SG11201601821VA - Performance enhanced heat spreader - Google Patents

Performance enhanced heat spreader

Info

Publication number
SG11201601821VA
SG11201601821VA SG11201601821VA SG11201601821VA SG11201601821VA SG 11201601821V A SG11201601821V A SG 11201601821VA SG 11201601821V A SG11201601821V A SG 11201601821VA SG 11201601821V A SG11201601821V A SG 11201601821VA SG 11201601821V A SG11201601821V A SG 11201601821VA
Authority
SG
Singapore
Prior art keywords
heat spreader
enhanced heat
performance enhanced
performance
spreader
Prior art date
Application number
SG11201601821VA
Inventor
Richard J Lemak
Robert J Moskaitis
Original Assignee
Specialty Minerals Michigan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Specialty Minerals Michigan filed Critical Specialty Minerals Michigan
Publication of SG11201601821VA publication Critical patent/SG11201601821VA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SG11201601821VA 2013-09-30 2014-09-26 Performance enhanced heat spreader SG11201601821VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361884818P 2013-09-30 2013-09-30
PCT/US2014/057816 WO2015048516A1 (en) 2013-09-30 2014-09-26 Performance enhanced heat spreader

Publications (1)

Publication Number Publication Date
SG11201601821VA true SG11201601821VA (en) 2016-04-28

Family

ID=51662389

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601821VA SG11201601821VA (en) 2013-09-30 2014-09-26 Performance enhanced heat spreader

Country Status (9)

Country Link
US (1) US20150090434A1 (en)
EP (1) EP3052676A1 (en)
JP (1) JP2016535941A (en)
KR (1) KR20160065141A (en)
CN (1) CN105637124A (en)
CA (1) CA2925816A1 (en)
SG (1) SG11201601821VA (en)
TW (1) TW201524755A (en)
WO (1) WO2015048516A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US9791704B2 (en) * 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US9674986B2 (en) * 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
US10584927B2 (en) * 2015-12-30 2020-03-10 General Electric Company Tube thermal coupling assembly
CN106328614A (en) * 2016-09-28 2017-01-11 厦门恒坤新材料科技股份有限公司 Graphite sheet and metal layer composed thermally conductive sheet and its composing method
GB201706783D0 (en) * 2017-04-28 2017-06-14 Cambridge Entpr Ltd Composite layers, methods for their manufacture and uses thereof
US11824229B2 (en) * 2017-09-20 2023-11-21 Nexgen Materials, Llc Manufacturing enhanced graphite metallic bipolar plate materials
GB2569306A (en) * 2017-12-12 2019-06-19 Rolls Royce Plc Thermal management device
JP7032348B2 (en) 2019-03-26 2022-03-08 矢崎総業株式会社 Metal-plated carbon material and its manufacturing method
CN115103929A (en) * 2020-02-18 2022-09-23 朗姆研究公司 High temperature substrate support with heat sink
CN111690963B (en) * 2020-06-24 2022-10-04 上海理工大学 Method for preparing copper/graphite/copper laminated composite material with high thermal conductivity
US11882673B1 (en) * 2020-11-25 2024-01-23 Advanced Cooling Technologies, Inc. Heat spreader having conduction enhancement with EMI shielding
TWI768966B (en) * 2021-06-15 2022-06-21 許國誠 Graphite based composite laminated heat dissipation structure and manufacturing method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3547692A (en) * 1968-10-17 1970-12-15 Engelhard Min & Chem Metal coating carbon substrates
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
DE10228323B4 (en) 2002-06-25 2005-06-09 Integran Technologies Inc., Toronto Cathodic electrodeposition process and microcomponents made by such a process
US20100326645A1 (en) * 2004-01-21 2010-12-30 Wei Fan Thermal pyrolytic graphite laminates with vias
US7387578B2 (en) 2004-12-17 2008-06-17 Integran Technologies Inc. Strong, lightweight article containing a fine-grained metallic layer
US7320832B2 (en) 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
TW200933117A (en) * 2007-09-07 2009-08-01 Specialty Minerals Michigan Layered heat spreader and method of making the same
US7808787B2 (en) 2007-09-07 2010-10-05 Specialty Minerals (Michigan) Inc. Heat spreader and method of making the same
US8394507B2 (en) 2009-06-02 2013-03-12 Integran Technologies, Inc. Metal-clad polymer article
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
CN103890937B (en) * 2011-10-20 2017-05-03 科卢斯博知识产权有限公司 Bulk amorphous alloy heat sink

Also Published As

Publication number Publication date
CN105637124A (en) 2016-06-01
TW201524755A (en) 2015-07-01
EP3052676A1 (en) 2016-08-10
WO2015048516A1 (en) 2015-04-02
JP2016535941A (en) 2016-11-17
KR20160065141A (en) 2016-06-08
CA2925816A1 (en) 2015-04-02
US20150090434A1 (en) 2015-04-02

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