07-11 Daicel Corp A method of manufacturing silver ink containing silver nanoparticles, and an ink containing silver nanoparticles
JP5849036B2 (ja) * 2012-09-27 2016-01-27 富士フイルム株式会社 導電ペースト、プリント配線基板
US9725614B2 (en) 2013-04-19 2017-08-08 Xerox Corporation Conductive ink compositions and methods for preparation of stabilized metal-containing nanoparticles
US20150240101A1 (en) * 2014-02-24 2015-08-27 Xerox Corporation High silver content nanosilver ink for gravure and flexographic printing applications
US20150240102A1 (en) * 2014-02-24 2015-08-27 Xerox Corporation Low viscosity and high loading silver nanoparticles inks for ultrasonic aerosol (ua)
US9460824B2 (en) 2014-04-23 2016-10-04 Xerox Corporation Stretchable conductive film based on silver nanoparticles

Also Published As

Publication number Publication date
JP6704364B2 (ja) 2020-06-03
DE102017203069A1 (de) 2017-09-07
US20170253757A1 (en) 2017-09-07
CA2958956A1 (en) 2017-09-04
DE102017203069B4 (de) 2022-06-23
US10563079B2 (en) 2020-02-18
JP2017155220A (ja) 2017-09-07

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