CA2702399C - Wireless devices including printed integrated circuitry and methods for manufacturing and using the same - Google Patents

Wireless devices including printed integrated circuitry and methods for manufacturing and using the same Download PDF

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Publication number
CA2702399C
CA2702399C CA2702399A CA2702399A CA2702399C CA 2702399 C CA2702399 C CA 2702399C CA 2702399 A CA2702399 A CA 2702399A CA 2702399 A CA2702399 A CA 2702399A CA 2702399 C CA2702399 C CA 2702399C
Authority
CA
Canada
Prior art keywords
substrate
antenna
layer
stock
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA2702399A
Other languages
English (en)
French (fr)
Other versions
CA2702399A1 (en
Inventor
Patrick Smith
Criswell Choi
Vikram Pavate
James Montague Cleeves
Vivek Subramanian
Richard Young
Vince Biviano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ensurge Micropower ASA
Original Assignee
Thin Film Electronics ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thin Film Electronics ASA filed Critical Thin Film Electronics ASA
Publication of CA2702399A1 publication Critical patent/CA2702399A1/en
Application granted granted Critical
Publication of CA2702399C publication Critical patent/CA2702399C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Details Of Aerials (AREA)
  • Combinations Of Printed Boards (AREA)
CA2702399A 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same Expired - Fee Related CA2702399C (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US97905707P 2007-10-10 2007-10-10
US60/979,057 2007-10-10
US98058107P 2007-10-17 2007-10-17
US60/980,581 2007-10-17
US12/249,707 US9004366B2 (en) 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
US12/249,707 2008-10-10
PCT/US2008/079653 WO2009049264A1 (en) 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same

Publications (2)

Publication Number Publication Date
CA2702399A1 CA2702399A1 (en) 2009-04-16
CA2702399C true CA2702399C (en) 2019-01-08

Family

ID=40533230

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2702399A Expired - Fee Related CA2702399C (en) 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same

Country Status (7)

Country Link
US (1) US9004366B2 (de)
EP (1) EP2201546B1 (de)
JP (2) JP2011516932A (de)
KR (1) KR101539125B1 (de)
CN (1) CN101896947B (de)
CA (1) CA2702399C (de)
WO (1) WO2009049264A1 (de)

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US9183973B2 (en) * 2009-05-28 2015-11-10 Thin Film Electronics Asa Diffusion barrier coated substrates and methods of making the same
CN102668241B (zh) * 2010-03-24 2015-01-28 株式会社村田制作所 Rfid系统
KR200461991Y1 (ko) * 2011-12-22 2012-08-20 주식회사 이그잭스 별도의 루프부 시트와 다이폴부 시트로 이루어진 유에이치에프 알에프아이디 태그
MX2014009365A (es) * 2012-02-02 2015-11-06 Neo Eco Systems Ltd Sistema y metodo para vender productos.
DE102012010560B4 (de) * 2012-05-29 2020-07-09 Mühlbauer Gmbh & Co. Kg Transponder, Verfahren zur Herstellung eines Transponders und Vorrichtungzum Herstellen des Transponders
CN103778460A (zh) * 2012-10-12 2014-05-07 上海中京电子标签集成技术有限公司 带有大接触板的无线射频识别集成电路
US9424507B2 (en) * 2014-04-01 2016-08-23 Nxp B.V. Dual interface IC card components and method for manufacturing the dual-interface IC card components
US9476635B2 (en) * 2014-06-25 2016-10-25 Haier Us Appliance Solutions, Inc. Radio frequency identification heat flux measurement systems for refrigerator vacuum insulation panels
US9519904B2 (en) * 2014-10-19 2016-12-13 Thin Film Electronics Asa NFC/RF mechanism with multiple valid states for detecting an open container, and methods of making and using the same
JP5907365B1 (ja) * 2014-11-07 2016-04-26 株式会社村田製作所 無線通信デバイスおよびその製造方法、ならびにｒｆｉｃ素子付きシールおよびその作製方法
EP3091483B1 (de) * 2014-11-07 2020-08-12 Murata Manufacturing Co., Ltd. Drahtloskommunikationsvorrichtung, verfahren zur herstellung davon und verfahren zur herstellung einer dichtung mit einem rfic-element
EP3281155A4 (de) * 2015-04-10 2019-02-20 Thin Film Electronics ASA Sensorbasierter nfc-/hf-mechanismus mit mehreren gültigen zuständen zur detektion eines offenen oder kompromittierten behälters
WO2016203882A1 (ja) * 2015-06-18 2016-12-22 株式会社村田製作所 キャリアテープ及びその製造方法、並びにｒｆｉｄタグの製造方法
US20180285706A1 (en) * 2015-10-06 2018-10-04 Thin Film Electronics Asa Electronic Device Having an Antenna, Metal Trace(s) and/or Inductor With a Printed Adhesion Promoter Thereon, and Methods of Making and Using the Same
WO2017069059A1 (ja) * 2015-10-21 2017-04-27 東レ株式会社 コンデンサおよびその製造方法ならびにそれを用いた無線通信装置
EP3387673A4 (de) * 2015-12-11 2019-07-24 Thin Film Electronics ASA Elektronische vorrichtung mit plattierter antenne und/oder spur und verfahren zur herstellung und verwendung davon
CN109415146A (zh) * 2016-04-18 2019-03-01 薄膜电子有限公司 具有智能标签的瓶子和用于瓶子的智能标签的制造及使用方法
CN105868823A (zh) * 2016-06-03 2016-08-17 广东楚天龙智能卡有限公司 一种生产良率高的双界面ic卡用线圈、采用该线圈的ic卡及其生产方法
JP6485597B2 (ja) 2016-07-15 2019-03-20 株式会社村田製作所 Ｒｆｉｄタグの製造装置及びｒｆｉｄタグの製造方法
US20180158788A1 (en) * 2016-12-01 2018-06-07 Avery Dennison Retail Information Services, Llc Mixed structure method of layout of different size elements to optimize the area usage on a wafer
US20180253632A1 (en) * 2017-03-03 2018-09-06 Thin Film Electronics Asa Connectable smart label or tag, and methods of making and connecting the same
CN107219028A (zh) * 2017-05-05 2017-09-29 华东师范大学 一种基于喷墨打印技术的柔性无线压力检测系统的制备方法
TWI806772B (zh) * 2017-08-17 2023-06-21 日商東京威力科創股份有限公司 工業製造設備中特性的即時感測裝置和方法
SE542007C2 (en) * 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
KR20200068718A (ko) * 2017-10-16 2020-06-15 셈테크 코포레이션 전송 태그
CN110600439A (zh) * 2018-06-12 2019-12-20 深圳市环基实业有限公司 一种rfid芯片及其制作方法
JP7357191B2 (ja) 2018-06-18 2023-10-06 東京エレクトロン株式会社 製造装置における特性の低干渉でのリアルタイム感知
US11742363B2 (en) 2018-10-22 2023-08-29 Ensurge Micropower Asa Barrier stacks for printed and/or thin film electronics, methods of manufacturing the same, and method of controlling a threshold voltage of a thin film transistor
WO2020254185A1 (en) * 2019-06-20 2020-12-24 Tetra Laval Holdings & Finance S.A. A method for a packaging material
US11281874B2 (en) * 2020-06-11 2022-03-22 The Board Of Trustees Of The Leland Stanford Junior University Flexible tag device and flexible sensing system comprising the same
DE102020209307A1 (de) * 2020-07-23 2022-01-27 Robert Bosch Gesellschaft mit beschränkter Haftung Radarsensor mit Hohlleiterstruktur

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Also Published As

Publication number Publication date
JP5881223B2 (ja) 2016-03-09
CN101896947A (zh) 2010-11-24
JP2011516932A (ja) 2011-05-26
US9004366B2 (en) 2015-04-14
US20090095818A1 (en) 2009-04-16
KR20100065186A (ko) 2010-06-15
EP2201546B1 (de) 2018-10-03
CN101896947B (zh) 2016-05-11
EP2201546A4 (de) 2016-06-22
JP2014160515A (ja) 2014-09-04
WO2009049264A1 (en) 2009-04-16
CA2702399A1 (en) 2009-04-16
EP2201546A1 (de) 2010-06-30
KR101539125B1 (ko) 2015-07-23

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Legal Events

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EEER Examination request

Effective date: 20131002

MKLA Lapsed

Effective date: 20211012