CA2925816A1 - Dissipateur thermique a performance amelioree - Google Patents

Dissipateur thermique a performance amelioree Download PDF

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Publication number
CA2925816A1
CA2925816A1 CA2925816A CA2925816A CA2925816A1 CA 2925816 A1 CA2925816 A1 CA 2925816A1 CA 2925816 A CA2925816 A CA 2925816A CA 2925816 A CA2925816 A CA 2925816A CA 2925816 A1 CA2925816 A1 CA 2925816A1
Authority
CA
Canada
Prior art keywords
substrate
metal
coating layer
thermal conductivity
metallic coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA2925816A
Other languages
English (en)
Inventor
Richard J. Lemak
Robert J. Moskaitis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Specialty Minerals Michigan Inc
Original Assignee
Specialty Minerals Michigan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Specialty Minerals Michigan Inc filed Critical Specialty Minerals Michigan Inc
Publication of CA2925816A1 publication Critical patent/CA2925816A1/fr
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CA2925816A 2013-09-30 2014-09-26 Dissipateur thermique a performance amelioree Pending CA2925816A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361884818P 2013-09-30 2013-09-30
US61/884,818 2013-09-30
PCT/US2014/057816 WO2015048516A1 (fr) 2013-09-30 2014-09-26 Dissipateur thermique à performance améliorée

Publications (1)

Publication Number Publication Date
CA2925816A1 true CA2925816A1 (fr) 2015-04-02

Family

ID=51662389

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2925816A Pending CA2925816A1 (fr) 2013-09-30 2014-09-26 Dissipateur thermique a performance amelioree

Country Status (9)

Country Link
US (1) US20150090434A1 (fr)
EP (1) EP3052676A1 (fr)
JP (1) JP2016535941A (fr)
KR (1) KR20160065141A (fr)
CN (1) CN105637124A (fr)
CA (1) CA2925816A1 (fr)
SG (1) SG11201601821VA (fr)
TW (1) TW201524755A (fr)
WO (1) WO2015048516A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9791704B2 (en) * 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US9674986B2 (en) * 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
US10584927B2 (en) * 2015-12-30 2020-03-10 General Electric Company Tube thermal coupling assembly
CN106328614A (zh) * 2016-09-28 2017-01-11 厦门恒坤新材料科技股份有限公司 一种由石墨片与金属层复合的导热片及其复合方法
GB201706783D0 (en) * 2017-04-28 2017-06-14 Cambridge Entpr Ltd Composite layers, methods for their manufacture and uses thereof
WO2019060503A2 (fr) * 2017-09-20 2019-03-28 eChemion, Inc. Fabrication de matériaux améliorés de plaque bipolaire métallique à base de graphite
GB2569306A (en) * 2017-12-12 2019-06-19 Rolls Royce Plc Thermal management device
JP7032348B2 (ja) 2019-03-26 2022-03-08 矢崎総業株式会社 金属めっき炭素素材及びその製造方法
JP2023513938A (ja) * 2020-02-18 2023-04-04 ラム リサーチ コーポレーション ヒートスプレッダを備えた高温基板支持体
CN111690963B (zh) * 2020-06-24 2022-10-04 上海理工大学 一种制备高导热性能的铜/石墨/铜叠层复合材料的方法
US11882673B1 (en) * 2020-11-25 2024-01-23 Advanced Cooling Technologies, Inc. Heat spreader having conduction enhancement with EMI shielding
TWI768966B (zh) * 2021-06-15 2022-06-21 許國誠 石墨複合層疊散熱結構及其製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3547692A (en) * 1968-10-17 1970-12-15 Engelhard Min & Chem Metal coating carbon substrates
DE10228323B4 (de) 2002-06-25 2005-06-09 Integran Technologies Inc., Toronto Verfahren zum kathodischen elektrolytischen Abscheiden und Mikrokomponenten, hergestellt durch ein solches Verfahren
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US20100326645A1 (en) * 2004-01-21 2010-12-30 Wei Fan Thermal pyrolytic graphite laminates with vias
US7320832B2 (en) 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
US7387578B2 (en) 2004-12-17 2008-06-17 Integran Technologies Inc. Strong, lightweight article containing a fine-grained metallic layer
US7808787B2 (en) 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
EP2196075B1 (fr) 2007-09-07 2021-06-23 Specialty Minerals (Michigan) Inc. Répartiteur de chaleur en couches et procédé pour sa fabrication
US8394507B2 (en) 2009-06-02 2013-03-12 Integran Technologies, Inc. Metal-clad polymer article
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
CN103890937B (zh) * 2011-10-20 2017-05-03 科卢斯博知识产权有限公司 块体无定形合金散热器

Also Published As

Publication number Publication date
WO2015048516A1 (fr) 2015-04-02
EP3052676A1 (fr) 2016-08-10
KR20160065141A (ko) 2016-06-08
SG11201601821VA (en) 2016-04-28
JP2016535941A (ja) 2016-11-17
US20150090434A1 (en) 2015-04-02
TW201524755A (zh) 2015-07-01
CN105637124A (zh) 2016-06-01

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